loadpatents
name:-0.031548976898193
name:-0.036220073699951
name:-0.0038881301879883
Fujii; Tomoyuki Patent Filings

Fujii; Tomoyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujii; Tomoyuki.The latest application filed is for "grooved noodle, grooved noodle production method, and grooved noodle cooking method".

Company Profile
3.34.25
  • Fujii; Tomoyuki - Kobe JP
  • FUJII; Tomoyuki - Fujimino-city Saitama
  • FUJII; Tomoyuki - Fujimino-shi JP
  • Fujii; Tomoyuki - Osaka JP
  • FUJII; Tomoyuki - Kobe-shi JP
  • Fujii; Tomoyuki - Nagoya N/A JP
  • Fujii; Tomoyuki - Kosai JP
  • Fujii; Tomoyuki - Hamamatsu-shi JP
  • Fujii; Tomoyuki - Nagoya-Shi JP
  • Fujii, Tomoyuki - Nagoya-City JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Piston pump
Grant D943,637 - Fujii February 15, 2
2022-02-15
Piston pump
Grant D938,997 - Fujii December 21, 2
2021-12-21
Neutral valve and valve assembly including same
Grant 10,774,848 - Fujii Sept
2020-09-15
Grooved Noodle, Grooved Noodle Production Method, And Grooved Noodle Cooking Method
App 20200260764 - KIMURA; Ryusuke ;   et al.
2020-08-20
Low-carbohydrate Noodle Mix
App 20200170285 - KIMURA; Ryusuke ;   et al.
2020-06-04
Method For Manufacturing Dried Pasta
App 20200163365 - ASAHINA; Kenta ;   et al.
2020-05-28
Packaging bag, and method using same for storing polyvinyl alcohol-based resin that contains modified group having active hydrogen
Grant 10,518,498 - Takahashi , et al. Dec
2019-12-31
Neutral Valve And Valve Assembly Including Same
App 20190186505 - FUJII; Tomoyuki
2019-06-20
Packaging Bag, And Method Using Same For Storing Polyvinyl Alcohol-based Resin That Contains Modified Group Having Active Hydrogen
App 20170283142 - TAKAHASHI; Hirosato ;   et al.
2017-10-05
Bonding material and semiconductor supporting device
Grant 9,631,128 - Fujii , et al. April 25, 2
2017-04-25
Tensile test machine
Grant 9,366,608 - Fujii , et al. June 14, 2
2016-06-14
Tensile Test Machine
App 20150177112 - Fujii; Tomoyuki ;   et al.
2015-06-25
Bonding structure and semiconductor device manufacturing apparatus
Grant 8,480,806 - Nakamura , et al. July 9, 2
2013-07-09
Bonding structure and semiconductor device manufacturing apparatus
Grant 8,414,704 - Fujii , et al. April 9, 2
2013-04-09
Bonding structure for a terminal of a susceptor of a semiconductor device manufacturing apparatus
Grant 8,193,629 - Takebayashi , et al. June 5, 2
2012-06-05
Substrate supporting member
Grant 8,129,016 - Kawajiri , et al. March 6, 2
2012-03-06
Joined body and manufacturing method for the same
Grant 7,854,975 - Fujii December 21, 2
2010-12-21
Bonding Structure And Semiconductor Device Manufacturing Apparatus
App 20090173449 - Nakamura; Taichi ;   et al.
2009-07-09
Bonding Structure And Semiconductor Device Manufacturing Apparatus
App 20090176065 - TAKEBAYASHI; Hiroshi ;   et al.
2009-07-09
Bonding Structure And Semiconductor Device Manufacturing Apparatus
App 20090173448 - FUJII; Tomoyuki ;   et al.
2009-07-09
Body Having A Junction And Method Of Manufacturing The Same
App 20090169726 - FUJII; Tomoyuki ;   et al.
2009-07-02
Bonding Material And Semiconductor Supporting Device
App 20080193741 - FUJII; Tomoyuki ;   et al.
2008-08-14
Joining structure between ceramic substrate and power supply connector
Grant 7,407,391 - Fujii August 5, 2
2008-08-05
Substrate Supporting Member
App 20080138645 - KAWAJIRI; Tetsuya ;   et al.
2008-06-12
Method of fabricating substrate placing stage
Grant 7,353,979 - Fujii , et al. April 8, 2
2008-04-08
Joined structures of ceramics
Grant 7,252,872 - Fujii , et al. August 7, 2
