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Patent applications and USPTO patent grants for Fu; Wei-Cheng.The latest application filed is for "molded interconnect device (mid) with thermal conductive property and method for production thereof".
Patent | Date |
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Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof App 20120134631 - Chiang; Cheng-Feng ;   et al. | 2012-05-31 |
Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier App 20120074094 - Chiang; Cheng-Feng ;   et al. | 2012-03-29 |
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