Fujinawa; Tohru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujinawa; Tohru.The latest application filed is for "adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device".

Company Profile

2.29.30

Fujinawa; Tohru - Chikusei N/A JP
Fujinawa; Tohru - Ibaraki N/A JP
Fujinawa; Tohru - Chikusei-shi JP
Fujinawa; Tohru - Tsukuba JP
Fujinawa; Tohru - Ibaraki-ken JP
Fujinawa; Tohru - Tsukuba-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device Grant 8,696,942 - Katogi , et al. April 15, 2	2014-04-15
Circuit connection material, circuit member connecting structure and method of connecting circuit member Grant 8,558,118 - Arifuku , et al. October 15, 2	2013-10-15
Circuit connection material, circuit member connecting structure and method of connecting circuit member Grant 8,541,688 - Arifuku , et al. September 24, 2	2013-09-24
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device Grant 8,518,303 - Katogi , et al. August 27, 2	2013-08-27
Circuit connection material, circuit member connecting structure and method of connecting circuit member Grant 8,497,431 - Arifuku , et al. July 30, 2	2013-07-30
Adhesive Composition, Circuit Connecting Material, Connection Structure Of Circuit Member, And Semiconductor Device App 20120273974 - Katogi; Shigeki ; et al.	2012-11-01
Circuit Connecting Material, Film-like Circuit Connecting Material Using The Circuit Connecting Material, Structure For Connecting Circuit Member, And Method For Connecting Circuit Member App 20120138868 - Arifuku; Motohiro ; et al.	2012-06-07
Anisotropic Conductive Particles App 20120097902 - Arifuku; Motohiro ; et al.	2012-04-26
Adhesive Composition, Circuit Connecting Material And Connecting Structure Of Circuit Member App 20120085579 - Tatsuzawa; Takashi ; et al.	2012-04-12
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 8,142,605 - Watanabe , et al. March 27, 2	2012-03-27
Wiring terminal-connecting adhesive Grant 8,120,189 - Arifuku , et al. February 21, 2	2012-02-21
Adhesive, method of connecting wiring terminals and wiring structure Grant 8,115,322 - Arifuku , et al. February 14, 2	2012-02-14
Adhesive Material Reel App 20120015126 - Tatsuzawa; Takashi ; et al.	2012-01-19
Adhesive Material Reel App 20110300326 - Tatsuzawa; Takashi ; et al.	2011-12-08
Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure Grant 8,029,911 - Nomura , et al. October 4, 2	2011-10-04
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,967,943 - Watanabe , et al. June 28, 2	2011-06-28
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,968,196 - Watanabe , et al. June 28, 2	2011-06-28
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20110114893 - Watanabe; Itsuo ; et al.	2011-05-19
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,879,956 - Watanabe , et al. February 1, 2	2011-02-01
Adhesive, Method Of Connecting Wiring Terminals And Wiring Structure App 20100326596 - ARIFUKU; Motohiro ; et al.	2010-12-30
Adhesive, Method Of Connecting Wiring Terminals And Wiring Structure App 20100330364 - ARIFUKU; Motohiro ; et al.	2010-12-30
Adhesive For Circuit Connection, Circuit Connection Method Using The Same, And Circuit Connected Structure App 20100294551 - Nomura; Satoyuki ; et al.	2010-11-25
Wiring-connecting Material And Wiring-connected Board Production Process Using The Same App 20100265685 - Fujinawa; Tohru ; et al.	2010-10-21
Circuit Connection Material, Circuit Member Connecting Structure And Method Of Connecting Circuit Member App 20100212943 - Arifuku; Motohiro ; et al.	2010-08-26
Circuit Connection Material, Circuit Member Connecting Structure And Method Of Connecting Circuit Member App 20100208444 - Arifuku; Motohiro ; et al.	2010-08-19
Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles Grant 7,777,335 - Arifuku , et al. August 17, 2	2010-08-17
Circuit Connection Material, Circuit Member Connecting Structure And Method Of Connecting Circuit Member App 20100108365 - Arifuku; Motohiro ; et al.	2010-05-06
Adhesive Composition, Circuit Connecting Material, Connection Structure Of Circuit Member, And Semiconductor Device App 20090309220 - Katogi; Shigeki ; et al.	2009-12-17
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,629,056 - Watanabe , et al. December 8, 2	2009-12-08
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,629,050 - Watanabe , et al. December 8, 2	2009-12-08
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,618,713 - Watanabe , et al. November 17, 2	2009-11-17
Electronic circuit including circuit-connecting material Grant 7,604,868 - Watanabe , et al. October 20, 2	2009-10-20
Circuit-connecting material and circuit terminal connected structure and connecting method Grant 7,553,890 - Watanabe , et al. June 30, 2	2009-06-30
Adhesive, Method Of Connecting Wiring Terminals And Wiring Structure App 20090101279 - Arifuki; Motohiro ; et al.	2009-04-23
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20080064233 - Watanabe; Itsuo ; et al.	2008-03-13
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20080057742 - Watanabe; Itsuo ; et al.	2008-03-06
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20080054225 - Watanabe; Itsuo ; et al.	2008-03-06
Circuit-connecting Material And Circuit Terminal Connected Structure And Connecting Method App 20070299172 - Watanabe; Itsuo ; et al.	2007-12-27
Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure App 20070166549 - Nomura; Satoyuki ; et al.	2007-07-19
Adhesive, method of connecting wiring terminals and wiring structure Grant 7,241,644 - Arifuku , et al. July 10, 2	2007-07-10
Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure Grant 7,208,105 - Nomura , et al. April 24, 2	2007-04-24
Wiring-connecting material and wiring-connected board production process using the same Grant 7,141,645 - Fujinawa , et al. November 28, 2	2006-11-28
Wiring-connecting material and wiring-connected board production process using the same App 20060252843 - Fujinawa; Tohru ; et al.	2006-11-09
Electronic circuit including circuit-connecting material App 20060060969 - Watanabe; Itsuo ; et al.	2006-03-23
Circuit-connecting material and circuit terminal connected structure and connecting method App 20060063366 - Watanabe; Itsuo ; et al.	2006-03-23
Circuit-connecting material and circuit terminal connected structure and connecting method App 20060014860 - Watanabe; Itsuo ; et al.	2006-01-19
Adhesive agent, method of connecting wiring terminals and wiring structure Grant 6,939,913 - Arifuku , et al. September 6, 2	2005-09-06
Adhesive, method of connecting wiring terminals and wiring structure App 20050178502 - Arifuku, Motohiro ; et al.	2005-08-18
Adhesive, method of connecting wiring terminals and wiring structure App 20050176882 - Arifuku, Motohiro ; et al.	2005-08-11
Circuit-connecting material and circuit terminal connected structure and connecting method App 20040222408 - Watanabe, Itsuo ; et al.	2004-11-11
Wiring-connecting material and wiring-connected board production process using the same App 20040214979 - Fujinawa, Tohru ; et al.	2004-10-28
Circuit connecting material, and structure and method of connecting circuit terminal Grant 6,777,464 - Watanabe , et al. August 17, 2	2004-08-17
Wiring-connecting material and process for producing circuit board with the same Grant 6,762,249 - Fujinawa , et al. July 13, 2	2004-07-13
Adhesive for circuit connection , circuit connection method using the same, and circuit connection structure App 20030141014 - Satoyuki, Nomura ; et al.	2003-07-31

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