Fujitsu; Takao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fujitsu; Takao.The latest application filed is for "semiconductor integrated circuit device assembly".
- Fujitsu; Takao - Kanagawa-ken JP
- Fujitsu; Takao - Yokohama JP
- Fujitsu; Takao - Kanagawa JP
- Fujitsu; Takao - Kitakami JP
| Patent | Date |
|---|---|
| Semiconductor integrated circuit device assembly Grant 5,767,572 - Fujitsu June 16, 1 | 1998-06-16 |
| Thin semiconductor integrated circuit device assembly Grant 5,672,908 - Fujitsu September 30, 1 | 1997-09-30 |
| Semiconductor device having tape automated bonding leads Grant 5,654,584 - Fujitsu August 5, 1 | 1997-08-05 |
| Thin semiconductor integrated circuit device assembly Grant 5,448,106 - Fujitsu September 5, 1 | 1995-09-05 |
| Semiconductor device Grant 4,953,173 - Fujitsu August 28, 1 | 1990-08-28 |
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