| Patent | Date |
|---|
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
App 20220285283 - Fuergut; Edward ; et al. | 2022-09-08 |
Silicon carbide device and method for forming a silicon carbide device
Grant 11,367,683 - Fuergut , et al. June 21, 2 | 2022-06-21 |
Package and lead frame design for enhanced creepage and clearance
Grant 11,348,866 - Gan , et al. May 31, 2 | 2022-05-31 |
Package With Electrically Insulated Carrier And At Least One Step On Encapsulant
App 20220157682 - FUERGUT; Edward ; et al. | 2022-05-19 |
Molded Semiconductor Package With Dual Integrated Heat Spreaders
App 20220157686 - Joanna Chye; Jo Ean ; et al. | 2022-05-19 |
Multi-Device Semiconductor Chip with Electrical Access to Devices at Either Side
App 20220149038 - Fuergut; Edward ; et al. | 2022-05-12 |
Linear Spacer For Spacing A Carrier Of A Package
App 20220148934 - Fuergut; Edward ; et al. | 2022-05-12 |
Semiconductor Device Module Having Vertical Metallic Contacts And A Method For Fabricating The Same
App 20220102311 - Fuergut; Edward ; et al. | 2022-03-31 |
Semiconductor Package Having A Chip Carrier With A Pad Offset Feature
App 20220102263 - Ng; Chee Yang ; et al. | 2022-03-31 |
Semiconductor Device Package Comprising a Thermal Interface Material with Improved Handling Properties
App 20220013433 - Mayer; Martin ; et al. | 2022-01-13 |
Package and Lead Frame Design for Enhanced Creepage and Clearance
App 20210391246 - Gan; Thai Kee ; et al. | 2021-12-16 |
Semiconductor Package with Signal Distribution Element
App 20210384111 - Voss; Stephan ; et al. | 2021-12-09 |
Method for fabricating an electronic module via compression molding
Grant 11,189,542 - Fuergut , et al. November 30, 2 | 2021-11-30 |
Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
Grant 11,189,537 - Hosseini , et al. November 30, 2 | 2021-11-30 |
Semiconductor Device Including An Embedded Semiconductor Die And A Method For Fabricating The Same
App 20210249334 - Fuergut; Edward ; et al. | 2021-08-12 |
Additive Manufacturing of a Frontside or Backside Interconnect of a Semiconductor Die
App 20210225798 - Fuergut; Edward ; et al. | 2021-07-22 |
Electronic Module Including A Semiconductor Package Connected To A Fluid Heatsink
App 20210225734 - Fuergut; Edward ; et al. | 2021-07-22 |
Electrically insulating thermal interface on the discontinuity of an encapsulation structure
Grant 11,049,790 - Fuergut , et al. June 29, 2 | 2021-06-29 |
Semiconductor module
Grant 11,040,872 - Waechter , et al. June 22, 2 | 2021-06-22 |
Power Semiconductor Device and Method
App 20210066495 - Fuergut; Edward ; et al. | 2021-03-04 |
Electronic Devices Including Electrically Insulated Load Electrodes
App 20210043555 - Fuergut; Edward ; et al. | 2021-02-11 |
Systems and methods using an RF circuit on isolating material
Grant 10,916,515 - Ahrens , et al. February 9, 2 | 2021-02-09 |
Thermal interface material having defined thermal, mechanical and electric properties
App 20210020541 - KASZTELAN; Christian ; et al. | 2021-01-21 |
Semiconductor Package and Method of Forming a Semiconductor Package
App 20200365548 - Fuergut; Edward ; et al. | 2020-11-19 |
Electronic Module Comprising a Semiconductor Package with Integrated Clip and Fastening Element
App 20200294885 - Fuergut; Edward ; et al. | 2020-09-17 |
Electronic Module with Improved Heat Dissipation and Fabrication Thereof
App 20200266121 - Fuergut; Edward ; et al. | 2020-08-20 |
Method of manufacturing a package having a power semiconductor chip
Grant 10,734,250 - Basler , et al. | 2020-08-04 |
Power package having multiple mold compounds
Grant 10,685,909 - Fuergut , et al. | 2020-06-16 |
Method of reducing a sheet resistance in an electronic device, and an electronic device
Grant 10,573,533 - Fuergut , et al. Feb | 2020-02-25 |
Method For Producing A Semiconductor Module
App 20200039820 - Waechter; Claus ; et al. | 2020-02-06 |
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
App 20200013723 - Fuergut; Edward ; et al. | 2020-01-09 |
Systems And Methods Using An Rf Circuit On Isolating Material
App 20200006262 - Ahrens; Carsten ; et al. | 2020-01-02 |
Method for fabricating a semiconductor chip panel
Grant 10,483,133 - Porwol , et al. Nov | 2019-11-19 |
Method for producing a semiconductor module
