FUJIMARU; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUJIMARU; Koichi.The latest application filed is for "active energy ray-curable ink for offset printing and method for producing printed matter using the same".

Company Profile

2.7.9

FUJIMARU; Koichi - Otsu-shi JP
Fujimaru; Koichi - Otsu JP
Fujimaru; Koichi - Shiga JP
Fujimaru; Koichi - Hikone JP
Fujimaru; Koichi - Niigata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Active Energy Ray-curable Ink For Offset Printing And Method For Producing Printed Matter Using The Same App 20200010701 - TSUJI; Yuichi ; et al.	2020-01-09
Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same Grant 10,294,395 - Matsumura , et al.	2019-05-21
Adhesive Composition, Semiconductor Device Containing Cured Product Thereof, And Method For Manufacturing Semiconductor Device Using Same App 20170362472 - Matsumura; Kazuyuki ; et al.	2017-12-21
Adhesive agent having a polyimide and acid modified rosin Grant 9,591,768 - Fujimaru , et al. March 7, 2	2017-03-07
Adhesive Agent, Adhesive Film, And Semiconductor Device And Method For Manufacturing Same App 20150315436 - FUJIMARU; Koichi ; et al.	2015-11-05
Adhesive Sheet For Production Of Semiconductor Device With Bump Electrode, And Method For Production Of Semiconductor Device App 20150072477 - Matsumura; Kazuyuki ; et al.	2015-03-12
Resin Composition, Resin Composition Sheet, Semiconductor Device And Production Method Therefor App 20140291870 - Shimba; Yoichi ; et al.	2014-10-02
Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device Grant 8,653,202 - Fujimaru , et al. February 18, 2	2014-02-18
Adhesive Composition, Adhesive Sheet, Circuit Board And Semiconductor Device Both Produced Using These, And Processes For Producing These App 20120129988 - Fujimaru; Koichi ; et al.	2012-05-24
Paste composition for light guide and light guide utilizing the same Grant 7,960,462 - Shinba , et al. June 14, 2	2011-06-14
Paste Composition For Light Guide And Light Guide Utilizing The Same App 20090270541 - Shinba; Yoichi ; et al.	2009-10-29
Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device App 20090123747 - Fujimaru; Koichi ; et al.	2009-05-14
Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same Grant 6,783,828 - Fujimaru , et al. August 31, 2	2004-08-31
Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same App 20030035948 - Fujimaru, Koichi ; et al.	2003-02-20
Directly imageable waterless planographic printing plate Grant 6,194,122 - Ichikawa , et al. February 27, 2	2001-02-27

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