| Patent | Date |
|---|
Vehicle door latch apparatus
Grant 11,454,051 - Nagaoka , et al. September 27, 2 | 2022-09-27 |
Information Processing Apparatus, Information Processing Method, Article Manufacturing System, And Article Manufacturing Method
App 20220246456 - Fujiwara; Hiroaki | 2022-08-04 |
Prepreg, metal-clad laminate, and wiring board
Grant 11,401,393 - Kitai , et al. August 2, 2 | 2022-08-02 |
Relief Valve
App 20220178456 - FUJIWARA; Hiroaki ; et al. | 2022-06-09 |
Metal-clad laminate, printed wiring board and metal foil with resin
Grant 11,351,755 - Kitai , et al. June 7, 2 | 2022-06-07 |
Solenoid flow control valve
Grant 11,293,560 - Fujiwara , et al. April 5, 2 | 2022-04-05 |
Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate
Grant 11,242,425 - Sato , et al. February 8, 2 | 2022-02-08 |
Resin Composition, Prepreg, Resin-added Film, Resin-added Metal Foil, Metal-clad Layered Plate, And Wiring Plate
App 20210246251 - SATO; Mikio ; et al. | 2021-08-12 |
Valve Device
App 20210239139 - FUJIWARA; Hiroaki ; et al. | 2021-08-05 |
Solenoid Flow Control Valve
App 20210215267 - FUJIWARA; Hiroaki ; et al. | 2021-07-15 |
Swing-back preventing apparatus
Grant 10,982,692 - Matsuo , et al. April 20, 2 | 2021-04-20 |
Metal-clad Laminate, Metal Foil With Resin, And Wiring Board
App 20210084757 - TSUDA; Kosuke ; et al. | 2021-03-18 |
Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board
Grant 10,897,818 - Kitai , et al. January 19, 2 | 2021-01-19 |
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
Grant 10,870,721 - Kitai , et al. December 22, 2 | 2020-12-22 |
Swing-back Preventing Apparatus
App 20200277754 - MATSUO; Masahiro ; et al. | 2020-09-03 |
Prepreg, Metal-clad Laminate, And Wiring Board
App 20200270411 - KITAI; Yuki ; et al. | 2020-08-27 |
Prepreg, Metal-clad Laminate, And Wiring Board
App 20200247972 - Kind Code | 2020-08-06 |
Prepreg, And Metal-clad Laminated Board And Wiring Substrate Obtained Using Same
App 20200223998 - HOSHINO; Yasunori ; et al. | 2020-07-16 |
Vehicle Door Latch Apparatus
App 20200224465 - Nagaoka; Tomoharu ; et al. | 2020-07-16 |
Vehicle Door Latch Apparatus
App 20200224461 - Nagaoka; Tomoharu ; et al. | 2020-07-16 |
Substituted purine derivative
Grant 10,703,755 - Tojo , et al. | 2020-07-07 |
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
Grant 10,590,223 - Kitai , et al. | 2020-03-17 |
Resin Composition, Prepreg, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board
App 20200001573 - SAITO; Hirosuke ; et al. | 2020-01-02 |
Pneumatic tire
Grant 10,518,589 - Kobayashi , et al. Dec | 2019-12-31 |
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate And Printed Wiring Board
App 20190300639 - KITAI; Yuki ; et al. | 2019-10-03 |
Metal-clad Laminate, Printed Wiring Board And Metal Foil With Resin
App 20190217576 - KITAI; YUKI ; et al. | 2019-07-18 |
Substituted Purine Derivative
App 20190169191 - TOJO; Shingo ; et al. | 2019-06-06 |
Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board
Grant 10,240,015 - Kitai , et al. | 2019-03-26 |
Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
Grant 10,047,213 - Fujiwara , et al. August 14, 2 | 2018-08-14 |
Curable Composition, Prepreg, Metal Foil With Composition, Metal-clad Laminate And Wiring Board
App 20180170005 - SAITO; HIROSUKE ; et al. | 2018-06-21 |
Bicyclic Imidazolo Derivative
App 20180044343 - FUJII; Yuki ; et al. | 2018-02-15 |
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
Grant 9,795,033 - Yoshioka , et al. October 17, 2 | 2017-10-17 |
Curable Composition, Prepreg, Metal Foil With Resin, Metal-clad Laminate And Printed Wiring Board
App 20170226302 - SAITO; HIROSUKE ; et al. | 2017-08-10 |
Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board
Grant 9,708,468 - Kitai , et al. July 18, 2 | 2017-07-18 |
Method Of Curing Thermosetting Resin Composition, Thermosetting Resin Composition, And Prepreg, Metal-clad Laminate, Resin Sheet, Printed-wiring Board, And Sealing Material In Which Thermosetting Resin Composition Is Used
App 20170190875 - FUJIWARA; Hiroaki ; et al. | 2017-07-06 |
Metal-clad Laminate, Method For Producing Same, Metal Foil With Resin, And Printed Wiring Board