Grant 10,435,292 - Waechter , et al. O | 2019-10-08 |
Electronic module comprising a plurality of encapsulation layers and a method for producing it
Grant 10,418,313 - Fuergut , et al. Sept | 2019-09-17 |
Semiconductor device having die pads with exposed surfaces
Grant 10,373,895 - Fuergut , et al. | 2019-08-06 |
Semiconductor devices with improved thermal and electrical performance
Grant 10,373,897 - Otremba , et al. | 2019-08-06 |
Method for manufacturing an arrangement including a chip carrier notch
Grant 10,361,138 - Ledutke , et al. | 2019-07-23 |
Spatially selective roughening of encapsulant to promote adhesion with functional structure
Grant 10,347,554 - Santos , et al. July 9, 2 | 2019-07-09 |
Method of Manufacturing a Package Having a Power Semiconductor Chip
App 20190198355 - Basler; Thomas ; et al. | 2019-06-27 |
Power Package Having Multiple Mold Compounds
App 20190157190 - Fuergut; Edward ; et al. | 2019-05-23 |
Method of manufacturing a semiconductor power package
Grant 10,256,119 - Basler , et al. | 2019-04-09 |
Method Of Reducing A Sheet Resistance In An Electronic Device, And An Electronic Device
App 20190013210 - Fuergut; Edward ; et al. | 2019-01-10 |
Attaching chip attach medium to already encapsulated electronic chip
Grant 10,177,112 - Mahler , et al. J | 2019-01-08 |
An Electronic Device Package
App 20180350780 - Fuergut; Edward ; et al. | 2018-12-06 |
MEMS device
Grant 10,125,012 - Fuergut , et al. November 13, 2 | 2018-11-13 |
Method of manufacturing a semiconductor component and semiconductor component
Grant 10,121,690 - Meyer-Berg , et al. November 6, 2 | 2018-11-06 |
Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
Grant 10,115,646 - Hoegerl , et al. October 30, 2 | 2018-10-30 |
Method for producing a power semiconductor module
Grant 10,096,584 - Hohlfeld , et al. October 9, 2 | 2018-10-09 |
Arrangement of multiple power semiconductor chips and method of manufacturing the same
Grant 10,049,962 - Meyer-Berg , et al. August 14, 2 | 2018-08-14 |
Method for Fabricating a Semiconductor Chip Panel
App 20180226276 - Porwol; Daniel ; et al. | 2018-08-09 |
Electronic device package having a dielectric layer and an encapsulant
Grant 10,043,782 - Fuergut , et al. August 7, 2 | 2018-08-07 |
Electronic module comprising fluid cooling channel and method of manufacturing the same
Grant 10,037,972 - Fuergut , et al. July 31, 2 | 2018-07-31 |
Method of producing a semiconductor device and a semiconductor device
Grant 10,020,285 - Fuergut , et al. July 10, 2 | 2018-07-10 |
Semiconductor Devices Including Exposed Opposing Die Pads
App 20180166366 - Fuergut; Edward ; et al. | 2018-06-14 |
Method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Grant 9,984,928 - Hohlfeld , et al. May 29, 2 | 2018-05-29 |
Power device with overvoltage arrester
Grant 9,979,187 - Basler , et al. May 22, 2 | 2018-05-22 |
Arrangement and method for manufacturing the same
Grant 9,966,277 - Zundel , et al. May 8, 2 | 2018-05-08 |
Method for fabricating a semiconductor chip panel
Grant 9,953,846 - Porwol , et al. April 24, 2 | 2018-04-24 |
Method of Manufacturing a Semiconductor Power Package
App 20180102262 - Basler; Thomas ; et al. | 2018-04-12 |
Functionalized interface structure
Grant 9,922,910 - Otremba , et al. March 20, 2 | 2018-03-20 |
Method For Producing A Semiconductor Module
App 20180022601 - Waechter; Claus ; et al. | 2018-01-25 |
Semiconductor power package and method of manufacturing the same
Grant 9,837,288 - Basler , et al. December 5, 2 | 2017-12-05 |
Electronic Device Package Having a Dielectric Layer and an Encapsulant
App 20170287880 - Fuergut; Edward ; et al. | 2017-10-05 |
Spatially selective roughening of encapsulant to promote adhesion with functional structure
App 20170271229 - SANTOS; Norbert Joson ; et al. | 2017-09-21 |
Electronic device package including metal blocks
Grant 9,768,037 - Palm , et al. September 19, 2 | 2017-09-19 |
Arrangement Having A Plurality Of Chips And A Chip Carrier, And A Processing Arrangement
App 20170263480 - Ledutke; Michael ; et al. | 2017-09-14 |
Attaching chip attach medium to already encapsulated electronic chip
App 20170221857 - MAHLER; Joachim ; et al. | 2017-08-03 |
Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
