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Patent applications and USPTO patent grants for FUJISAWA; Sachiko.The latest application filed is for "bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board".
Patent | Date |
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Bonded Body, Ceramic Copper Circuit Board, Method For Manufacturing Bonded Body, And Method For Manufacturing Ceramic Copper Circuit Board App 20220295644 - YONETSU; Maki ;   et al. | 2022-09-15 |
Brazing Material, Bonded Body, Ceramic Circuit Board, And Method For Manufacturing Bonded Body App 20220288726 - YONETSU; Maki ;   et al. | 2022-09-15 |
Bonded Body, Circuit Board, And Semiconductor Device App 20210398928 - YONETSU; Maki ;   et al. | 2021-12-23 |
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