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FUJIKAWA; Iwao Patent Filings

FUJIKAWA; Iwao

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUJIKAWA; Iwao.The latest application filed is for "arithmetic processing device for resolver signal".

Company Profile
0.4.3
  • FUJIKAWA; Iwao - Tokyo JP
  • Fujikawa; Iwao - Gunma JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Arithmetic Processing Device For Resolver Signal
App 20200110582 - KATSU; Mitsunori ;   et al.
2020-04-09
Laminated capacitor having laminated internal conductor layers with lead out portions on side areas thereof
Grant 7,460,354 - Shimizu , et al. December 2, 2
2008-12-02
Laminated Capacitor
App 20070247783 - Shimizu; Masayuki ;   et al.
2007-10-25
Method of manufacturing wire wound electronic component
Grant 6,727,792 - Amada , et al. April 27, 2
2004-04-27
Method of manufacturing wire wound electronic component
App 20020190832 - Amada, Yoshihiro ;   et al.
2002-12-19
Method of manufacturing wire wound electronic component
Grant 6,449,830 - Amada , et al. September 17, 2
2002-09-17
Wire wound electronic component and method of manufacturing the same
Grant 6,144,280 - Amada , et al. November 7, 2
2000-11-07

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