Grant 9,698,070 - Ledutke , et al. July 4, 2 | 2017-07-04 |
Electronic component and methods of manufacturing the same
App 20170178993 - MEYER; Thorsten ; et al. | 2017-06-22 |
Semiconductor Devices With Improved Thermal And Electrical Performance
App 20170179009 - Otremba; Ralf ; et al. | 2017-06-22 |
Semiconductor device with encapsulant
Grant 9,666,499 - Mahler , et al. May 30, 2 | 2017-05-30 |
Power Device With Overvoltage Arrester
App 20170141567 - Basler; Thomas ; et al. | 2017-05-18 |
Method for Producing a Power Semiconductor Module
App 20170125395 - Hohlfeld; Olaf ; et al. | 2017-05-04 |
Thermal interface material having defined thermal, mechanical and electric properties
App 20170117208 - KASZTELAN; Christian ; et al. | 2017-04-27 |
Thinning in package using separation structure as stop
Grant 9,627,287 - Engelhardt , et al. April 18, 2 | 2017-04-18 |
Method for Producing a Number of Chip Assemblies and Method for Producing a Semiconductor Arrangement
App 20170098580 - Hohlfeld; Olaf ; et al. | 2017-04-06 |
Functionalized interface structure
App 20170098598 - OTREMBA; Ralf ; et al. | 2017-04-06 |
Arrangement And Method For Manufacturing The Same
App 20170076961 - Zundel; Markus ; et al. | 2017-03-16 |
Apparatus comprising and a method for manufacturing an embedded MEMS device
Grant 9,593,009 - Fuergut , et al. March 14, 2 | 2017-03-14 |
Spring contact for semiconductor chip
Grant 9,595,502 - Hohlfeld , et al. March 14, 2 | 2017-03-14 |
Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Grant 9,589,859 - Beer , et al. March 7, 2 | 2017-03-07 |
System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille
Grant 9,584,889 - Escher-Poeppel , et al. February 28, 2 | 2017-02-28 |
Method for Fabricating a Semiconductor Chip Panel
App 20160379847 - Porwol; Daniel ; et al. | 2016-12-29 |
Electrically insulating thermal interface on the discontinuity of an encapsulation structure
App 20160372399 - FUERGUT; Edward ; et al. | 2016-12-22 |
Electronic Devices with Increased Creepage Distances
App 20160365296 - Otremba; Ralf ; et al. | 2016-12-15 |
Semiconductor Arrangement, Semiconductor System And Method Of Forming A Semiconductor Arrangement
App 20160365295 - HOEGERL; Juergen ; et al. | 2016-12-15 |
Semiconductor Power Package and Method of Manufacturing the Same
App 20160358838 - Basler; Thomas ; et al. | 2016-12-08 |
Arrangement Of Multiple Power Semiconductor Chips And Method Of Manufacturing The Same
App 20160358886 - Meyer-Berg; Georg ; et al. | 2016-12-08 |
Method of reducing a sheet resistance in an electronic device, and an electronic device
App 20160336226 - FUERGUT; Edward ; et al. | 2016-11-17 |
Integrated circuit and method of manufacturing an integrated circuit
Grant 9,496,228 - Fuergut , et al. November 15, 2 | 2016-11-15 |
Electronic module comprising fluid cooling channel and method of manufacturing the same
App 20160322333 - FUERGUT; Edward ; et al. | 2016-11-03 |
Method for fabricating a semiconductor chip panel
Grant 9,455,160 - Porwol , et al. September 27, 2 | 2016-09-27 |
Electrically insulating thermal interface on the discontinuity of an encapsulation structure
Grant 9,437,513 - Fuergut , et al. September 6, 2 | 2016-09-06 |
Method for manufacturing a chip arrangement
Grant 9,412,626 - Otremba , et al. August 9, 2 | 2016-08-09 |
Integrated Circuit And Method Of Manufacturing An Integrated Circuit
App 20160211226 - Fuergut; Edward ; et al. | 2016-07-21 |
Method for testing semiconductor chips or semiconductor chip modules
Grant 9,395,404 - Fuergut , et al. July 19, 2 | 2016-07-19 |
Method of manufacturing a semiconductor component and semiconductor component
App 20160181138 - Meyer-Berg; Georg ; et al. | 2016-06-23 |
Semiconductor device including a dielectric material
Grant 9,355,881 - Goller , et al. May 31, 2 | 2016-05-31 |
Chip arrangement and method of manufacturing the same
Grant 9,349,680 - Mahler , et al. May 24, 2 | 2016-05-24 |
Semiconductor Arrangement, Method For Producing A Semiconductor Chip
App 20160126211 - Hohlfeld; Olaf ; et al. | 2016-05-05 |
Systems and Methods Using an RF Circuit on Isolating Material
App 20160118353 - Ahrens; Carsten ; et al. | 2016-04-28 |
Semiconductor device including a polymer disposed on a carrier
