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name:-0.42363691329956
name:-0.42953085899353
name:-0.026571035385132
Fu; Ting Yu Patent Filings

Fu; Ting Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fu; Ting Yu.The latest application filed is for "semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate".

Company Profile
0.3.3
  • Fu; Ting Yu - Hsinchu County TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

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