Fu; Xinyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fu; Xinyu.The latest application filed is for "pump truck boom control method, pump truck boom control system and pump truck".

Company Profile

8.59.57

Fu; Xinyu - Changsha CN
Fu; Xinyu - Pleasanton CA
Fu; Xinyu - Fremont CA
Fu; Xinyu - Providence RI

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pump Truck Boom Control Method, Pump Truck Boom Control System And Pump Truck App 20210293038 - Wu; Liang ; et al.	2021-09-23
Methods For Depositing Fluorine/Carbon-Free Conformal Tungsten App 20210225655 - Fu; Xinyu ; et al.	2021-07-22
Methods for depositing fluorine/carbon-free conformal tungsten Grant 10,985,023 - Fu , et al. April 20, 2	2021-04-20
Process kit shield for improved particle reduction Grant 10,718,049 - Rasheed , et al.	2020-07-21
Method of enabling seamless cobalt gap-fill Grant 10,699,946 - Zope , et al.	2020-06-30
Methods of depositing metal films using metal oxyhalide precursors Grant 10,483,116 - Fu , et al. Nov	2019-11-19
Method of enabling seamless cobalt gap-fill Grant 10,269,633 - Zope , et al.	2019-04-23
Methods of Depositing Metal Films Using Metal Oxyhalide Precursors App 20190088489 - Fu; Xinyu ; et al.	2019-03-21
Methods for selective deposition of metal silicides via atomic layer deposition cycles Grant 10,199,230 - Ganguli , et al. Fe	2019-02-05
Methods of depositing metal films using metal oxyhalide precursors Grant 10,121,671 - Fu , et al. November 6, 2	2018-11-06
Methods for thermally forming a selective cobalt layer Grant 10,043,709 - Ai , et al. August 7, 2	2018-08-07
Methods for forming low-resistance contacts through integrated process flow systems Grant 9,947,578 - Lei , et al. April 17, 2	2018-04-17
Process Kit Shield For Improved Particle Reduction App 20180087147 - RASHEED; MUHAMMAD ; et al.	2018-03-29
Tungsten films by organometallic or silane pre-treatment of substrate Grant 9,922,872 - Knapp , et al. March 20, 2	2018-03-20
Method Of Enabling Seamless Cobalt Gap-fill App 20180068890 - ZOPE; Bhushan N. ; et al.	2018-03-08
Method of enabling seamless cobalt gap-fill Grant 9,842,769 - Zope , et al. December 12, 2	2017-12-12
Process kit shield for improved particle reduction Grant 9,834,840 - Rasheed , et al. December 5, 2	2017-12-05
Methods For Depositing Fluorine/Carbon-Free Conformal Tungsten App 20170194156 - Fu; Xinyu ; et al.	2017-07-06
Method of enabling seamless cobalt gap-fill Grant 9,685,371 - Zope , et al. June 20, 2	2017-06-20
Methods For Forming Low-resistance Contacts Through Integrated Process Flow Systems App 20170148670 - LEI; YU ; et al.	2017-05-25
Method Of Enabling Seamless Cobalt Gap-fill App 20170084486 - ZOPE; Bhushan N. ; et al.	2017-03-23
Methods for depositing fluorine/carbon-free conformal tungsten Grant 9,601,339 - Fu , et al. March 21, 2	2017-03-21
Methods for etching via atomic layer deposition (ALD) cycles Grant 9,595,466 - Fu , et al. March 14, 2	2017-03-14
Methods of Depositing Metal Films Using Metal Oxyhalide Precursors App 20170062224 - Fu; Xinyu ; et al.	2017-03-02
Tungsten Films by Organometallic or Silane Pre-Treatment of Substrate App 20160336222 - Knapp; David ; et al.	2016-11-17
Methods For Selective Deposition Of Metal Silicides Via Atomic Layer Deposition Cycles App 20160322229 - GANGULI; Seshadri ; et al.	2016-11-03
Methods For Etching Via Atomic Layer Deposition (ald) Cycles App 20160276214 - FU; Xinyu ; et al.	2016-09-22
Method Of Enabling Seamless Cobalt Gap-fill App 20160247718 - ZOPE; Bhushan N. ; et al.	2016-08-25
Methods For Thermally Forming A Selective Cobalt Layer App 20160133563 - AI; HUA ; et al.	2016-05-12
