FUJIWARA; Hidemichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUJIWARA; Hidemichi.The latest application filed is for "bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body".

Company Profile

3.13.22

FUJIWARA; Hidemichi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding Film, Tape For Wafer Processing, Method For Producing Bonded Body, And Bonded Body And Pasted Body App 20220139864 - NITTA; Norzafriza ; et al.	2022-05-05
Joining Film, Tape For Wafer Processing, Method For Producing Joined Body, And Joined Body App 20210348038 - NITTA; Norzafriza ; et al.	2021-11-11
Metal Particle-containing Composition And Electrically Conductive Adhesive Film App 20210317343 - NITTA; Norzafriza ; et al.	2021-10-14
Joining Film, Tape For Wafer Processing, Method For Producing Joined Body, And Joined Body App 20210189197 - NITTA; Norzafriza ; et al.	2021-06-24
Joining Film, Tape For Wafer Processing, Method For Producing Joined Body, And Joined Body App 20210189198 - NITTA; Norzafriza ; et al.	2021-06-24
Metal fine particle-containing composition Grant 10,818,405 - Ishii , et al. October 27, 2	2020-10-27
Copper alloy wire rod Grant 10,626,483 - Sekiya , et al.	2020-04-21
Joining Film And Tape For Wafer Processing App 20190273062 - FUJIWARA; Hidemichi ; et al.	2019-09-05
Joining Film, Tape For Wafer Processing, Method For Producing Joined Body, And Joined Body App 20190264072 - NITTA; Norzafriza ; et al.	2019-08-29
Metal Fine Particle-containing Composition App 20190019594 - ISHII; Tomohiro ; et al.	2019-01-17
Conductive connecting member and manufacturing method of same Grant 10,177,079 - Nishikubo , et al. J	2019-01-08
Copper Alloy Wire Rod App 20180371580 - Sekiya; Shigeki ; et al.	2018-12-27
Electrically conductive paste, and electrically conducive connection member produced using the paste Grant 10,046,418 - Masumori , et al. August 14, 2	2018-08-14
Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method Grant 9,221,130 - Asada , et al. December 29, 2	2015-12-29
Method For Producing Fine Particle Dispersion App 20140127409 - HARADA; Takuya ; et al.	2014-05-08
Material For Thermal Bonding, Coating Material For Thermal Bonding, Coating, And Electronic Component Bonding Method App 20130266796 - Asada; Toshiaki ; et al.	2013-10-10
Heat transfer film, semiconductor device, and electronic apparatus Grant 8,475,923 - Katayama , et al. July 2, 2	2013-07-02
Conductive Connecting Member And Manufacturing Method Of Same App 20130001775 - Nishikubo; Hideo ; et al.	2013-01-03
Electrically Conductive Paste, And Electrically Conductive Connection Member Produced Using The Paste App 20130001774 - Masumori; Shunji ; et al.	2013-01-03
Fine particle dispersion and method for producing fine particle dispersion Grant 8,337,726 - Harada , et al. December 25, 2	2012-12-25
Method for producing fine particle dispersion and fine particle dispersion Grant 8,277,693 - Harada , et al. October 2, 2	2012-10-02
Fine Particle Dispersion And Method For Producing Fine Particle Dispersion App 20100113647 - Harada; Takuya ; et al.	2010-05-06
Method For Producing Fine Particle Dispersion And Fine Particle Dispersion App 20090321689 - Harada; Takuya ; et al.	2009-12-31
Heat transfer film, semiconductor device, and electronic apparatus App 20090190312 - Katayama; Masako ; et al.	2009-07-30
Electromagnetic Wave Shielding Wiring Circuit Forming Method And Electromagnetic Wave Shielding Sheet App 20090151998 - Fujiwara; Hidemichi ; et al.	2009-06-18
Power cable for mobile and terminal for the power cable Grant 6,867,372 - Fujiwara March 15, 2	2005-03-15
Power cable for mobile and terminal for the power cable App 20030111256 - Fujiwara, Hidemichi	2003-06-19
Aluminum alloy material for use in a terminal, and terminal using the material App 20030059336 - Aida, Yukikatsu ; et al.	2003-03-27
Electric distribution assembly App 20020162683 - Fujiwara, Hidemichi	2002-11-07

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