Fukasawa; Hideyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fukasawa; Hideyuki.The latest application filed is for "paste providing method, soldering method and apparatus and system therefor".
- Fukasawa; Hideyuki - Hadano JP
- Fukasawa, Hideyuki - Hadano-shi JP
| Patent | Date |
|---|---|
| Paste providing method, soldering method and apparatus and system therefor Grant 6,705,505 - Yoshikawa , et al. March 16, 2 | 2004-03-16 |
| Paste providing method, soldering method and apparatus and system therefor App 20030057264 - Yoshikawa, Fumio ; et al. | 2003-03-27 |
| Paste providing method, soldering method and apparatus and system therefor App 20010000906 - Yoshikawa, Fumio ; et al. | 2001-05-10 |
| Minute particle loading method and apparatus Grant 5,279,045 - Odashima , et al. January 18, 1 | 1994-01-18 |
| Method and apparatus for aligning solder balls Grant 4,871,110 - Fukasawa , et al. October 3, 1 | 1989-10-03 |
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