Fu; Yankun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fu; Yankun.The latest application filed is for "light emitting die (led) packages and related methods".

Company Profile

0.8.6

Fu; Yankun - Raleigh NC US
Fu; Yankun - Santa Barbara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light emitting die (LED) packages and related methods Grant 10,256,385 - Britt , et al.	2019-04-09
Wafer level phosphor coating method and devices fabricated utilizing method Grant 9,159,888 - Chitnis , et al. October 13, 2	2015-10-13
Wafer level phosphor coating method and devices fabricated utilizing method Grant 9,024,349 - Chitnis , et al. May 5, 2	2015-05-05
Light Emitting Die (led) Packages And Related Methods App 20120187862 - Britt; Jeffrey Carl ; et al.	2012-07-26
Method of uniform phosphor chip coating and LED package fabricated using method Grant 7,943,952 - Loh , et al. May 17, 2	2011-05-17
Semiconductor light emitting device mounting substrates including a conductive lead extending therein Grant 7,777,247 - Loh , et al. August 17, 2	2010-08-17
Wafer level phosphor coating method and devices fabricated utilizing method App 20080179611 - Chitnis; Ashay ; et al.	2008-07-31
Wafer level phosphor coating method and devices fabricated utilizing method App 20080173884 - Chitnis; Ashay ; et al.	2008-07-24
Method of uniform phosphor chip coating and led package fabricated using method App 20080079017 - Loh; Ban P. ; et al.	2008-04-03
Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same App 20060157726 - Loh; Ban P. ; et al.	2006-07-20
Saturated phosphor solid state emitter App 20040012027 - Keller, Bernd ; et al.	2004-01-22

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