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name:-0.026155948638916
name:-0.020910978317261
name:-0.0037579536437988
FUKASAWA; Masanaga Patent Filings

FUKASAWA; Masanaga

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUKASAWA; Masanaga.The latest application filed is for "etching method for oxide semiconductor film".

Company Profile
3.18.22
  • FUKASAWA; Masanaga - Kanagawa JP
  • FUKASAWA; MASANAGA - TOKYO JP
  • Fukasawa; Masanaga - Fishkill NY US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Etching Method For Oxide Semiconductor Film
App 20220122852 - HIRATA; Akiko ;   et al.
2022-04-21
Semiconductor Device
App 20210296384 - FUKASAWA; MASANAGA ;   et al.
2021-09-23
Etching Method Of Oxide Semiconductor Film, Oxide Semiconductor Workpiece, And Electronic Device
App 20210249273 - HIRATA; AKIKO ;   et al.
2021-08-12
Solid-state Imaging Device And Method For Manufacturing The Same
App 20210167106 - FUKASAWA; MASANAGA
2021-06-03
Etching method and etching processing apparatus
Grant 11,017,987 - Fukasawa May 25, 2
2021-05-25
Etching Method And Etching Processing Apparatus
App 20200373135 - FUKASAWA; MASANAGA
2020-11-26
Semiconductor device and solid-state imaging device
Grant 10,804,313 - Kagawa , et al. October 13, 2
2020-10-13
Semiconductor device and manufacturing method of the same
Grant 10,504,839 - Fukasawa Dec
2019-12-10
Semiconductor Device And Manufacturing Method Of The Same
App 20190080997 - Fukasawa; Masanaga
2019-03-14
Semiconductor device and manufacturing method of the same
Grant 10,157,837 - Fukasawa Dec
2018-12-18
Semiconductor Device And Solid-state Imaging Device
App 20180286911 - KAGAWA; Yoshihisa ;   et al.
2018-10-04
Semiconductor device and solid-state imaging device
Grant 10,026,769 - Kagawa , et al. July 17, 2
2018-07-17
Semiconductor Device And Manufacturing Method Of The Same
App 20180076126 - Fukasawa; Masanaga
2018-03-15
Semiconductor device and manufacturing method of the same
Grant 9,859,214 - Fukasawa January 2, 2
2018-01-02
Semiconductor Device And Manufacturing Method Of The Same
App 20170207163 - Fukasawa; Masanaga
2017-07-20
Semiconductor device and manufacturing method of the same
Grant 9,627,359 - Fukasawa April 18, 2
2017-04-18
Semiconductor Device And Manufacturing Method Of The Same
App 20160307877 - Fukasawa; Masanaga
2016-10-20
Semiconductor device and manufacturing method of the same
Grant 9,425,142 - Fukasawa August 23, 2
2016-08-23
Semiconductor Device And Solid-state Imaging Device
App 20160233264 - KAGAWA; Yoshihisa ;   et al.
2016-08-11
Semiconductor device and manufacturing method of the same
Grant 9,293,411 - Fukasawa March 22, 2
2016-03-22
Predicting ultraviolet ray damage with visible wavelength spectroscopy during a semiconductor manufacturing process
Grant 9,287,097 - Kuboi , et al. March 15, 2
2016-03-15
Semiconductor Device And Manufacturing Method Of The Same
App 20150357313 - Fukasawa; Masanaga
2015-12-10
Semiconductor Device And Manufacturing Method Of The Same
App 20150008591 - Fukasawa; Masanaga
2015-01-08
Semiconductor device and manufacturing method of the same
Grant 8,871,633 - Fukasawa October 28, 2
2014-10-28
Integrated circuit chip stack employing carbon nanotube interconnects
Grant 8,586,468 - Nogami , et al. November 19, 2
2013-11-19
Simulation Method, Simulation Program, And Semiconductor Manufacturing Apparatus
App 20130133832 - Kuboi; Nobuyuki ;   et al.
2013-05-30
Semiconductor Device And Manufacturing Method Of The Same
App 20130082401 - Fukasawa; Masanaga
2013-04-04
Method Of Manufacturing Semiconductor Device
App 20090047793 - Fukasawa; Masanaga
2009-02-19
Damascene interconnection having porous low k layer with a hard mask reduced in thickness
Grant 7,300,868 - Fukasawa , et al. November 27, 2
2007-11-27
Damascene interconnection having porous low k layer with a hard mask reduced in thickness
App 20070231993 - Fukasawa; Masanaga ;   et al.
2007-10-04
Damage recovery method for low K layer in a damascene interconnection
App 20070232047 - Fukasawa; Masanaga ;   et al.
2007-10-04
Single or dual damascene structure reducing or eliminating the formation of micro-trenches arising from lithographic misalignment
App 20070222076 - Fukasawa; Masanaga ;   et al.
2007-09-27
Integrated circuit chip stack employing carbon nanotube interconnects
App 20070045762 - Nogami; Takeshi ;   et al.
2007-03-01
Method of etching insulating film and method of forming interconnection layer
Grant 6,943,104 - Fukasawa , et al. September 13, 2
2005-09-13
Method of etching insulating film and method of forming interconnection layer
App 20040043597 - Fukasawa, Masanaga ;   et al.
2004-03-04
Method of etching insulating film and method of forming interconnection layer
Grant 6,638,848 - Fukasawa , et al. October 28, 2
2003-10-28
Low dielectric constant insulating films with laminated carbon-containing silicon oxide and organic layers
Grant 6,407,011 - Ikeda , et al. June 18, 2
2002-06-18

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