App 20170164469 - KITAI; YUKI ; et al. | 2017-06-08 |
Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
Grant 9,637,598 - Fujiwara , et al. May 2, 2 | 2017-05-02 |
Pneumatic Tire
App 20170113492 - KOBAYASHI; Fumitaka ; et al. | 2017-04-27 |
Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board
Grant 9,567,481 - Saito , et al. February 14, 2 | 2017-02-14 |
Thermosetting Resin Composition, And Resin Varnish, Metal Foil With Resin, Resin Film, Metal-clad Laminate, And Printed Wiring Board Using The Same
App 20170029619 - LIN; LIN ; et al. | 2017-02-02 |
Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
Grant 9,528,026 - Sagara , et al. December 27, 2 | 2016-12-27 |
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate And Printed Wiring Board
App 20160145370 - KITAI; Yuki ; et al. | 2016-05-26 |
Circuit board, and semiconductor device having component mounted on circuit board
Grant 9,351,402 - Yoshioka , et al. May 24, 2 | 2016-05-24 |
Method of producing multilayer circuit board
Grant 9,332,650 - Yoshioka , et al. May 3, 2 | 2016-05-03 |
Circuit board
Grant 9,332,642 - Yoshioka , et al. May 3, 2 | 2016-05-03 |
Tricyclic Guanidine Derivative
App 20160083400 - Burdi; Douglas F. ; et al. | 2016-03-24 |
Thermosetting Resin Composition, Prepreg, Metal Clad Laminate Plate, And Printed Wiring Board
App 20160060429 - KITAI; YUKI ; et al. | 2016-03-03 |
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate And Printed Wiring Board
App 20150376444 - SAITO; Hirosuke ; et al. | 2015-12-31 |
Method Of Curing Thermosetting Resin Composition, Thermosetting Resin Composition, And Prepreg, Metal-clad Laminate, Resin Sheet, Printed-wiring Board, And Sealing Material In Which Thermosetting Resin Composition Is Used
App 20150376338 - FUJIWARA; Hiroaki ; et al. | 2015-12-31 |
Epoxy Resin Composition, Prepreg Using The Epoxy Resin Composition, Metal-clad Laminate, And Printed Wiring Board
App 20150359093 - FUJIWARA; Hiroaki ; et al. | 2015-12-10 |
Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
Grant 9,206,308 - Iwami , et al. December 8, 2 | 2015-12-08 |
Electronic components assembly
Grant 9,204,530 - Takashita , et al. December 1, 2 | 2015-12-01 |
Resin composition and method for producing circuit board
Grant 9,175,151 - Konno , et al. November 3, 2 | 2015-11-03 |
Wiring Method, Structure Having Wiring Provided On Surface, Semiconductor Device, Wiring Board, Memory Card, Electric Device, Module, And Multilayer Circuit Board
App 20150271924 - YOSHIOKA; Shingo ; et al. | 2015-09-24 |
Modified Polyphenylene Ether, Method For Preparing Same, Polyphenylene Ether Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate And Printed Circuit Board
App 20150218326 - Kitai; Yuki ; et al. | 2015-08-06 |
Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board
Grant 9,082,635 - Yoshioka , et al. July 14, 2 | 2015-07-14 |
Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
Grant 9,082,825 - Takashita , et al. July 14, 2 | 2015-07-14 |
Three-dimensional structure for wiring formation
Grant 9,082,438 - Yoshioka , et al. July 14, 2 | 2015-07-14 |
Three-dimensional structure in which wiring is provided on its surface
Grant 9,070,393 - Yoshioka , et al. June 30, 2 | 2015-06-30 |
Circuit Board, And Semiconductor Device Having Component Mounted On Circuit Board
App 20150156873 - YOSHIOKA; Shingo ; et al. | 2015-06-04 |
Circuit Board
App 20150034366 - YOSHIOKA; Shingo ; et al. | 2015-02-05 |
8-azabicyclo[3.2.1]octane-8-carboxamide derivative
Grant 8,933,229 - Horiuchi , et al. January 13, 2 | 2015-01-13 |
Resin Composition And Method For Producing Circuit Board
App 20150008379 - KONNO; Yuko ; et al. | 2015-01-08 |
Circuit board, and semiconductor device having component mounted on circuit board
Grant 8,929,092 - Yoshioka , et al. January 6, 2 | 2015-01-06 |
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
Grant 8,901,728 - Yoshioka , et al. December 2, 2 | 2014-12-02 |
Cyclic amide derivative
Grant 8,895,552 - Horiuchi , et al. November 25, 2 | 2014-11-25 |
Resin composition and method for producing circuit board
Grant 8,877,843 - Konno , et al. November 4, 2 | 2014-11-04 |
Manufacturing Method For Semiconductor Package, Semiconductor Package, And Semiconductor Device
