Fujimaki; Rei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fujimaki; Rei.The latest application filed is for "solder alloy for led, and led module".
- Fujimaki; Rei - Tokyo JP
- Fujimaki; Rei - Koshigaya JP
- Fujimaki; Rei - Koshigaya-shi JP
| Patent | Date |
|---|---|
| Lead-free solder alloy Grant 10,343,238 - Suzuki , et al. July 9, 2 | 2019-07-09 |
| Solder alloy, and LED module Grant 10,272,527 - Ueshima , et al. | 2019-04-30 |
| Solder alloy and module Grant 10,265,807 - Ueshima , et al. | 2019-04-23 |
| Sn-Cu-based lead-free solder alloy Grant 10,137,536 - Ohnishi , et al. November 27, 2 | 2018-11-27 |
| Solder Alloy for LED, and LED Module App 20180264601 - Ueshima; Minoru ; et al. | 2018-09-20 |
| Lead-free Solder Alloy App 20180001426 - SUZUKI; Masayuki ; et al. | 2018-01-04 |
| High-temperature lead-free solder alloy Grant 9,796,053 - Fujimaki , et al. October 24, 2 | 2017-10-24 |
| Solder Alloy for LED, and LED Module App 20170014955 - UESHIMA; Minoru ; et al. | 2017-01-19 |
| Lead-free Solder Alloy App 20150328722 - SUZUKI; Masayuki ; et al. | 2015-11-19 |
| High-temperature Lead-free Solder Alloy App 20150217410 - Fujimaki; Rei ; et al. | 2015-08-06 |
| Sn-cu-based Lead-free Solder Alloy App 20150029670 - Ohnishi; Tsukasa ; et al. | 2015-01-29 |
| High-temperature lead-free solder alloy Grant 8,865,062 - Ueshima , et al. October 21, 2 | 2014-10-21 |
| High-temperature Lead-free Solder Alloy App 20140044479 - Ueshima; Minoru ; et al. | 2014-02-13 |
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