Fukai; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukai; Hiroyuki.The latest application filed is for "winding wire, coil, and transformer".

Company Profile

1.7.10

Fukai; Hiroyuki - Tokyo JP
Fukai; Hiroyuki - Ibaraki N/A JP
Fukai; Hiroyuki - Shimodate JP
Fukai, Hiroyuki - Shimodate-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Winding wire, coil, and transformer Grant 11,393,621 - Fukai , et al. July 19, 2	2022-07-19
Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board Grant 10,645,804 - Matsuura , et al.	2020-05-05
Winding Wire, Coil, And Transformer App 20190051451 - FUKAI; Hiroyuki ; et al.	2019-02-14
Adhesive Film, Multilayer Printed Wiring Board Using Adhesive Film, And Method For Manufacturing Multilayer Printed Wiring Board App 20140199533 - Matsuura; Masaharu ; et al.	2014-07-17
Circuit Board And Method For Manufacturing Circuit Board App 20140008105 - ABE; Kyutaro ; et al.	2014-01-09
Cooling Device With A Plurality Of Fin Pitches App 20130112373 - Fukai; Hiroyuki ; et al.	2013-05-09
Board And Method For Manufacturing Board App 20130033842 - HARA; Toshitaka ; et al.	2013-02-07
Substrate And Substrate Production Method App 20130033350 - HARA; Toshitaka ; et al.	2013-02-07
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same Grant 7,572,503 - Takanezawa , et al. August 11, 2	2009-08-11
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same Grant 6,979,712 - Takanezawa , et al. December 27, 2	2005-12-27
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same App 20050255270 - Takanezawa, Shin ; et al.	2005-11-17
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same App 20040161612 - Takanezawa, Shin ; et al.	2004-08-19
Photosensitive resin composition, and multilayer printed circuit board using the same Grant 6,190,834 - Narahara , et al. February 20, 2	2001-02-20
Multilayer circuit board and photosensitive resin composition used therefor Grant 5,914,216 - Amou , et al. June 22, 1	1999-06-22

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.