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Refrigerant Cycle System
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Resin Composition, Resin Member, Resin Sheet, B-stage Sheet, C-stage Sheet, Metal Foil With Resin, Metal Substrate, And Power Semiconductor Device
App 20210206906 - KIGUCHI; Kazuya ; et al. | 2021-07-08 |
Method for producing semiconductor device
Grant 11,049,825 - Kasahara , et al. June 29, 2 | 2021-06-29 |
Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-stage Sheet, C-stage Sheet, Cured Product, Metal Foil With Resin, Metal Substrate, And Power Semiconductor Device
App 20210016546 - KIGUCHI; Kazuya ; et al. | 2021-01-21 |
Prepreg, Laminate, And Production Methods Therefor, As Well As Printed Circuit Board And Semiconductor Package
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On-chip monitor circuit and semiconductor chip
Grant 10,776,484 - Nagata , et al. Sept | 2020-09-15 |
Method For Producing Semiconductor Device
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Roof ditch molding end cap
Grant 10,464,502 - Renn , et al. No | 2019-11-05 |
Roof Ditch Molding End Cap
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Buffer Sheet Composition And Buffer Sheet
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Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
Grant 10,034,384 - Kurafuchi , et al. July 24, 2 | 2018-07-24 |
Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
Grant 9,873,771 - Nomura , et al. January 23, 2 | 2018-01-23 |
On-chip Monitor Circuit And Semiconductor Chip
App 20180004944 - NAGATA; Makoto ; et al. | 2018-01-04 |
Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
Grant 9,661,763 - Kurafuchi , et al. May 23, 2 | 2017-05-23 |
Film-like Epoxy Resin Composition, Method Of Producing Film-like Epoxy Resin Composition, And Method Of Producing Semiconductor Device
App 20170073481 - NOMURA; Yutaka ; et al. | 2017-03-16 |
Structure Containing Conductor Circuit, Method For Manufacturing Same, And Heat-curable Resin Composition
App 20170020004 - KURAFUCHI; Kazuhiko ; et al. | 2017-01-19 |
Structure Containing Conductor Circuit, Method For Manufacturing Same, And Heat-curable Resin Composition
App 20140251676 - Kurafuchi; Kazuhiko ; et al. | 2014-09-11 |
Primer Layer For Plating Process, Laminate For Circuit Board And Production Method For Same, And Multilayer Circuit Board And Production Method For Same
App 20140151091 - Fujimoto; Daisuke ; et al. | 2014-06-05 |
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
Grant 8,568,891 - Mizuno , et al. October 29, 2 | 2013-10-29 |
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
Grant 8,501,870 - Mizuno , et al. August 6, 2 | 2013-08-06 |
Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
Grant 8,404,769 - Fujimoto , et al. March 26, 2 | 2013-03-26 |
Process For Producing Resin Varnish Containing Semi-ipn Composite, Thermosetting Resin And, Provided Using The Same, Resin Varnish For Printed Wiring Board, Prepreg And Metal-clad Laminate
App 20130040153 - FUJIMOTO; Daisuke ; et al. | 2013-02-14 |
Thermosetting Resin Composition Of Semi-ipn Composite, And Varnish, Prepreg And Metal Clad Laminated Board Using The Same
App 20130000843 - MIZUNO; Yasuyuki ; et al. | 2013-01-03 |
Primer Layer For Plating Process, Laminate For Wiring Board And Method For Manufacture Thereof, Multilayer Wiring Board And Method For Manufacture Thereof
App 20120305291 - FUJIMOTO; Daisuke ; et al. | 2012-12-06 |
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
Grant 8,277,948 - Mizuno , et al. October 2, 2 | 2012-10-02 |
Thermosetting Resin Composition Of Semi-ipn Composite, And Varnish, Prepreg And Metal Clad Laminated Board Using The Same
App 20120214009 - MIZUNO; Yasuyuki ; et al. | 2012-08-23 |
Composition of polycyanate ester and biphenyl epoxy resin
Grant 7,816,430 - Mizuno , et al. October 19, 2 | 2010-10-19 |
Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same
App 20100233495 - Mizuno; Yasuyuki ; et al. | 2010-09-16 |
Process For Producing Resin Varnish Containing Semi-ipn Composite Thermosetting Resin And, Provided Using The Same, Resin Varnish For Printed Wiring Board, Prepreg And Metal-clad Laminate
App 20100129676 - Fujimoto; Daisuke ; et al. | 2010-05-27 |
Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
App 20090323300 - Fujimoto; Daisuke ; et al. | 2009-12-31 |
Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish
App 20070207326 - Mizuno; Yasuyuki ; et al. | 2007-09-06 |
Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate
Grant 7,157,506 - Mizuno , et al. January 2, 2 | 2007-01-02 |
Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same
App 20060167189 - Mizuno; Yasuyuki ; et al. | 2006-07-27 |
Thermosetting resin composition and use thereof
Grant 7,078,106 - Tsuchikawa , et al. July 18, 2 | 2006-07-18 |
Thermosetting resin composition and use thereof
App 20040091726 - Tsuchikawa, Shinji ; et al. | 2004-05-13 |
Zinc phosphate-containing surface conditioning agent phosphate conversion-treated steel plate and painted steel plate, and zinc phosphate dispersion
App 20040011429 - Miyamoto, Satoshi ; et al. | 2004-01-22 |
Thermosetting resin composition and use thereof
Grant 6,667,107 - Tsuchikawa , et al. December 23, 2 | 2003-12-23 |
Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate
App 20030130412 - Mizuno, Yasuyuki ; et al. | 2003-07-10 |
Thermosetting resin composition and use thereof
App 20020147277 - Tsuchikawa, Shinji ; et al. | 2002-10-10 |
Production of insulating varnishes and multilayer printed circuit boards using these varnishes
Grant 6,197,149 - Kobayashi , et al. March 6, 2 | 2001-03-06 |
Process for producing multilayer printed circuit board for wire bonding
Grant 5,879,568 - Urasaki , et al. March 9, 1 | 1999-03-09 |
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