Grant 9,318,473 - Mahler , et al. April 19, 2 | 2016-04-19 |
Electronic Module Comprising a Plurality of Encapsulation Layers and a Method for Producing It
App 20160099207 - Fuergut; Edward ; et al. | 2016-04-07 |
Method of Producing a Semiconductor Device and a Semiconductor Device
App 20160071819 - Fuergut; Edward ; et al. | 2016-03-10 |
Method For Manufacturing A Chip Arrangement
App 20160064255 - Otremba; Ralf ; et al. | 2016-03-03 |
Removable indicator structure in electronic chips of a common substrate for process adjustment
Grant 9,275,916 - Fuergut , et al. March 1, 2 | 2016-03-01 |
Methods for manufacturing a chip package
Grant 9,230,894 - Fuergut , et al. January 5, 2 | 2016-01-05 |
Arrangement and method for manufacturing the same
Grant 9,196,568 - Fischer , et al. November 24, 2 | 2015-11-24 |
Electronic Device Package Including Metal Blocks
App 20150332938 - Palm; Petteri ; et al. | 2015-11-19 |
Chip arrangements and methods for manufacturing a chip arrangement
Grant 9,184,066 - Otremba , et al. November 10, 2 | 2015-11-10 |
Method for fabricating an electronic component
Grant 9,171,804 - Meyer-Berg , et al. October 27, 2 | 2015-10-27 |
Method for manufacturing an electronic module and an electronic module
Grant 9,129,959 - Fuergut , et al. September 8, 2 | 2015-09-08 |
Method of manufacturing a semiconductor device
Grant 9,123,806 - Fuergut , et al. September 1, 2 | 2015-09-01 |
Semiconductor Device Including A Dielectric Material
App 20150235890 - Goller; Bernhard ; et al. | 2015-08-20 |
Arrangement And Method For Manufacturing The Same
App 20150221523 - Zundel; Markus ; et al. | 2015-08-06 |
Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
Grant 9,082,767 - Mahler , et al. July 14, 2 | 2015-07-14 |
Chip arrangement and method of manufacturing the same
App 20150194377 - MAHLER; Joachim ; et al. | 2015-07-09 |
Semiconductor module and a method for fabrication thereof by extended embedding technologies
Grant 9,064,869 - Hoegerl , et al. June 23, 2 | 2015-06-23 |
Electronic component with electronic chip between redistribution structure and mounting structure
App 20150145111 - MENGEL; Manfred ; et al. | 2015-05-28 |
Semiconductor package and methods of formation thereof
Grant 9,040,346 - Nikitin , et al. May 26, 2 | 2015-05-26 |
Chip arrangement and a method of manufacturing a chip arrangement
Grant 9,041,226 - Steiner , et al. May 26, 2 | 2015-05-26 |
Thinning in package using separation structure as stop
App 20150108666 - ENGELHARDT; Manfred ; et al. | 2015-04-23 |
Electrically insulating thermal interface on the discontinuity of an encapsulation structure
App 20150102479 - FUERGUT; Edward ; et al. | 2015-04-16 |
Arrangement And Method For Manufacturing The Same
App 20150091183 - Fischer; Thomas ; et al. | 2015-04-02 |
MEMS Device
App 20150061045 - Fuergut; Edward ; et al. | 2015-03-05 |
Packaged MEMS Device
App 20150061048 - Escher-Poeppel; Irmgard ; et al. | 2015-03-05 |
Semiconductor Module and a Method for Fabrication Thereof By Extended Embedding Technologies
App 20150054159 - Hoegerl; Juergen ; et al. | 2015-02-26 |
Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies and Method for Producing a Semiconductor Arrangement
App 20150054166 - Beer; Gottfried ; et al. | 2015-02-26 |
Apparatus Comprising and a Method for Manufacturing an Embedded MEMS Device
App 20150028436 - Fuergut; Edward ; et al. | 2015-01-29 |
Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
Grant 8,901,739 - Fuergut , et al. December 2, 2 | 2014-12-02 |
Method of Manufacturing a Semiconductor Device
App 20140327071 - Fuergut; Edward ; et al. | 2014-11-06 |
Removable indicator structure in electronic chips of a common substrate for process adjustment
App 20140327003 - FUERGUT; Edward ; et al. | 2014-11-06 |
Apparatus comprising and a method for manufacturing an embedded MEMS device
Grant 8,872,288 - Fuergut , et al. October 28, 2 | 2014-10-28 |
Arrangement Having A Plurality Of Chips And A Chip Carrier, And A Processing Arrangement
App 20140306356 - Ledutke; Michael ; et al. | 2014-10-16 |
Chip Arrangement And A Method Of Manufacturing A Chip Arrangement
App 20140264950 - Steiner; Rainer ; et al. | 2014-09-18 |
Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier
