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Sharing system using valet key Grant 11,142,166 - Arakawa , et al. October 12, 2 | 2021-10-12 |
On-board Device App 20210173911 - OHASHI; Yosuke ;   et al. | 2021-06-10 |
Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same Grant 11,011,506 - Hosoda , et al. May 18, 2 | 2021-05-18 |
Sharing System App 20210114557 - ARAKAWA; Masahiro ;   et al. | 2021-04-22 |
Three-dimensional memory device containing channels with laterally pegged dielectric cores Grant 10,964,715 - Kakazu , et al. March 30, 2 | 2021-03-30 |
Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same Grant 10,957,680 - Yada , et al. March 23, 2 | 2021-03-23 |
On-vehicle Device App 20200369243 - OWAKI; Rijin ;   et al. | 2020-11-26 |
Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same Grant 10,833,100 - Sugiura , et al. November 10, 2 | 2020-11-10 |
Bonded Structure Including A Performance-optimized Support Chip And A Stress-optimized Three-dimensional Memory Chip And Method App 20200258876 - A1 | 2020-08-13 |
Three-dimensional Memory Device Containing Channels With Laterally Pegged Dielectric Cores And Methods For Making The Same App 20200251485 - Kind Code | 2020-08-06 |
Three-dimensional Memory Device Including A Deformation-resistant Edge Seal Structure And Methods For Making The Same App 20200235123 - SUGIURA; Kenji ;   et al. | 2020-07-23 |
Semiconductor Die Stacking Using Vertical Interconnection By Through-dielectric Via Structures And Methods For Making The Same App 20200227397 - YADA; Shinsuke ;   et al. | 2020-07-16 |
Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same Grant 10,665,607 - Sugiura , et al. | 2020-05-26 |
Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same Grant 10,665,580 - Hosoda , et al. | 2020-05-26 |
Three-dimensional memory device containing multi-threshold-voltage drain select gates and method of making the same Grant 10,347,647 - Hosoda , et al. July 9, 2 | 2019-07-09 |
Three-dimensional Memory Device Containing Multi-threshold-voltage Drain Select Gates And Method Of Making The Same App 20190198515 - HOSODA; Naohiro ;   et al. | 2019-06-27 |
Three-dimensional Memory Device Containing Support Pillars Underneath A Retro-stepped Dielectric Material And Method Of Making Thereof App 20180342531 - Susuki; Hiromasa ;   et al. | 2018-11-29 |
Three-dimensional memory device containing support pillars underneath a retro-stepped dielectric material and method of making thereof Grant 10,141,331 - Susuki , et al. Nov | 2018-11-27 |
Three dimensional NAND memory having improved connection between source line and in-hole channel material as well as reduced damage to in-hole layers Grant 9,711,532 - Miyamoto , et al. July 18, 2 | 2017-07-18 |
Three Dimensional Nand Memory Having Improved Connection Between Source Line And In-hole Channel Material As Well As Reduced Damage To In-hole Layers App 20170033121 - Miyamoto; Masato ;   et al. | 2017-02-02 |
Three dimensional NAND memory having improved connection between source line and in-hole channel material as well as reduced damage to in-hole layers Grant 9,530,781 - Miyamoto , et al. December 27, 2 | 2016-12-27 |
Three Dimensional Nand Memory Having Improved Connection Between Source Line And In-hole Channel Material As Well As Reduced Damage To In-hole Layers App 20160181264 - Miyamoto; Masato ;   et al. | 2016-06-23 |
Vertical Nand Device Containing Peripheral Devices On Epitaxial Semiconductor Pedestal App 20160111436 - DING; Hao ;   et al. | 2016-04-21 |
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