FUJISAWA; Satoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUJISAWA; Satoshi.The latest application filed is for "optical filter device, optical module, and electronic apparatus".

Company Profile

4.11.14

FUJISAWA; Satoshi - Tatsuno JP
Fujisawa; Satoshi - Tokyo N/A JP
Fujisawa; Satoshi - Nikko JP
Fujisawa; Satoshi - Tochigi-ken JP
Fujisawa; Satoshi - Nikko-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical Filter Device, Optical Module, And Electronic Apparatus App 20200264425 - SAITO; Daisuke ; et al.	2020-08-20
Optical filter device, optical module, and electronic apparatus Grant 10,684,463 - Saito , et al.	2020-06-16
Optical filter device, optical module, and electronic apparatus Grant 10,330,917 - Saito , et al.	2019-06-25
Optical Filter Device, Optical Module, And Electronic Apparatus App 20190146206 - SAITO; Daisuke ; et al.	2019-05-16
Optical Filter Device, Optical Module, And Electronic Apparatus App 20160091644 - SAITO; Daisuke ; et al.	2016-03-31
Surface-treated copper foil, method for producing same, and copper clad laminated board Grant 8,852,754 - Fujisawa , et al. October 7, 2	2014-10-07
Flexible copper clad laminate Grant 8,557,392 - Fujisawa , et al. October 15, 2	2013-10-15
Surface treated copper foil and copper clad laminate Grant 8,512,873 - Fujisawa , et al. August 20, 2	2013-08-20
Surface-treated Roughened Copper Foil And Copper Clad Laminate App 20130084463 - Fujisawa; Satoshi	2013-04-04
Surface-treated Copper Foil, Method For Producing Same, And Copper Clad Laminated Board App 20130040162 - Fujisawa; Satoshi ; et al.	2013-02-14
Roughened Copper Foil, Method For Producing Same, Copper Clad Laminated Board, And Printed Circuit Board App 20120285734 - Uno; Takeo ; et al.	2012-11-15
Surface Treated Copper Foil And Copper Clad Laminate App 20110189499 - Fujisawa; Satoshi ; et al.	2011-08-04
Flexible Copper Clad Laminate App 20110189501 - Fujisawa; Satoshi ; et al.	2011-08-04
Ultrathin copper foil with carrier and printed circuit board using same Grant 7,985,488 - Suzuki , et al. July 26, 2	2011-07-26
Ultrathin copper foil with carrier and printed circuit board using same Grant 7,892,655 - Suzuki , et al. February 22, 2	2011-02-22
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same App 20100270063 - Suzuki; Yuuji ; et al.	2010-10-28
Ultrathin copper foil with carrier and printed circuit board using same Grant 7,771,841 - Suzuki , et al. August 10, 2	2010-08-10
Droplet Ejection Head, Droplet Ejection Device, And Method Of Forming Electrode Substrate App 20080239006 - MATSUNO; Yasushi ; et al.	2008-10-02
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same App 20070154692 - Suzuki; Yuuji ; et al.	2007-07-05
Ultrathin copper foil with carrier and printed circuit board using same App 20070141381 - Suzuki; Yuuji ; et al.	2007-06-21

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