Grant 8,815,651 - Fuergut , et al. August 26, 2 | 2014-08-26 |
Semiconductor packages and methods of formation thereof
Grant 8,786,111 - Fuergut , et al. July 22, 2 | 2014-07-22 |
Method for Fabricating a Semiconductor Chip Panel
App 20140197551 - Porwol; Daniel ; et al. | 2014-07-17 |
Semiconductor package and methods of formation thereof
Grant 8,778,733 - Fuergut , et al. July 15, 2 | 2014-07-15 |
Method for Testing Semiconductor Chips or Semiconductor Chip Modules
App 20140167800 - Fuergut; Edward ; et al. | 2014-06-19 |
Method of manufacturing a semiconductor device
Grant 8,749,029 - Fuergut , et al. June 10, 2 | 2014-06-10 |
Embedded Integrated Circuit Package And Method For Manufacturing An Embedded Integrated Circuit Package
App 20140151862 - Mahler; Joachim ; et al. | 2014-06-05 |
Embedded Chip Package, A Chip Package, And A Method For Manufacturing An Embedded Chip Package
App 20140151701 - Fuergut; Edward ; et al. | 2014-06-05 |
Chip Arrangements And Methods For Manufacturing A Chip Arrangement
App 20140138803 - Otremba; Ralf ; et al. | 2014-05-22 |
Method for Fabricating an Electronic Component
App 20140138843 - Meyer-Berg; Georg ; et al. | 2014-05-22 |
Methods for filling a contact hole in a chip package arrangement and chip package arrangements
Grant 8,728,873 - Alles , et al. May 20, 2 | 2014-05-20 |
Semiconductor Device With Encapsulant
App 20140117531 - MAHLER; Joachim ; et al. | 2014-05-01 |
Electric device package comprising a laminate and method of making an electric device package comprising a laminate
Grant 8,692,361 - Mahler , et al. April 8, 2 | 2014-04-08 |
Method for Manufacturing an Electronic Module and an Electronic Module
App 20140054780 - Fuergut; Edward ; et al. | 2014-02-27 |
Apparatus Comprising and a Method for Manufacturing an Embedded MEMS Device
App 20140042565 - Fuergut; Edward ; et al. | 2014-02-13 |
Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
Grant 8,648,456 - Mahler , et al. February 11, 2 | 2014-02-11 |
Electric Device Package Comprising a Laminate and Method of Making an Electric Device Package Comprising a Laminate
App 20140027892 - Mahler; Joachim ; et al. | 2014-01-30 |
Embedded Integrated Circuit Package And Method For Manufacturing An Embedded Integrated Circuit Package
App 20140021638 - Mahler; Joachim ; et al. | 2014-01-23 |
Methods For Manufacturing A Chip Package, A Method For Manufacturing A Wafer Level Package, And A Compression Apparatus
App 20130337614 - Fuergut; Edward ; et al. | 2013-12-19 |
Semiconductor Packages and Methods of Formation Thereof
App 20130299848 - Fuergut; Edward ; et al. | 2013-11-14 |
Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer
Grant 8,580,070 - Fuergut , et al. November 12, 2 | 2013-11-12 |
Semiconductor Package and Methods of Formation Thereof
App 20130292684 - Nikitin; Ivan ; et al. | 2013-11-07 |
Methods For Manufacturing A Chip Package
App 20130295720 - Fuergut; Edward ; et al. | 2013-11-07 |
Chip Embedded Packages And Methods For Forming A Chip Embedded Package
App 20130292852 - FUERGUT; Edward ; et al. | 2013-11-07 |
Semiconductor device having a semiconductor chip, and method for the production thereof
Grant 8,574,966 - Bauer , et al. November 5, 2 | 2013-11-05 |
Manufacturing Method for Semiconductor Device and Semiconductor Device
App 20130277824 - Mahler; Joachim ; et al. | 2013-10-24 |
Circuit Package, An Electronic Circuit Package, And Methods For Encapsulating An Electronic Circuit
App 20130249069 - Hosseini; Khalil ; et al. | 2013-09-26 |
Semiconductor Package and Methods of Formation Thereof
App 20130241077 - Fuergut; Edward ; et al. | 2013-09-19 |
Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
Grant 8,524,542 - Brunnbauer , et al. September 3, 2 | 2013-09-03 |
Method of Manufacturing a Semiconductor Device
App 20130207243 - Fuergut; Edward ; et al. | 2013-08-15 |
Device And Method For Manufacturing An Electronic Device
App 20130168870 - Fuergut; Edward ; et al. | 2013-07-04 |
Molding Apparatus and a Method for Molding
App 20130161867 - Fuergut; Edward ; et al. | 2013-06-27 |
Molding compound adhesion for map-molded flip-chip
Grant 8,450,148 - Mahler , et al. May 28, 2 | 2013-05-28 |
