Fu; Shih-Kang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fu; Shih-Kang.The latest application filed is for "chemical mechanical polishing topography reset and control on interconnect metal lines".

Company Profile

4.10.11

Fu; Shih-Kang - Taoyuan County TW
FU; Shih-Kang - Hsinchu TW
Fu; Shih-Kang - Zhongli TW
Fu; Shih-Kang - Taoyuan TW
FU; Shih-Kang - Zhongli City TW
FU; Shih-Kang - Taoyuan City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hybrid method for forming semiconductor interconnect structure Grant 11,450,602 - Fu , et al. September 20, 2	2022-09-20
Chemical Mechanical Polishing Topography Reset And Control On Interconnect Metal Lines App 20220270915 - FU; Shih-Kang ; et al.	2022-08-25
Chemical mechanical polishing topography reset and control on interconnect metal lines Grant 11,342,219 - Fu , et al. May 24, 2	2022-05-24
Chemical Mechanical Polishing Topography Reset And Control On Interconnect Metal Lines App 20220102191 - FU; Shih-Kang ; et al.	2022-03-31
Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices App 20220068701 - Fu; Shih-Kang ; et al.	2022-03-03
Method with CMP for metal ion prevention Grant 11,211,256 - Fu , et al. December 28, 2	2021-12-28
Methods of performing chemical-mechanical polishing process in semiconductor devices Grant 11,152,255 - Fu , et al. October 19, 2	2021-10-19
Hybrid Method for Forming Semiconductor Interconnect Structure App 20210313262 - Fu; Shih-Kang ; et al.	2021-10-07
Semiconductor device and manufacturing method thereof Grant 11,127,680 - Fu , et al. September 21, 2	2021-09-21
Method with CMP for Metal Ion Prevention App 20210265172 - Fu; Shih-Kang ; et al.	2021-08-26
Semiconductor device and forming method thereof Grant 10,879,115 - Lee , et al. December 29, 2	2020-12-29
Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices App 20200312708 - Fu; Shih-Kang ; et al.	2020-10-01
Semiconductor Device And Forming Method Thereof App 20190157144 - LEE; Ming-Han ; et al.	2019-05-23
Method for forming conductive structure using polishing process Grant 10,163,700 - Fu , et al. Dec	2018-12-25
Semiconductor Device And Manufacturing Method Thereof App 20170287842 - FU; Shih-Kang ; et al.	2017-10-05
Semiconductor device and manufacturing method thereof Grant 9,721,894 - Fu , et al. August 1, 2	2017-08-01
Conductive Structure And Method For Forming Conductive Structure Using Polishing Process App 20170194201 - FU; Shih-Kang ; et al.	2017-07-06
Semiconductor Device And Manufacturing Method Thereof App 20170092591 - FU; Shih-Kang ; et al.	2017-03-30
Semiconductor device and manufacturing method thereof Grant 9,530,737 - Fu , et al. December 27, 2	2016-12-27
System and method for chemical-mechanical planarization of a metal layer Grant 9,330,989 - Wu , et al. May 3, 2	2016-05-03
System And Method For Chemical-mechanical Planarization Of A Metal Layer App 20140091477 - Wu; Yung-Hsu ; et al.	2014-04-03

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