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name:-0.010493040084839
name:-0.019285917282104
name:-0.0068321228027344
Fujisawa; Shinji Patent Filings

Fujisawa; Shinji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujisawa; Shinji.The latest application filed is for "ultrasonic bonding device and ultrasonic bonding method".

Company Profile
1.5.3
  • Fujisawa; Shinji - Kanagawa JP
  • Fujisawa; Shinji - Tokyo JP
  • Fujisawa; Shinji - Nagano-ken JP
  • Fujisawa; Shinji - Suwa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ultrasonic bonding device and ultrasonic bonding method
Grant 10,518,513 - Oorui , et al. Dec
2019-12-31
Method for bonding composite materials and device for bonding composite materials
Grant 10,414,100 - Nakano , et al. Sept
2019-09-17
Display device and display panel
Grant 10,330,967 - Tamaki , et al.
2019-06-25
Ultrasonic Bonding Device And Ultrasonic Bonding Method
App 20170305129 - OORUI; Toshiaki ;   et al.
2017-10-26
Display Device And Display Panel
App 20170176796 - Tamaki; Masaya ;   et al.
2017-06-22
Method For Bonding Composite Materials And Device For Bonding Composite Materials
App 20170120505 - NAKANO; Takahiro ;   et al.
2017-05-04
Liquid crystal device and electronic equipment
Grant 6,812,974 - Hinata , et al. November 2, 2
2004-11-02
Liquid crystal display element, methods of producing and storing the same, and electronic equipment on which the same is mounted
Grant 5,610,742 - Hinata , et al. March 11, 1
1997-03-11

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