Heat treatment for a panel and apparatus for carrying out the heat treatment method
Grant 8,431,063 - Beer , et al. April 30, 2 | 2013-04-30 |
Mold method
Grant 8,394,308 - Brunnbauer , et al. March 12, 2 | 2013-03-12 |
Blank Including A Composite Panel With Semiconductor Chips And Plastic Package Molding Compound And Method And Mold For Producing The Same
App 20120286434 - Brunnbauer; Markus ; et al. | 2012-11-15 |
Method of manufacturing semiconductor devices
Grant 8,288,207 - Mahler , et al. October 16, 2 | 2012-10-16 |
Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
Grant 8,247,897 - Brunnbauer , et al. August 21, 2 | 2012-08-21 |
Mold Apparatus And Method
App 20120202319 - Brunnbauer; Markus ; et al. | 2012-08-09 |
Semiconductor Device Having A Semiconductor Chip, And Method For The Production Thereof
App 20120178218 - Bauer; Michael ; et al. | 2012-07-12 |
Semiconductor device having a semiconductor chip, and method for the production thereof
Grant 8,168,472 - Bauer , et al. May 1, 2 | 2012-05-01 |
Mold apparatus and method
Grant 8,158,046 - Brunnbauer , et al. April 17, 2 | 2012-04-17 |
Method for fabricating a semiconductor chip panel
Grant 8,148,210 - Fuergut , et al. April 3, 2 | 2012-04-03 |
Methods for filling a contact hole in a chip package arrangement and chip package arrangements
App 20120061845 - Alles; Benjamin ; et al. | 2012-03-15 |
Method For Fabricating A Semiconductor Chip Panel
App 20120064673 - Fuergut; Edward ; et al. | 2012-03-15 |
Semiconductor Device Having A Semiconductor Chip, And Method For The Production Thereof
App 20120028382 - Bauer; Michael ; et al. | 2012-02-02 |
Semiconductor device having a semiconductor chip, and method for the production thereof
Grant 8,062,928 - Bauer , et al. November 22, 2 | 2011-11-22 |
Semiconductor device
Grant 7,994,646 - Mahler , et al. August 9, 2 | 2011-08-09 |
Method Of Applying An Adhesive Layer On Thincut Semiconductor Chips Of A Semiconductor Wafer
App 20110155297 - Fuergut; Edward ; et al. | 2011-06-30 |
Electronic device
Grant 7,968,378 - Mahler , et al. June 28, 2 | 2011-06-28 |
Semiconductor Component And Method For Producing Semiconductor Components
App 20110133297 - FRANOSCH; Martin ; et al. | 2011-06-09 |
Reconfigured wafer alignment
Grant 7,943,423 - Pohl , et al. May 17, 2 | 2011-05-17 |
Semiconductor device having through contacts through a plastic housing composition and method for the production thereof
Grant 7,944,061 - Bauer , et al. May 17, 2 | 2011-05-17 |
Support with solder ball elements and a method for populating substrates with solder balls
Grant 7,935,622 - Bauer , et al. May 3, 2 | 2011-05-03 |
Manufacturing a semiconductor device via etching a semiconductor chip to a first layer
Grant 7,932,180 - Mahler , et al. April 26, 2 | 2011-04-26 |
Method of manufacturing a semiconductor device including etching to etch stop regions
Grant 7,923,350 - Mahler , et al. April 12, 2 | 2011-04-12 |
Encapsulation method
Grant 7,915,089 - Fuergut , et al. March 29, 2 | 2011-03-29 |
External contact material for external contacts of a semiconductor device and method of making the same
Grant 7,893,532 - Bauer , et al. February 22, 2 | 2011-02-22 |
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
Grant 7,883,993 - Fuergut , et al. February 8, 2 | 2011-02-08 |
Semiconductor device having an adhesion promoting layer and method for producing it
Grant 7,843,055 - Bauer , et al. November 30, 2 | 2010-11-30 |
Semiconductor Device Having A Semiconductor Chip, And Method For The Production Thereof
App 20100297792 - Bauer; Michael ; et al. | 2010-11-25 |
Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip
Grant 7,830,026 - Beer , et al. November 9, 2 | 2010-11-09 |
Semiconductor device with semiconductor device components embedded in a plastics composition
Grant 7,800,241 - Bauer , et al. September 21, 2 | 2010-09-21 |
Reconfigured Wafer Alignment
App 20100233831 - Pohl; Jens ; et al. | 2010-09-16 |
Semiconductor device having a semiconductor chip, and method for the production thereof
Grant 7,795,742 - Bauer , et al. September 14, 2 | 2010-09-14 |
Method Of Manufacturing Semiconductor Devices
App 20100210071 - Mahler; Joachim ; et al. | 2010-08-19 |
Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material
