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Patent applications and USPTO patent grants for Fu Zhun Precision Ind. (Shenzhen) Co., Ltd..The latest application filed is for "heat sink assembly with retention module and clip".
Patent | Date |
---|---|
Heat sink assembly with retention module and clip Grant 7,277,288 - Lee , et al. October 2, 2 | 2007-10-02 |
Heat dissipation device with interlocking fin plates Grant 7,231,963 - Lee , et al. June 19, 2 | 2007-06-19 |
Heat dissipation device including wire clips Grant 7,233,496 - Lee , et al. June 19, 2 | 2007-06-19 |
Heat dissipation device Grant 7,230,828 - Lee , et al. June 12, 2 | 2007-06-12 |
Liquid-cooled heat sink assembly Grant 7,224,585 - Lee , et al. May 29, 2 | 2007-05-29 |
Heat dissipation device Grant 7,209,356 - Lee , et al. April 24, 2 | 2007-04-24 |
Heat sink assembly incorporating spring clip Grant 7,203,066 - Lee , et al. April 10, 2 | 2007-04-10 |
Heat dissipating device Grant 7,193,849 - Xu , et al. March 20, 2 | 2007-03-20 |
Fastener for mounting heat-radiator to electronic device Grant 7,167,370 - Lee , et al. January 23, 2 | 2007-01-23 |
Mounting device for heat sink Grant 7,164,583 - Lee , et al. January 16, 2 | 2007-01-16 |
Integrated liquid cooling system for electronic components Grant 7,156,160 - Lee , et al. January 2, 2 | 2007-01-02 |
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