Fujimoto; Harry

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujimoto; Harry.The latest application filed is for "isolation structure configurations for modifying stresses in semiconductor devices".

Company Profile

0.9.3

Fujimoto; Harry - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Isolation structure configurations for modifying stresses in semiconductor devices Grant 7,411,269 - Ma , et al. August 12, 2	2008-08-12
Isolation structure configurations for modifying stresses in semiconductor devices Grant 7,410,858 - Ma , et al. August 12, 2	2008-08-12
Isolation structure configurations for modifying stresses in semiconductor devices App 20070013023 - Ma; Qing ; et al.	2007-01-18
Isolation structure configurations for modifying stresses in semiconductor devices App 20060220147 - Ma; Qing ; et al.	2006-10-05
Isolation structure configurations for modifying stresses in semiconductor devices App 20050179109 - Ma, Qing ; et al.	2005-08-18
Isolation structure configurations for modifying stresses in semiconductor devices Grant 6,876,053 - Ma , et al. April 5, 2	2005-04-05
Silicon interposer and multi-chip-module (MCM) with through substrate vias Grant 6,562,653 - Ma , et al. May 13, 2	2003-05-13
Integrated circuit guard ring structures Grant 6,509,622 - Ma , et al. January 21, 2	2003-01-21
Direct build-up layer on an encapsulated die package Grant 6,271,469 - Ma , et al. August 7, 2	2001-08-07
Silicon interposer and multi-chip-module (MCM) with through substrate vias Grant 6,229,216 - Ma , et al. May 8, 2	2001-05-08
Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units Grant 6,219,243 - Ma , et al. April 17, 2	2001-04-17
Structures and processes for fabricating moisture resistant chip-on-flex packages Grant 6,154,366 - Ma , et al. November 28, 2	2000-11-28

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