Method of enabling seamless cobalt gap-fill Grant 9,330,939 - Zope , et al. May 3, 2	2016-05-03
Methods For Depositing Fluorine/Carbon-Free Conformal Tungsten App 20160104624 - Fu; Xinyu ; et al.	2016-04-14
Integrated platform for fabricating n-type metal oxide semiconductor (NMOS) devices Grant 9,230,835 - Gelatos , et al. January 5, 2	2016-01-05
Methods for depositing fluorine/carbon-free conformal tungsten Grant 9,230,815 - Fu , et al. January 5, 2	2016-01-05
Deposition of N-metal films comprising aluminum alloys Grant 9,145,612 - Gandikota , et al. September 29, 2	2015-09-29
Atomic layer deposition methods for metal gate electrodes Grant 9,082,702 - Lei , et al. July 14, 2	2015-07-14
Method Of Enabling Seamless Cobalt Gap-fill App 20150093891 - ZOPE; Bhushan N. ; et al.	2015-04-02
Methods for forming layers on a substrate Grant 8,993,434 - Yu , et al. March 31, 2	2015-03-31
Methods for manufacturing metal gates Grant 8,987,080 - Lu , et al. March 24, 2	2015-03-24
Method for removing native oxide and associated residue from a substrate Grant 8,951,913 - Zheng , et al. February 10, 2	2015-02-10
Methods for annealing a contact metal layer to form a metal silicidation layer Grant 8,927,423 - Fu , et al. January 6, 2	2015-01-06
Electromagnet array in a sputter reactor Grant 8,871,064 - Gung , et al. October 28, 2	2014-10-28
Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers Grant 8,852,674 - Fu , et al. October 7, 2	2014-10-07
Method For Removing Native Oxide And Associated Residue From A Substrate App 20140295665 - ZHENG; Bo ; et al.	2014-10-02
Integrated Platform For Fabricating N-type Metal Oxide Semiconductor (nmos) Devices App 20140273515 - GELATOS; AVGERINOS V. ; et al.	2014-09-18
Method for removing native oxide and associated residue from a substrate Grant 8,772,162 - Zheng , et al. July 8, 2	2014-07-08
Post deposition treatments for CVD cobalt films Grant 8,765,601 - Lei , et al. July 1, 2	2014-07-01
Methods For Depositing Fluorine/carbon-free Conformal Tungsten App 20140120723 - Fu; Xinyu ; et al.	2014-05-01
Method for metal deposition using hydrogen plasma Grant 8,637,410 - Subramani , et al. January 28, 2	2014-01-28
Deposition Of N-Metal Films Comprising Aluminum Alloys App 20140017408 - Gandikota; Srinivas ; et al.	2014-01-16
Post Deposition Treatments For Cvd Cobalt Films App 20140011354 - LEI; Yu ; et al.	2014-01-09
Method For Removing Native Oxide And Associated Residue From A Substrate App 20130316533 - ZHENG; Bo ; et al.	2013-11-28
Methods for forming a contact metal layer in semiconductor devices Grant 8,586,479 - Fu , et al. November 19, 2	2013-11-19
Plasma treatment of substrates prior to deposition Grant 8,580,354 - Fu , et al. November 12, 2	2013-11-12
Methods for forming a metal gate structure on a substrate Grant 8,580,630 - Lei , et al. November 12, 2	2013-11-12
Methods For Manufacturing Metal Gates App 20130295759 - Lu; Xinliang ; et al.	2013-11-07
Method Of Enabling Seamless Cobalt Gap-fill App 20130260555 - ZOPE; Bhushan N. ; et al.	2013-10-03
Post deposition treatments for CVD cobalt films Grant 8,524,600 - Lei , et al. September 3, 2	2013-09-03
Atomic Layer Deposition Methods For Metal Gate Electrodes App 20130221445 - Lei; Yu ; et al.	2013-08-29
Methods For Forming A Contact Metal Layer In Semiconductor Devices App 20130189840 - Fu; Xinyu ; et al.	2013-07-25
Methods For Annealing A Metal Contact Layer To Form A Metal Silicidation Layer App 20130157460 - Fu; Xinyu ; et al.	2013-06-20
Method for removing native oxide and associated residue from a substrate Grant 8,455,352 - Zheng , et al. June 4, 2	2013-06-04
Methods For Forming A Metal Gate Structure On A Substrate App 20130102144 - LEI; JIANXIN ; et al.	2013-04-25