Grant 7,767,495 - Fuergut , et al. August 3, 2 | 2010-08-03 |
Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles
Grant 7,759,805 - Beer , et al. July 20, 2 | 2010-07-20 |
Semiconductor Device
App 20100148381 - Mahler; Joachim ; et al. | 2010-06-17 |
Composite board with semiconductor chips and plastic housing composition and method
Grant 7,732,242 - Brunnbauer , et al. June 8, 2 | 2010-06-08 |
Panel and semiconductor device having a composite plate with semiconductor chips
Grant 7,713,791 - Bauer , et al. May 11, 2 | 2010-05-11 |
Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof
Grant 7,709,379 - Bauer , et al. May 4, 2 | 2010-05-04 |
Sensor component and panel used for the production thereof
Grant 7,700,956 - Fuergut , et al. April 20, 2 | 2010-04-20 |
Method Of Manufacturing A Semiconductor Device Including Etching To Etch Stop Regions
App 20100059864 - Mahler; Joachim ; et al. | 2010-03-11 |
Producing thin integrated semiconductor devices
Grant 7,674,654 - Brunnbauer , et al. March 9, 2 | 2010-03-09 |
Semiconductor Device And Manufacturing Method
App 20100044885 - Fuergut; Edward ; et al. | 2010-02-25 |
Integrated circuit component with a surface-mount housing
Grant 7,663,218 - Bauer , et al. February 16, 2 | 2010-02-16 |
Manufacturing A Semiconductor Device Via Etching A Semiconductor Chip To A First Layer
App 20100001414 - Mahler; Joachim ; et al. | 2010-01-07 |
Semiconductor structure with a plastic housing and separable carrier plate
Grant 7,622,733 - Fuergut , et al. November 24, 2 | 2009-11-24 |
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film
Grant 7,585,701 - Beer , et al. September 8, 2 | 2009-09-08 |
Smart card, smart card module, and a method for production of a smart card module
Grant 7,575,173 - Fuergut , et al. August 18, 2 | 2009-08-18 |
Electronic Device
App 20090194882 - Mahler; Joachim ; et al. | 2009-08-06 |
Semiconductor device with a wiring substrate and method for producing the same
Grant 7,545,047 - Bauer , et al. June 9, 2 | 2009-06-09 |
Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
Grant 7,528,054 - Fuergut , et al. May 5, 2 | 2009-05-05 |
Electronic component and a panel
Grant 7,524,699 - Fuergut , et al. April 28, 2 | 2009-04-28 |
Singulating surface-mountable semiconductor devices and fitting external contacts to said devices
Grant 7,485,493 - Fuergut , et al. February 3, 2 | 2009-02-03 |
Apparatus and method for producing an article by means of a molding technique
Grant 7,481,641 - Fuergut , et al. January 27, 2 | 2009-01-27 |
Method for producing through-contacts and a semiconductor component with through-contacts
Grant 7,482,198 - Bauer , et al. January 27, 2 | 2009-01-27 |
Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof
App 20080315399 - Bauer; Michael ; et al. | 2008-12-25 |
Encapsulation Method And Apparatus
App 20080254575 - Fuergut; Edward ; et al. | 2008-10-16 |
Semiconductor stack block comprising semiconductor chips and methods for producing the same
Grant 7,429,782 - Brunnbauer , et al. September 30, 2 | 2008-09-30 |
Semiconductor device with a recessed bond pad
Grant 7,408,241 - Bauer , et al. August 5, 2 | 2008-08-05 |
Electronic module having plug contacts and method for producing it
Grant 7,391,103 - Fuergut , et al. June 24, 2 | 2008-06-24 |
Molding compound adhesion for map-molded flip-chip
App 20080142992 - Mahler; Joachim ; et al. | 2008-06-19 |
Semiconductor Device with Plastic Housing Composition and Method for Producing the Same
App 20080142932 - Beer; Gottfried ; et al. | 2008-06-19 |
Integrated Circuit Component with a Surface-Mount Housing and Method for Producing the Same
App 20080029874 - Bauer; Michael ; et al. | 2008-02-07 |
Producing Thin Integrated Semiconductor Devices
App 20070278653 - Brunnbauer; Markus ; et al. | 2007-12-06 |
Panel And Semiconductor Device Having A Structure With A Low-k Dielectric
App 20070249102 - Brunnbauer; Markus ; et al. | 2007-10-25 |
Semiconductor Device Having An Adhesion Promoting Layer And Method For Producing It
App 20070235857 - Bauer; Michael ; et al. | 2007-10-11 |
Mold Apparatus And Method
App 20070235897 - Brunnbauer; Markus ; et al. | 2007-10-11 |
Singulating Surface-Mountable Semiconductor Devices and Fitting External Contacts to Said Devices