App 20140191406 - Takashita; Hiromitsu ; et al. | 2014-07-10 |
Three-dimensional Structure In Which Wiring Is Provided On Its Surface
App 20140183751 - YOSHIOKA; Shingo ; et al. | 2014-07-03 |
Three-dimensional Structure For Wiring Formation
App 20140182887 - YOSHIOKA; Shingo ; et al. | 2014-07-03 |
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate, And Printed Wiring Board
App 20140182903 - Sagara; Takashi ; et al. | 2014-07-03 |
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
Grant 8,759,148 - Yoshioka , et al. June 24, 2 | 2014-06-24 |
Method of producing circuit board, and circuit board obtained using the manufacturing method
Grant 8,698,003 - Yoshioka , et al. April 15, 2 | 2014-04-15 |
Method Of Mounting Semiconductor Chips, Semiconductor Device Obtained Using The Method, Method Of Connecting Semiconductor Chips, Three-dimensional Structure In Which Wiring Is Provided On Its Surface, And Method Of Producing The Same
App 20140097004 - YOSHIOKA; Shingo ; et al. | 2014-04-10 |
Method Of Mounting Semiconductor Chips, Semiconductor Device Obtained Using The Method, Method Of Connecting Semiconductor Chips, Three-dimensional Structure In Which Wiring Is Provided On Its Surface, And Method Of Producing The Same
App 20140090876 - YOSHIOKA; Shingo ; et al. | 2014-04-03 |
Resin Composition And Method For Producing Circuit Board
App 20130337188 - Konno; Yuko ; et al. | 2013-12-19 |
Electronic Components Assembly
App 20130265729 - TAKASHITA; Hiromitsu ; et al. | 2013-10-10 |
Electrophotographic photoreceptor, electrophotographic photoreceptor cartridge, and image-forming apparatus
Grant 8,530,123 - Fujiwara , et al. September 10, 2 | 2013-09-10 |
Cyclic Amide Derivative
App 20130217692 - Horiuchi; Yoshihiro ; et al. | 2013-08-22 |
Information processing method and information processing apparatus for transmitting data generated by device manufacturing apparatus
Grant 8,516,145 - Itai , et al. August 20, 2 | 2013-08-20 |
Method Of Mounting Semiconductor Chips, Semiconductor Device Obtained Using The Method, Method Of Connecting Semiconductor Chips, Three-dimensional Structure In Which Wiring Is Provided On Its Surface, And Method Of Producing The Same
App 20130200522 - YOSHIOKA; Shingo ; et al. | 2013-08-08 |
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
Grant 8,482,137 - Yoshioka , et al. July 9, 2 | 2013-07-09 |
Epoxy Resin Composition For Prepreg, Prepreg, And Multilayer Printed Circuit Board
App 20130096233 - Iwami; Tomoaki ; et al. | 2013-04-18 |
Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board
Grant 8,409,704 - Fukuhara , et al. April 2, 2 | 2013-04-02 |
Wiring Method, Structure Having Wiring Provided On Surface, Semiconductor Device, Wiring Board, Memory Card, Electric Device, Module And Multilayer Circuit Board
App 20130056247 - Yoshioka; Shingo ; et al. | 2013-03-07 |
Method Of Producing Circuit Board By Additive Method, And Circuit Board And Multilayer Circuit Board Obtained By The Method
App 20120292083 - YOSHIOKA; Shingo ; et al. | 2012-11-22 |
Method Of Producing Circuit Board By Additive Method, And Circuit Board And Multilayer Circuit Board Obtained By The Method
App 20120285736 - YOSHIOKA; Shingo ; et al. | 2012-11-15 |
Method of producing circuit board
Grant 8,272,126 - Yoshioka , et al. September 25, 2 | 2012-09-25 |
8-azabicyclo[3.2.1]octane-8-carboxamide Derivative
App 20120225876 - Horiuchi; Yoshihiro ; et al. | 2012-09-06 |
Circuit Board, And Semiconductor Device Having Component Mounted On Circuit Board
App 20120206891 - Yoshioka; Shingo ; et al. | 2012-08-16 |
Method of producing a circuit board
Grant 8,240,036 - Yoshioka , et al. August 14, 2 | 2012-08-14 |
Information processing system, information processing method, and memory medium
Grant 8,065,270 - Itai , et al. November 22, 2 | 2011-11-22 |
Method Of Mounting Semiconductor Chips, Semiconductor Device Obtained Using The Method,method Of Connecting Semiconductor Chips, Three-dimensional Structure In Which Wiring Is Provided On Its Surface, And Method Of Producing The Same
App 20110281138 - Yoshioka; Shingo ; et al. | 2011-11-17 |
Information processing system, information processing method, and computer-readable storage medium
