Fukazawa; Yuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukazawa; Yuji.The latest application filed is for "semiconductor device having multilayer wiring structure and method for manufacturing the same".

Company Profile

0.12.3

Fukazawa; Yuji - Yokohama JP
Fukazawa, Yuji - Yokohama-shi JP
Fukazawa, Yuji - Minato-ku JP
Fukazawa; Yuji - Tokyo JP
Fukazawa; Yuji - Shizuoka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer Grant 7,208,831 - Fukazawa April 24, 2	2007-04-24
Semiconductor device having multilayer wiring structure and method for manufacturing the same App 20040140568 - Fukazawa, Yuji	2004-07-22
Method for manufacturing semiconductor devices using thermal nitride films as gate insulating films Grant 6,759,314 - Moriyama , et al. July 6, 2	2004-07-06
Semiconductor device having multilayer wiring structure and method for manufacturing the same Grant 6,693,028 - Fukazawa February 17, 2	2004-02-17
Method for cleaning a semiconductor substrate Grant 6,423,146 - Fukazawa July 23, 2	2002-07-23
Semiconductor device having multilayer wiring structure and method for manufacturing the same App 20010055872 - Fukazawa, Yuji	2001-12-27
Manufacturing method of semiconductor devices App 20010034107 - Fukazawa, Yuji ; et al.	2001-10-25
Substrate cleaning/drying equipment and substrate cleaning/drying method Grant 6,152,153 - Takase , et al. November 28, 2	2000-11-28
White decorative part and process for producing the same Grant 5,985,469 - Kurakata , et al. November 16, 1	1999-11-16
Surface processing method and surface processing device for silicon substrates Grant 5,868,855 - Fukazawa , et al. February 9, 1	1999-02-09
Method of analyzing impurities in the surface of a semiconductor wafer Grant 5,527,707 - Fukazawa June 18, 1	1996-06-18
Wear-resistant reed for a high-speed loom Grant 5,511,587 - Miya , et al. April 30, 1	1996-04-30
Semiconductor wafer treating method Grant 5,470,393 - Fukazawa November 28, 1	1995-11-28
Semiconductor device having a multilayered wiring structure with dummy wiring Grant 5,442,236 - Fukazawa August 15, 1	1995-08-15
Fluorine containing aqueous composition having water repellent and oil repellent properties Grant 5,346,949 - Fukazawa September 13, 1	1994-09-13

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