| Patent | Date |
|---|
Curable Organopolysiloxane Composition, Cured Product, And Electric/electronic Equipment
App 20220275206 - FANG; Lei ; et al. | 2022-09-01 |
Liquid curable silicone adhesive composition, cured product thereof, and use thereof
Grant 11,396,616 - Kodama , et al. July 26, 2 | 2022-07-26 |
Multi-component Type Thermally Conductive Silicone-gel Composition, Thermally Conductive Material And Heat-emission Structure
App 20220185992 - OTA; Kenji ; et al. | 2022-06-16 |
Thermally conductive silicone compound
Grant 11,319,412 - Kato , et al. May 3, 2 | 2022-05-03 |
Multicomponent-curable Thermally-conductive Silicone Gel Composition, Thermally-conductive Member And Heat Dissipation Structure
App 20210261844 - OTA; Kenji ; et al. | 2021-08-26 |
A Curable Organopolysiloxane Composition And A Protectant Or Adhesive Composition Of Electric/electronic Parts
App 20200347229 - FUJISAWA; Toyohiko ; et al. | 2020-11-05 |
Multicomponent-curable Thermally-conductive Silicone Gel Composition, Thermally-conductive Member And Heat Dissipation Structure
App 20200270499 - OTA; Kenji ; et al. | 2020-08-27 |
Liquid Curable Silicone Adhesive Composition, Cured Product Thereof, And Use Thereof
App 20200123417 - KODAMA; Harumi ; et al. | 2020-04-23 |
Curable organopolysiloxane composition, semiconductor sealant comprising same, and semiconductor device
Grant 10,604,612 - Fujisawa , et al. | 2020-03-31 |
Thermally Conductive Silicone Compound
App 20190345291 - KATO; Tomoko ; et al. | 2019-11-14 |
Adhesion promoter and curable organopolysiloxane composition containing same
Grant 10,358,542 - Fujisawa , et al. | 2019-07-23 |
Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components
Grant 10,077,339 - Fujisawa , et al. September 18, 2 | 2018-09-18 |
Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
Grant 9,947,858 - Fujisawa , et al. April 17, 2 | 2018-04-17 |
Curable Organopolysiloxane Composition, Semiconductor Sealant Comprising Same, And Semiconductor Device
App 20170355804 - FUJISAWA; Toyohiko ; et al. | 2017-12-14 |
Curable Organopolysiloxane Composition, And Protective-agent Or Adhesive-agent Composition For Electrical/electronic Components
App 20170121462 - FUJISAWA; Toyohiko ; et al. | 2017-05-04 |
Adhesion Promoter And Curable Organopolysiloxane Composition Containing Same
App 20170058103 - FUJISAWA; Toyohiko ; et al. | 2017-03-02 |
Curable silicone composition and cured product thereof
Grant 9,403,982 - Fujisawa , et al. August 2, 2 | 2016-08-02 |
Microparticles and curable organopolysiloxane composition containing the same
Grant 9,227,183 - Sutoh , et al. January 5, 2 | 2016-01-05 |
Curable Organopolysiloxane Composition For Transducers And Applications Of Such Curable Silicone Composition For Transducers
App 20150380636 - Fujisawa; Toyohiko ; et al. | 2015-12-31 |
Microparticles And Curable Organopolysiloxane Composition Containing The Same
App 20150246349 - Sutoh; Manabu ; et al. | 2015-09-03 |
Curable Silicone Composition And Cured Product Thereof
App 20150210853 - Fujisawa; Toyohiko ; et al. | 2015-07-30 |
Organosilicon compound, method for producing thereof, and curable silicone composition containing the same
Grant 8,729,195 - Taniguchi , et al. May 20, 2 | 2014-05-20 |
Organosilicon Compound, Method For Producing Thereof, And Curable Silicone Composition Containing The Same
App 20120309921 - Taniguchi; Yoshinori ; et al. | 2012-12-06 |
Hot-melt silicone adhesive
Grant 8,093,333 - Fujisawa , et al. January 10, 2 | 2012-01-10 |
Liquid Die Bonding Agent
App 20110224344 - Fujisawa; Toyohiko ; et al. | 2011-09-15 |
Display device, method of manufacturing thereof, and method of improving visibility
Grant 7,990,033 - Nakata , et al. August 2, 2 | 2011-08-02 |
Insulating liquid die-bonding agent and semiconductor device
Grant 7,897,717 - Fujisawa , et al. March 1, 2 | 2011-03-01 |
Display Device, Method Of Manufacturing Thereof, And Method Of Improving Visibility
App 20100148649 - Nakata; Toshiki ; et al. | 2010-06-17 |
Insulating Liquid Die-Bonding Agent And Semiconductor Device
App 20090263936 - Fujisawa; Toyohiko ; et al. | 2009-10-22 |
Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
Grant 7,534,659 - Sutoh , et al. May 19, 2 | 2009-05-19 |
Hot-Melt Silicone Adhesive
App 20090075009 - Fujisawa; Toyohiko ; et al. | 2009-03-19 |
Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device
Grant 7,198,853 - Ushio , et al. April 3, 2 | 2007-04-03 |
Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
App 20060057779 - Sutoh; Manabu ; et al. | 2006-03-16 |
Adhesive Sheet Of Cross-linked Silicone, Method Of Manufacturing Thereof, And Device
App 20040265599 - Ushio, Yoshito ; et al. | 2004-12-30 |
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