Fujimura; Makoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujimura; Makoto.The latest application filed is for "radiation-sensitive resin composition and electronic component".

Company Profile

4.10.22

Fujimura; Makoto - Tokyo JP
FUJIMURA; Makoto - Chiyoda-ku Tokyo
Fujimura; Makoto - Seki N/A JP
Fujimura; Makoto - Seki-shi JP
Fujimura; Makoto - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Radiation-sensitive resin composition and electronic component Grant 11,169,440 - Fujimura November 9, 2	2021-11-09
Laminate production method Grant 10,721,823 - Fujimura , et al.	2020-07-21
Laminate production method Grant 10,716,222 - Fujimura , et al.	2020-07-14
Manufacturing method for multi-layer printed circuit board Grant 10,568,212 - Fujimura , et al. Feb	2020-02-18
Radiation-sensitive Resin Composition And Electronic Component App 20200004145 - FUJIMURA; Makoto	2020-01-02
Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article Grant 10,501,620 - Fujimura , et al. Dec	2019-12-10
Resin composition Grant 10,233,325 - Tsutsumi , et al.	2019-03-19
Radiation Sensitive Resin Composition And Electronic Component App 20190079396 - TSUTSUMI; Takashi ; et al.	2019-03-14
Curable Resin Composition, Curable Resin Molded Article, Cured Product, Laminate, Complex, And Multi-layer Printed Circuit Board App 20180355184 - FUJIMURA; Makoto ; et al.	2018-12-13
Resin Composition App 20180273722 - TSUTSUMI; Takashi ; et al.	2018-09-27
Resin Composition App 20180258279 - Tsutsumi; Takashi ; et al.	2018-09-13
Manufacturing Method For Multi-layer Printed Circuit Board App 20180184525 - FUJIMURA; Makoto ; et al.	2018-06-28
Curable Resin Composition, Molded Curable-resin Object, Cured Object, Layered Product, Composite, And Multilayered Printed Wiring Board App 20180117891 - FUJIMURA; Makoto ; et al.	2018-05-03
Desmear Processing Method And Manufacturing Method For Multilayer Printed Wiring Board App 20180020551 - FUJIMURA; Makoto ; et al.	2018-01-18
Laminate Production Method App 20170359907 - FUJIMURA; Makoto ; et al.	2017-12-14
Laminate Production Method App 20170359908 - FUJIMURA; Makoto ; et al.	2017-12-14
Curable Epoxy Composition, Film, Laminated Film, Prepreg, Laminate, Cured Article, And Composite Article App 20170313809 - Fujimura; Makoto ; et al.	2017-11-02
Curable Epoxy Composition And Film, Laminated Film, Prepreg, Laminate, Cured Article, And Composite Article Obtained Using Same App 20170313043 - Fujimura; Makoto ; et al.	2017-11-02
Curable Epoxy Composition, Film, Laminated Film, Prepreg, Laminate, Cured Article, And Composite App 20160297921 - Shindo; Natsuko ; et al.	2016-10-13
Insulating adhesive film, prepreg, laminate, cured article, and composite article Grant 9,453,145 - Fujimura , et al. September 27, 2	2016-09-27
Curable Epoxy Composition, Film, Laminated Film, Prepreg, Laminate, Cured Article, And Composite Article App 20160257812 - Fujimura; Makoto ; et al.	2016-09-08
Electric cutting-tool grinder Grant 9,073,166 - Fujimura July 7, 2	2015-07-07
Insulating Adhesive Film, Prepreg, Laminate, Cured Article, And Composite Article App 20140234614 - Fujimura; Makoto ; et al.	2014-08-21
Electric Cutting-tool Grinder App 20140030964 - Fujimura; Makoto	2014-01-30
Curable Resin Composition, Cured Product, Surface Treated Cured Product, And Laminate App 20130309512 - Fujimura; Makoto ; et al.	2013-11-21
Method Of Manufacturing Electronic Device App 20100203713 - Ohmi; Tadahiro ; et al.	2010-08-12
Composite resin molded article, laminate, multi-layer circuit board, and electronic device App 20090151984 - Fujimura; Makoto	2009-06-18
Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same App 20080217617 - Sugawa; Shigetoshi ; et al.	2008-09-11
Antimicrobial substance and antimicrobial resin composition containing ethylene copolymer Grant 5,208,016 - Ohmae , et al. May 4, 1	1993-05-04

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