loadpatents
name:-0.01121187210083
name:-0.0094239711761475
name:-0.0077378749847412
Fujita; Yoshito Patent Filings

Fujita; Yoshito

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujita; Yoshito.The latest application filed is for "method for manufacturing cured film, method for manufacturing electronic component, and electronic component".

Company Profile
5.7.9
  • Fujita; Yoshito - Osaka JP
  • Fujita; Yoshito - Mishima-gun Osaka
  • Fujita; Yoshito - Nagoya JP
  • FUJITA; Yoshito - Nagoya-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Manufacturing Cured Film, Method For Manufacturing Electronic Component, And Electronic Component
App 20220098419 - Tanikawa; Mitsuru ;   et al.
2022-03-31
Method for manufacturing cured film, method for manufacturing electronic component, and electronic component
Grant 11,220,604 - Tanikawa , et al. January 11, 2
2022-01-11
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
Grant 10,961,411 - Tanikawa , et al. March 30, 2
2021-03-30
Curable composition for inkjet, and method for manufacturing electronic component
Grant 10,259,773 - Tanikawa , et al.
2019-04-16
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component
App 20190092963 - Tanikawa; Mitsuru ;   et al.
2019-03-28
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
Grant 10,202,519 - Tanikawa , et al. Feb
2019-02-12
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
Grant 10,066,118 - Tanikawa , et al. September 4, 2
2018-09-04
Curable Composition For Inkjet, And Method For Manufacturing Electronic Component
App 20170298005 - Tanikawa; Mitsuru ;   et al.
2017-10-19
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component
App 20170233615 - Tanikawa; Mitsuru ;   et al.
2017-08-17
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component
App 20170233599 - Tanikawa; Mitsuru ;   et al.
2017-08-17
Inkjet Photo- And Heat-curable Adhesive, Semiconductor Device Manufacturing Method, And Electronic Part
App 20170158922 - Tanikawa; Mitsuru ;   et al.
2017-06-08
Steering-column device
Grant 9,359,002 - Tanaka , et al. June 7, 2
2016-06-07
Method for manufacturing electronic component, and electronic component
Grant 9,337,019 - Tanikawa , et al. May 10, 2
2016-05-10
Method For Manufacturing Cured Film, Method For Manufacturing Electronic Component, And Electronic Component
App 20160046813 - Tanikawa; Mitsuru ;   et al.
2016-02-18
Method For Manufacturing Electronic Component, And Electronic Component
App 20160049297 - Tanikawa; Mitsuru ;   et al.
2016-02-18
Steering-column Device
App 20150314802 - TANAKA; Eiji ;   et al.
2015-11-05

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