Fujino; Noboru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fujino; Noboru.The latest application filed is for "method for calibrating wire clamp device, and wire bonding apparatus".
- Fujino; Noboru - Tokyo JP
- Fujino; Noboru - Saitama N/A JP
- - Saitama JP
- Fujino; Noboru - Musashimurayama-shi JP
- Fujino; Noboru - Akishima-shi JP
- Fujino; Noboru - Iwai JP
- Fujino; Noboru - Iwai-shi JP
- Fujino; Noboru - Musashimurayama JP
| Patent | Date |
|---|---|
| Method for calibrating wire clamp device Grant 11,257,781 - Fujino , et al. February 22, 2 | 2022-02-22 |
| Method For Calibrating Wire Clamp Device, And Wire Bonding Apparatus App 20190237428 - FUJINO; Noboru ; et al. | 2019-08-01 |
| Plastic lens Grant 8,619,371 - Fujino , et al. December 31, 2 | 2013-12-31 |
| Plastic lens Grant 08619371 - | 2013-12-31 |
| Plastic Lens App 20120140336 - FUJINO; Noboru ; et al. | 2012-06-07 |
| Method for securing a curved circuit board in die bonder and recording medium containing program for securing a curved circuit board in die bonder App 20100078125 - Fujino; Noboru ; et al. | 2010-04-01 |
| Apparatus and method for picking-up semiconductor dies App 20090101282 - Fujino; Noboru ; et al. | 2009-04-23 |
| Light source apparatus and an image display apparatus Grant 7,350,926 - Fukuda , et al. April 1, 2 | 2008-04-01 |
| Light source device Grant 7,210,825 - Watanabe , et al. May 1, 2 | 2007-05-01 |
| Light source apparatus and an image display apparatus App 20060001844 - Fukuda; Mitsuharu ; et al. | 2006-01-05 |
| Light source device App 20040145896 - Watanabe, Hiroshi ; et al. | 2004-07-29 |
| Die bonding apparatus Grant 6,244,493 - Shimazaki , et al. June 12, 2 | 2001-06-12 |
| Marking method and apparatus Grant 5,136,948 - Fujino , et al. August 11, 1 | 1992-08-11 |
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