loadpatents
Patent applications and USPTO patent grants for Fu; Yingsong.The latest application filed is for "pptc composition and device having low thermal derating and low process jump".
Patent | Date |
---|---|
Pptc Composition And Device Having Low Thermal Derating And Low Process Jump App 20220013259 - Chen; Jianhua ;   et al. | 2022-01-13 |
Conductive polymer composition, conductive polymer sheet, electrical device, and their preparation methods Grant 10,280,279 - Fu , et al. | 2019-05-07 |
Reflow Solderable Positive Temperature Coefficient Circuit Protection Device App 20180268969 - Hu; Cheng ;   et al. | 2018-09-20 |
Reflow Solderable Positive Temperature Coefficient Circuit Protection Device App 20180261362 - Hu; Cheng ;   et al. | 2018-09-13 |
Conductive Polymer Composition, Conductive Polymer Sheet, Electrical Device, And Their Preparation Methods App 20180186964 - Fu; Yingsong ;   et al. | 2018-07-05 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.