App 20070232024 - Fuergut; Edward ; et al. | 2007-10-04 |
Blank Including A Composite Panel With Semiconductor Chips And Plastic Package Molding Compound And Method And Mold For Producing The Same
App 20070216004 - Brunnbauer; Markus ; et al. | 2007-09-20 |
Composite Board With Semiconductor Chips And Plastic Housing Composition And Method
App 20070205513 - Brunnbauer; Markus ; et al. | 2007-09-06 |
Semiconductor Component And Method For Producing Semiconductor Components
App 20070182029 - Franosch; Martin ; et al. | 2007-08-09 |
Apparatus And Method For Producing An Article By Means Of A Molding Technique
App 20070178185 - Fuergut; Edward ; et al. | 2007-08-02 |
Semiconductor Structure with a Plastic Housing and Separable Carrier Plate
App 20070145555 - Fuergut; Edward ; et al. | 2007-06-28 |
Sensor component and panel used for the production thereof
App 20070128754 - Fuergut; Edward ; et al. | 2007-06-07 |
Semiconductor device with a wiring substrate and method for producing the same
App 20070126122 - Bauer; Michael ; et al. | 2007-06-07 |
Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof
App 20070113305 - Bauer; Michael ; et al. | 2007-05-17 |
Heat treatment for a panel and apparatus for carrying out the heat treatment method
App 20070094982 - Beer; Gottfried ; et al. | 2007-05-03 |
Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
App 20070096305 - Fuergut; Edward ; et al. | 2007-05-03 |
Method for producing through-contacts and a semiconductor component with through-contacts
App 20070099345 - Bauer; Michael ; et al. | 2007-05-03 |
Semiconductor Device Having A Semiconductor Chip, And Method For The Production Thereof
App 20070085216 - Bauer; Michael ; et al. | 2007-04-19 |
Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
Grant 7,202,107 - Fuergut , et al. April 10, 2 | 2007-04-10 |
Semiconductor device with plastic housing composition and method for producing the same
App 20070069353 - Beer; Gottfried ; et al. | 2007-03-29 |
External contact material for external contacts of a semiconductor device and method of making the same
App 20070057372 - Bauer; Michael ; et al. | 2007-03-15 |
Support with solder ball elements and a method for populating substrates with solder balls
App 20070052112 - Bauer; Michael ; et al. | 2007-03-08 |
Semiconductor stack block comprising semiconductor chips and methods for producing the same
App 20070023883 - Brunnbauer; Markus ; et al. | 2007-02-01 |
Semiconductor device with semiconductor device components embedded in a plastics composition
App 20070001319 - Bauer; Michael ; et al. | 2007-01-04 |
Optoelectronic semiconductor assembly with an optically transparent cover, and a method for producing optoelectronic semiconductor assembly with an optically transparent cover
App 20060273437 - Beer; Gottfried ; et al. | 2006-12-07 |
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film
App 20060273469 - Beer; Gottfried ; et al. | 2006-12-07 |
Panel and semiconductor device having a composite plate with semiconductor chips
App 20060265860 - Bauer; Michael ; et al. | 2006-11-30 |
Method for encapsulating a semiconductor device and semiconductor device
App 20060255435 - Fuergut; Edward ; et al. | 2006-11-16 |
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
App 20060246624 - Fuergut; Edward ; et al. | 2006-11-02 |
Semiconductor device with surface-mountable outer contacts, and process for producing it
App 20060192298 - Bauer; Michael ; et al. | 2006-08-31 |
Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
App 20060183269 - Fuergut; Edward ; et al. | 2006-08-17 |
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
Grant 7,091,595 - Fuergut , et al. August 15, 2 | 2006-08-15 |
Smart card, smart card module, and a method for production of a smart card module
App 20060175419 - Fuergut; Edward ; et al. | 2006-08-10 |
Electronic component and panel for producing the same
App 20060125042 - Fuergut; Edward ; et al. | 2006-06-15 |
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
App 20050098871 - Fuergut, Edward ; et al. | 2005-05-12 |
Electronic module having plug contacts and method for producing it
App 20050087851 - Fuergut, Edward ; et al. | 2005-04-28 |
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