Fujisawa; Atsushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujisawa; Atsushi.The latest application filed is for "method for manufacturing semiconductor device".

Company Profile

0.29.22

Fujisawa; Atsushi - Nanae JP
Fujisawa; Atsushi - Kameda JP
Fujisawa; Atsushi - Hokkaido N/A JP
Fujisawa; Atsushi - Yokkaichi JP
Fujisawa; Atsushi - Hakodate JP
Fujisawa, Atsushi - Mie JP
Fujisawa, Atsushi - Hakodate-shi JP
Fujisawa; Atsushi - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 9,324,644 - Fujisawa April 26, 2	2016-04-26
Method for manufacturing semiconductor device Grant 9,263,274 - Fujisawa , et al. February 16, 2	2016-02-16
Semiconductor device and manufacturing method of the same Grant 9,184,142 - Fujisawa November 10, 2	2015-11-10
Method For Manufacturing Semiconductor Device App 20150294870 - FUJISAWA; Atsushi ; et al.	2015-10-15
Method for manufacturing semiconductor device Grant 9,087,850 - Fujisawa , et al. July 21, 2	2015-07-21
Semiconductor Device App 20150187687 - FUJISAWA; Atsushi	2015-07-02
Semiconductor device and method of manufacturing the same Grant 9,006,871 - Fujisawa April 14, 2	2015-04-14
Semiconductor Device And Manufacturing Method Of The Same App 20140061953 - FUJISAWA; Atsushi	2014-03-06
Semiconductor device and method of manufacturing the same Grant 8,609,468 - Fujisawa December 17, 2	2013-12-17
Semiconductor device and manufacturing method therefor Grant 8,466,540 - Tanaka , et al. June 18, 2	2013-06-18
Method of manufacturing semiconductor device Grant 8,399,302 - Tanaka , et al. March 19, 2	2013-03-19
Semiconductor Device And Method Of Manufacturing The Same App 20130020692 - Fujisawa; Atsushi	2013-01-24
Semiconductor Device And Method Of Manufacturing The Same App 20120267772 - FUJISAWA; Atsushi	2012-10-25
Manufacturing method for semiconductor devices and semiconductor device Grant 8,193,024 - Fujisawa June 5, 2	2012-06-05
Method For Manufacturing Semiconductor Device App 20120108013 - Fujisawa; Atsushi ; et al.	2012-05-03
Wire harness fixing tool Grant 8,129,621 - Mizutani , et al. March 6, 2	2012-03-06
Method Of Manufacturing Semiconductor Device App 20110300670 - TANAKA; Shigeki ; et al.	2011-12-08
Semiconductor Device and Manufacturing Method Therefor App 20100193923 - Tanaka; Shigeki ; et al.	2010-08-05
Semiconductor package configuration with improved lead portion arrangement Grant 7,579,674 - Amano , et al. August 25, 2	2009-08-25
Semiconductor device and method of manufacturing thereof Grant 7,348,659 - Amano , et al. March 25, 2	2008-03-25
Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section Grant 6,924,548 - Hasebe , et al. August 2, 2	2005-08-02
Lead frame and semiconductor device using the lead frame and method of manufacturing the same Grant 6,909,179 - Tanaka , et al. June 21, 2	2005-06-21
Method of manufacturing semiconductor package including forming a resin sealing member Grant 6,887,739 - Fujisawa , et al. May 3, 2	2005-05-03
Semiconductor device and method of manufacturing thereof App 20050029640 - Amano, Kenji ; et al.	2005-02-10
Protective member for protecting electric wires App 20050032975 - Sakaguchi, Takahiro ; et al.	2005-02-10
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate Grant 6,764,878 - Fujisawa , et al. July 20, 2	2004-07-20
Method of manufacturing semiconductor device having resin sealing body Grant 6,759,279 - Fujisawa , et al. July 6, 2	2004-07-06
Semiconductor device and its manufacturing method App 20040046240 - Hasebe, Hajime ; et al.	2004-03-11
Method of manufacturing semiconductor device App 20040005733 - Fujisawa, Atsushi ; et al.	2004-01-08
Line switch part snow melting device Grant 6,664,521 - Kondo , et al. December 16, 2	2003-12-16
Semiconductor device and method of manufacturing the same Grant 6,551,862 - Oota , et al. April 22, 2	2003-04-22
Method of manufacturing semiconductor device App 20020192872 - Fujisawa, Atsushi ; et al.	2002-12-19
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate App 20020182776 - Fujisawa, Atsushi ; et al.	2002-12-05
Ball grid array type semiconductor package having a flexible substrate Grant 6,476,466 - Fujisawa , et al. November 5, 2	2002-11-05
Method of manufacturing a semiconductor device Grant 6,448,111 - Fujisawa , et al. September 10, 2	2002-09-10
Ball grid array type semiconductor package having a flexible substrate App 20020079579 - Fujisawa, Atsushi ; et al.	2002-06-27
Ball grid array type semiconductor package having a flexible substrate App 20020070462 - Fujisawa, Atsushi ; et al.	2002-06-13
Semiconductor device and method of manufacturing the same App 20020050642 - Oota, Riyouichi ; et al.	2002-05-02
A method of manufacturing a semiconductor device App 20020039811 - Fujisawa, Atsushi	2002-04-04
Lead frame and semiconductor device using the lead frame and method of manufacturing the same App 20010050419 - Tanaka, Shigeki ; et al.	2001-12-13
Semiconductor device and its manufacturing method App 20010015489 - Fujisawa, Atsushi ; et al.	2001-08-23
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting Grant 6,232,650 - Fujisawa , et al. May 15, 2	2001-05-15
Protective construction for splice portion Grant 5,901,441 - Kawamura , et al. May 11, 1	1999-05-11
Method for checking a connection of wires and control apparatus Grant 5,757,955 - Fujisawa , et al. May 26, 1	1998-05-26