Method for improving electromigration lifetime of copper interconnection by extended post anneal Grant 8,349,724 - Fu , et al. January 8, 2	2013-01-08
Method for Metal Deposition Using Hydrogen Plasma App 20120258602 - Subramani; Anantha K. ; et al.	2012-10-11
Post Deposition Treatments For Cvd Cobalt Films App 20120252207 - Lei; Yu ; et al.	2012-10-04
Method For Segregating The Alloying Elements And Reducing The Residue Resistivity Of Copper Alloy Layers App 20120121799 - Fu; Xinyu ; et al.	2012-05-17
Methods of forming a layer for barrier applications in an interconnect structure Grant 8,168,543 - Fu , et al. May 1, 2	2012-05-01
Methods For Forming Layers On A Substrate App 20120070982 - YU; JICK M. ; et al.	2012-03-22
Pre-clean Chamber With Reduced Ion Current App 20110315319 - FORSTER; JOHN C. ; et al.	2011-12-29
Plasma treatment of substrates prior to deposition App 20110300720 - Fu; Xinyu ; et al.	2011-12-08
Process Kit Shield For Improved Particle Reduction App 20110278165 - RASHEED; MUHAMMAD ; et al.	2011-11-17
Remote plasma source for pre-treatment of substrates prior to deposition Grant 8,021,514 - Fu , et al. September 20, 2	2011-09-20
Methods for reducing damage to substrate layers in deposition processes Grant 7,807,568 - Fu , et al. October 5, 2	2010-10-05
Method For Improving Electromigration Lifetime Of Copper Interconnection By Extended Post Anneal App 20100167526 - Fu; Xinyu ; et al.	2010-07-01
Electromagnet array in a sputter reactor App 20100155223 - GUNG; Tza-Jing ; et al.	2010-06-24
Methods For Reducing Damage To Substrate Layers In Deposition Processes App 20100105203 - FU; XINYU ; et al.	2010-04-29
Remote plasma pre-clean with low hydrogen pressure Grant 7,704,887 - Fu , et al. April 27, 2	2010-04-27
Method For Nitridation Pretreatment App 20100099251 - FU; XINYU ; et al.	2010-04-22
Water vapor passivation of a wall facing a plasma Grant 7,695,567 - Fu April 13, 2	2010-04-13
Multi-step process for forming a metal barrier in a sputter reactor Grant 7,686,926 - Gung , et al. March 30, 2	2010-03-30
Apparatus and a method for cleaning a dielectric film Grant 7,658,802 - Fu , et al. February 9, 2	2010-02-09
Methods Of Forming A Layer For Barrier Applications In An Interconnect Structure App 20100006425 - Fu; Xinyu ; et al.	2010-01-14
Methods of forming a layer for barrier applications in an interconnect structure Grant 7,618,893 - Fu , et al. November 17, 2	2009-11-17
Split magnet ring on a magnetron sputter chamber Grant 7,618,521 - Fu November 17, 2	2009-11-17
Method for forming metal interconnects and reducing metal seed layer overhang Grant 7,615,489 - Fu November 10, 2	2009-11-10
Methods Of Forming A Layer For Barrier Applications In An Interconnect Structure App 20090227105 - Fu; Xinyu ; et al.	2009-09-10
Remote Plasma Source for Pre-Treatment of Substrates Prior to Deposition App 20090017227 - FU; Xinyu ; et al.	2009-01-15
Resputtered Copper Seed Layer App 20080190760 - TANG; XIANMIN ; et al.	2008-08-14
Water vapor passivation of a wall facing a plasma App 20070190266 - Fu; Xinyu	2007-08-16
Remote plasma pre-clean with low hydrogen pressure App 20070117397 - Fu; Xinyu ; et al.	2007-05-24
Apparatus and a method for cleaning a dielectric film App 20070113868 - Fu; Xinyu ; et al.	2007-05-24
Nude mouse model for human neoplastic disease Grant RE39,337 - Monosov , et al. October 10, 2	2006-10-10
Split magnet ring on a magnetron sputter chamber App 20060207873 - Fu; Xinyu	2006-09-21
Multi-step process for forming a metal barrier in a sputter reactor App 20050263390 - Gung, Tza-Jing ; et al.	2005-12-01

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