Patent | Date |
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Semiconductor device Grant 9,324,644 - Fujisawa April 26, 2 | 2016-04-26 |
Method for manufacturing semiconductor device Grant 9,263,274 - Fujisawa , et al. February 16, 2 | 2016-02-16 |
Semiconductor device and manufacturing method of the same Grant 9,184,142 - Fujisawa November 10, 2 | 2015-11-10 |
Method For Manufacturing Semiconductor Device App 20150294870 - FUJISAWA; Atsushi ;   et al. | 2015-10-15 |
Method for manufacturing semiconductor device Grant 9,087,850 - Fujisawa , et al. July 21, 2 | 2015-07-21 |
Semiconductor Device App 20150187687 - FUJISAWA; Atsushi | 2015-07-02 |
Semiconductor device and method of manufacturing the same Grant 9,006,871 - Fujisawa April 14, 2 | 2015-04-14 |
Semiconductor Device And Manufacturing Method Of The Same App 20140061953 - FUJISAWA; Atsushi | 2014-03-06 |
Semiconductor device and method of manufacturing the same Grant 8,609,468 - Fujisawa December 17, 2 | 2013-12-17 |
Semiconductor device and manufacturing method therefor Grant 8,466,540 - Tanaka , et al. June 18, 2 | 2013-06-18 |
Method of manufacturing semiconductor device Grant 8,399,302 - Tanaka , et al. March 19, 2 | 2013-03-19 |
Semiconductor Device And Method Of Manufacturing The Same App 20130020692 - Fujisawa; Atsushi | 2013-01-24 |
Semiconductor Device And Method Of Manufacturing The Same App 20120267772 - FUJISAWA; Atsushi | 2012-10-25 |
Manufacturing method for semiconductor devices and semiconductor device Grant 8,193,024 - Fujisawa June 5, 2 | 2012-06-05 |
Method For Manufacturing Semiconductor Device App 20120108013 - Fujisawa; Atsushi ;   et al. | 2012-05-03 |
Wire harness fixing tool Grant 8,129,621 - Mizutani , et al. March 6, 2 | 2012-03-06 |
Method Of Manufacturing Semiconductor Device App 20110300670 - TANAKA; Shigeki ;   et al. | 2011-12-08 |
Semiconductor Device and Manufacturing Method Therefor App 20100193923 - Tanaka; Shigeki ;   et al. | 2010-08-05 |
Semiconductor package configuration with improved lead portion arrangement Grant 7,579,674 - Amano , et al. August 25, 2 | 2009-08-25 |
Semiconductor device and method of manufacturing thereof Grant 7,348,659 - Amano , et al. March 25, 2 | 2008-03-25 |
Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section Grant 6,924,548 - Hasebe , et al. August 2, 2 | 2005-08-02 |
Lead frame and semiconductor device using the lead frame and method of manufacturing the same Grant 6,909,179 - Tanaka , et al. June 21, 2 | 2005-06-21 |
Method of manufacturing semiconductor package including forming a resin sealing member Grant 6,887,739 - Fujisawa , et al. May 3, 2 | 2005-05-03 |
Semiconductor device and method of manufacturing thereof App 20050029640 - Amano, Kenji ;   et al. | 2005-02-10 |
Protective member for protecting electric wires App 20050032975 - Sakaguchi, Takahiro ;   et al. | 2005-02-10 |
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate Grant 6,764,878 - Fujisawa , et al. July 20, 2 | 2004-07-20 |
Method of manufacturing semiconductor device having resin sealing body Grant 6,759,279 - Fujisawa , et al. July 6, 2 | 2004-07-06 |
Semiconductor device and its manufacturing method App 20040046240 - Hasebe, Hajime ;   et al. | 2004-03-11 |
Method of manufacturing semiconductor device App 20040005733 - Fujisawa, Atsushi ;   et al. | 2004-01-08 |
Line switch part snow melting device Grant 6,664,521 - Kondo , et al. December 16, 2 | 2003-12-16 |
Semiconductor device and method of manufacturing the same Grant 6,551,862 - Oota , et al. April 22, 2 | 2003-04-22 |
Method of manufacturing semiconductor device App 20020192872 - Fujisawa, Atsushi ;   et al. | 2002-12-19 |
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate App 20020182776 - Fujisawa, Atsushi ;   et al. | 2002-12-05 |
Ball grid array type semiconductor package having a flexible substrate Grant 6,476,466 - Fujisawa , et al. November 5, 2 | 2002-11-05 |
Method of manufacturing a semiconductor device Grant 6,448,111 - Fujisawa , et al. September 10, 2 | 2002-09-10 |
Ball grid array type semiconductor package having a flexible substrate App 20020079579 - Fujisawa, Atsushi ;   et al. | 2002-06-27 |
Ball grid array type semiconductor package having a flexible substrate App 20020070462 - Fujisawa, Atsushi ;   et al. | 2002-06-13 |
Semiconductor device and method of manufacturing the same App 20020050642 - Oota, Riyouichi ;   et al. | 2002-05-02 |
A method of manufacturing a semiconductor device App 20020039811 - Fujisawa, Atsushi | 2002-04-04 |
Lead frame and semiconductor device using the lead frame and method of manufacturing the same App 20010050419 - Tanaka, Shigeki ;   et al. | 2001-12-13 |
Semiconductor device and its manufacturing method App 20010015489 - Fujisawa, Atsushi ;   et al. | 2001-08-23 |
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting Grant 6,232,650 - Fujisawa , et al. May 15, 2 | 2001-05-15 |
Protective construction for splice portion Grant 5,901,441 - Kawamura , et al. May 11, 1 | 1999-05-11 |
Method for checking a connection of wires and control apparatus Grant 5,757,955 - Fujisawa , et al. May 26, 1 | 1998-05-26 |