Grant 8,060,472 - Itai , et al. November 15, 2 | 2011-11-15 |
Method Of Producing Circuit Board, And Circuit Board Obtained Using The Manufacturing Method
App 20110247860 - Yoshioka; Shingo ; et al. | 2011-10-13 |
Mounting process simulation system and method thereof
Grant 7,904,281 - Okamoto , et al. March 8, 2 | 2011-03-08 |
Information Processing Method And Information Processing Apparatus For Transmitting Data Generated By Device Manufacturing Apparatus
App 20110029685 - Itai; Daisuke ; et al. | 2011-02-03 |
Method for analyzing component mounting board
Grant 7,873,932 - Kakino , et al. January 18, 2 | 2011-01-18 |
Electrophotographic Photoreceptor, Electrophotographic Photoreceptor Cartridge, And Image-forming Apparatus
App 20100330474 - Fujiwara; Kumiko ; et al. | 2010-12-30 |
Poly (phenylene ether) resin composition, prepreg, and laminated sheet
Grant 7,838,576 - Inoue , et al. November 23, 2 | 2010-11-23 |
Information Processing Method, Exposure Processing System Using Same, Device Manufacturing Method, And Information Processing Apparatus
App 20100248165 - Itai; Daisuke ; et al. | 2010-09-30 |
Information Processing System, Information Processing Method, And Computer-readable Storage Medium
App 20100235384 - Itai; Daisuke ; et al. | 2010-09-16 |
Information Processing System, Information Processing Method, And Memory Medium
App 20100228757 - Itai; Daisuke ; et al. | 2010-09-09 |
Epoxy Resin Composition, Prepreg Using The Epoxy Resin Composition, Metal-clad Laminate, And Printed Wiring Board
App 20100218982 - Fujiwara; Hiroaki ; et al. | 2010-09-02 |
Prepreg, Printed Wiring Board, Multilayer Circuit Board, And Process For Manufacturing Printed Wiring Board
App 20100044087 - Fukuhara; Yasuo ; et al. | 2010-02-25 |
Method Of Producing Circuit Board By Additive Method, And Circuit Board And Multilayer Circuit Board Obtained By The Method
App 20090272564 - YOSHIOKA; Shingo ; et al. | 2009-11-05 |
Method Of Producing Circuit Board By Additive Method, And Circuit Board And Multilayer Circuit Board Obtained By The Method
App 20090272562 - YOSHIOKA; Shingo ; et al. | 2009-11-05 |
Poly (phenylene Ether) Resin Composition, Prepreg, And Laminated Sheet
App 20080254257 - Inoue; Hiroharu ; et al. | 2008-10-16 |
Poly (phenylene ether) resin composition, prepreg, and laminated sheet
Grant 7,413,791 - Inoue , et al. August 19, 2 | 2008-08-19 |
Method for Analyzing Component Mounting Board
App 20080168413 - Kakino; Manabu ; et al. | 2008-07-10 |
Apparatus and method for setting teaching data, teaching data providing system over network
Grant 7,151,850 - Suzuki , et al. December 19, 2 | 2006-12-19 |
Portable terminal and message notifying system using the same
App 20060129352 - Fujiwara; Hiroaki ; et al. | 2006-06-15 |
Portable terminal and message notifying system using the same
Grant 7,035,774 - Fujiwara , et al. April 25, 2 | 2006-04-25 |
Curved belt support apparatus
Grant 6,962,252 - Fujiwara , et al. November 8, 2 | 2005-11-08 |
Mounting process simulation system and method thereof
App 20050038641 - Okamoto, Masaki ; et al. | 2005-02-17 |
Mounting process simulation program and method for the same and system implementing the same
App 20040186702 - Okamoto, Masaki ; et al. | 2004-09-23 |
Poly (phenylene ether) resin composition, prepreg, and laminated sheet
App 20040146692 - Inoue, Hiroharu ; et al. | 2004-07-29 |
Curved belt support apparatus
App 20040035685 - Fujiwara, Hiroaki ; et al. | 2004-02-26 |
Method and apparatus of checking mount quality of circuit board
Grant 6,665,854 - Fujiwara , et al. December 16, 2 | 2003-12-16 |
Portable terminal and message notifying system using the same
App 20030139176 - Fujiwara, Hiroaki ; et al. | 2003-07-24 |
Apparatus and method for setting teaching data, teaching data providing system over network
App 20030082503 - Suzuki, Noriyuki ; et al. | 2003-05-01 |
Method and apparatus of checking mount quality of circuit board
App 20020069395 - Fujiwara, Hiroaki ; et al. | 2002-06-06 |
Component-mounted circuit board production system
Grant 5,607,097 - Sato , et al. March 4, 1 | 1997-03-04 |
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