loadpatents
name:-0.19904708862305
name:-0.84356093406677
name:-0.0028378963470459
Fujii; Masanao Patent Filings

Fujii; Masanao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fujii; Masanao.The latest application filed is for "task circumstance processing device and method".

Company Profile
1.16.21
  • Fujii; Masanao - Kawasaki JP
  • Fujii; Masanao - Hiroshima N/A JP
  • Fujii; Masanao - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Task circumstance processing device and method
Grant 10,346,202 - Fujii , et al. July 9, 2
2019-07-09
Task Circumstance Processing Device And Method
App 20170286160 - Fujii; Masanao ;   et al.
2017-10-05
Taper coupling structure and rotating machine
Grant 8,915,666 - Yanagisawa , et al. December 23, 2
2014-12-23
Taper Coupling Structure And Rotating Machine
App 20120093579 - Yanagisawa; Eiichi ;   et al.
2012-04-19
Method of heating superposed components and heating apparatus therefor
Grant 8,153,941 - Fujii , et al. April 10, 2
2012-04-10
Micro component removing method
Grant 7,963,434 - Yamamoto , et al. June 21, 2
2011-06-21
Optical module
Grant 7,824,111 - Okada , et al. November 2, 2
2010-11-02
Micro Component Removing Method
App 20100213248 - YAMAMOTO; Keiichi ;   et al.
2010-08-26
Micro component removing apparatus
Grant 7,753,251 - Yamamoto , et al. July 13, 2
2010-07-13
Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method
Grant 7,717,317 - Fujii , et al. May 18, 2
2010-05-18
Optical module producing method and apparatus
Grant 7,691,662 - Okada , et al. April 6, 2
2010-04-06
Optical module producing method and apparatus
App 20080102544 - Okada; Toru ;   et al.
2008-05-01
Optical Module
App 20080101746 - Okada; Toru ;   et al.
2008-05-01
Micro Component Removing Method And Micro Component Removing Apparatus
App 20080099536 - YAMAMOTO; Keiichi ;   et al.
2008-05-01
Method of producing a micro-actuator
Grant 7,356,894 - Fujii , et al. April 15, 2
2008-04-15
Ball Capturing Apparatus, Solder Ball Disposing Apparatus, Ball Capturing Method, And Solder Ball Disposing Method
App 20080020561 - FUJII; Masanao ;   et al.
2008-01-24
Method and system for fabricating a semiconductor device
App 20070281395 - Kira; Hidehiko ;   et al.
2007-12-06
Method and system for fabricating a semiconductor device
App 20070261233 - Kira; Hidehiko ;   et al.
2007-11-15
Component supplying apparatus and component supplying method
App 20070102441 - Fujii; Masanao ;   et al.
2007-05-10
Design support system
Grant 7,133,733 - Okada , et al. November 7, 2
2006-11-07
Parts mounting and assembling apparatus
Grant 7,111,390 - Shimamura , et al. September 26, 2
2006-09-26
Soldering method and apparatus
App 20060169750 - Tanaka; Hisao ;   et al.
2006-08-03
Display
Grant 6,903,876 - Okada , et al. June 7, 2
2005-06-07
Micro-actuator and method of producing the same
App 20050104477 - Fujii, Masanao ;   et al.
2005-05-19
Design support system
App 20050038537 - Okada, Toru ;   et al.
2005-02-17
Parts mounting and assembling apparatus
App 20050034960 - Shimamura, Koichi ;   et al.
2005-02-17
Method of producing a micro-actuator
Grant 6,848,154 - Fujii , et al. February 1, 2
2005-02-01
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method
Grant 6,744,183 - Kitajima , et al. June 1, 2
2004-06-01
Micro-actuator and method of producing the same
Grant 6,653,761 - Fujii , et al. November 25, 2
2003-11-25
Micro-actuator and method of producing the same
App 20030184191 - Fujii, Masanao ;   et al.
2003-10-02
Method of heating superposed components and heating apparatus therefor
App 20030173411 - Fujii, Masanao ;   et al.
2003-09-18
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method
App 20030137223 - Kitajima, Masayuki ;   et al.
2003-07-24
Display
App 20030103169 - Okada, Toru ;   et al.
2003-06-05
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method
App 20020074902 - Kitajima, Masayuki ;   et al.
2002-06-20
Method of assembling micro-actuator
App 20020059717 - Okada, Toru ;   et al.
2002-05-23
Micro-actuator and method of producing the same
App 20020050767 - Fujii, Masanao ;   et al.
2002-05-02

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