2007-08-07
Bonding member and electrostatic chuck
Grant 7,218,502 - Fujii , et al. May 15, 2
2007-05-15
Joining Structure Between Ceramic Substrate And Power Supply Connector
App 20070097603 - FUJII; Tomoyuki
2007-05-03
Joined body and manufacturing method for the same
App 20060182908 - Fujii; Tomoyuki
2006-08-17
Joined bodies and a method of producing the same
Grant 7,067,200 - Fujii , et al. June 27, 2
2006-06-27
Electrostatic chuck having bonded structure and method of manufacturing the same
Grant 7,019,956 - Fujii , et al. March 28, 2
2006-03-28
Substrate mounting apparatus and control method of substrate temperature
App 20060021705 - Imai; Yasuyoshi ;   et al.
2006-02-02
Method of fabricating substrate placing stage
App 20050118450 - Fujii, Tomoyuki ;   et al.
2005-06-02
Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials
Grant 6,869,689 - Fujii , et al. March 22, 2
2005-03-22
Semiconductor mounting system
Grant 6,831,307 - Fujii December 14, 2
2004-12-14
Bonding member and electrostatic chuck
App 20040240142 - Fujii, Tomoyuki ;   et al.
2004-12-02
Joined article of a supporting member for a semiconductor wafer and a method of producing the same
Grant 6,820,795 - Fujii November 23, 2
2004-11-23
Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials
App 20040209108 - Fujii, Tomoyuki ;   et al.
2004-10-21
Joined structures of ceramics
App 20040146737 - Fujii, Tomoyuki ;   et al.
2004-07-29
Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials
Grant 6,756,132 - Fujii , et al. June 29, 2
2004-06-29
Joined bodies and a method of producing the same
App 20040016792 - Fujii, Tomoyuki ;   et al.
2004-01-29
Semiconductor mounting system
App 20030178638 - Fujii, Tomoyuki
2003-09-25
Ceramics joint structure and method of producing the same
Grant 6,617,514 - Ushikoshi , et al. September 9, 2
2003-09-09
Joined article of a supporting member for a semiconductor wafer and a method of producing the same
App 20030047589 - Fujii, Tomoyuki
2003-03-13
Electrostatic chuck having bonded structure and method of manufacturing the same
App 20020139473 - Fujii, Tomoyuki ;   et al.
2002-10-03
Joined structures of metal terminals and ceramic members, joined structures of metal members and ceramic members, and adhesive materials
App 20020139563 - Fujii, Tomoyuki ;   et al.
2002-10-03
Joint body of ceramic member and metal member and method of producing the same
Grant 6,436,545 - Tanahashi , et al. August 20, 2
2002-08-20
Method of manufacturing joint body
Grant 6,328,198 - Ohashi , et al. December 11, 2
2001-12-11
Joined structure of ceramic heater and electrode terminal, and joining method therefor
Grant 6,291,804 - Fujii September 18, 2
2001-09-18
Joined articles, corrosion-resistant joining materials and process for producing joined articles
Grant 6,106,960 - Fujii , et al. August 22, 2
2000-08-22
Joint structure of metal member and ceramic member and method of producing the same
Grant 6,057,513 - Ushikoshi , et al. May 2, 2
2000-05-02
Joined ceramic structures and a process for the production thereof
Grant 6,020,076 - Fujii , et al. February 1, 2
2000-02-01
Ceramic susceptor with embedded metal electrode and brazing material connection
Grant 5,817,406 - Cheung , et al. October 6, 1
1998-10-06
Ceramics joined body and method of joining ceramics
Grant 5,794,838 - Ushikoshi , et al. August 18, 1
1998-08-18
Connected body comprising a gas separator and a metal, and apparatus for separating hydrogen gas from a mixed gas
Grant 5,518,530 - Sakai , et al. May 21, 1
1996-05-21

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