FU; Qian

Patent Applications and Registrations

Patent applications and USPTO patent grants for FU; Qian.The latest application filed is for "silicon oxide silicon nitride stack stair step etch".

Company Profile

11.57.51

FU; Qian - Pleasanton CA
Fu; Qian - Fremont CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Silicon Oxide Silicon Nitride Stack Stair Step Etch App 20210407811 - QIN; Ce ; et al.	2021-12-30
Methods and systems for advanced ion control for etching processes Grant 11,049,726 - Tan , et al. June 29, 2	2021-06-29
Methods and Systems for Advanced Ion Control for Etching Processes App 20210193474 - Tan; Zhongkui ; et al.	2021-06-24
Methods and systems for advanced ion control for etching processes Grant 10,943,789 - Tan , et al. March 9, 2	2021-03-09
System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter Grant 10,763,142 - Musselman , et al. Sep	2020-09-01
Silicon-based deposition for semiconductor processing Grant 10,658,194 - Tan , et al.	2020-05-19
Method For Transferring A Pattern From An Organic Mask App 20190378725 - ABATCHEV; Mirzafer ; et al.	2019-12-12
Edge Ring Focused Deposition During A Cleaning Process Of A Processing Chamber App 20190341275 - JIN; Yansha ; et al.	2019-11-07
Spacer profile control using atomic layer deposition in a multiple patterning process Grant 10,446,394 - Abatchev , et al. Oc	2019-10-15
Spacer Profile Control Using Atomic Layer Deposition In A Multiple Patterning Process App 20190237330 - Abatchev; Mirzafer ; et al.	2019-08-01
Method and apparatus for anisotropic tungsten etching Grant 10,354,888 - Tan , et al. July 16, 2	2019-07-16
Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber Grant 10,242,845 - Tan , et al.	2019-03-26
Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level Grant 10,177,003 - Tan , et al. J	2019-01-08
Near-Substrate Supplemental Plasma Density Generation with Low Bias Voltage within Inductively Coupled Plasma Processing Chamber App 20180204708 - Tan; Zhongkui ; et al.	2018-07-19
Edge roughness reduction Grant 10,020,183 - Jin , et al. July 10, 2	2018-07-10
Silicon oxide silicon nitride stack ion-assisted etch Grant 9,997,366 - Tan , et al. June 12, 2	2018-06-12
Atomic layer etching in continuous plasma Grant 9,991,128 - Tan , et al. June 5, 2	2018-06-05
Silicon Oxide Silicon Nitride Stack Ion-assisted Etch App 20180108532 - TAN; Zhongkui ; et al.	2018-04-19
Post etch treatment to prevent pattern collapse Grant 9,941,123 - Abatchev , et al. April 10, 2	2018-04-10
Methods and Systems for Advanced Ion Control for Etching Processes App 20180090334 - Tan; Zhongkui ; et al.	2018-03-29
Methods and Systems for Advanced Ion Control for Etching Processes App 20180076045 - Tan; Zhongkui ; et al.	2018-03-15
Silicon-based Deposition For Semiconductor Processing App 20180061659 - TAN; Zhongkui ; et al.	2018-03-01
Methods and Systems for Independent Control of Radical Density, Ion Density, and Ion Energy in Pulsed Plasma Semiconductor Device Fabrication App 20180005803 - Tan; Zhongkui ; et al.	2018-01-04
Line edge roughness improvement with photon-assisted plasma process Grant 9,859,127 - Tan , et al. January 2, 2	2018-01-02
Systems and Methods for Reverse Pulsing App 20170372912 - Long; Maolin ; et al.	2017-12-28
Line edge roughness improvement with sidewall sputtering Grant 9,852,924 - Tan , et al. December 26, 2	2017-12-26
Line Edge Roughness Improvement With Photon-assisted Plasma Process App 20170358456 - TAN; Zhongkui ; et al.	2017-12-14
Methods and systems for advanced ion control for etching processes Grant 9,824,896 - Tan , et al. November 21, 2	2017-11-21
Methods and Systems for Plasma Etching Using Bi-Modal Process Gas Composition Responsive to Plasma Power Level App 20170271166 - Tan; Zhongkui ; et al.	2017-09-21
Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabrication Grant 9,767,991 - Tan , et al. September 19, 2	2017-09-19
Systems and methods for reverse pulsing Grant 9,761,459 - Long , et al. September 12, 2	2017-09-12
Hybrid stair-step etch Grant 9,741,563 - Xiang , et al. August 22, 2	2017-08-22
Atomic Layer Etching In Continuous Plasma App 20170229311 - Tan; Zhongkui ; et al.	2017-08-10
Hybrid Stair-step Etch App 20170213723 - XIANG; Hua ; et al.	2017-07-27
Method And Apparatus For Anisotropic Tungsten Etching App 20170194166 - Tan; Zhongkui ; et al.	2017-07-06
Method for forming stair-step structures Grant RE46,464 - Fu , et al. July 4, 2	2017-07-04
Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level Grant 9,691,625 - Tan , et al. June 27, 2	2017-06-27
Method for forming stair-step structures Grant 9,673,057 - Bae , et al. June 6, 2	2017-06-06
Method for forming stair-step structures Grant 9,646,844 - Fu , et al. May 9, 2	2017-05-09
Methods and Systems for Advanced Ion Control for Etching Processes App 20170125260 - Tan; Zhongkui ; et al.	2017-05-04
Methods and Systems for Independent Control of Radical Density, Ion Density, and Ion Energy in Pulsed Plasma Semiconductor Device Fabrication App 20170125216 - Tan; Zhongkui ; et al.	2017-05-04
Methods and Systems for Plasma Etching Using Bi-Modal Process Gas Composition Responsive to Plasma Power Level App 20170125253 - Tan; Zhongkui ; et al.	2017-05-04
Method and apparatus for anisotropic tungsten etching Grant 9,633,867 - Tan , et al. April 25, 2	2017-04-25
Etch process with pre-etch transient conditioning Grant 9,607,848 - Lee , et al. March 28, 2	2017-03-28
Systems and methods for reverse pulsing Grant 9,583,357 - Long , et al. February 28, 2	2017-02-28
Systems And Methods For Reverse Pulsing App 20170040176 - Long; Maolin ; et al.	2017-02-09
Systems And Methods For Reverse Pulsing App 20170040174 - Long; Maolin ; et al.	2017-02-09
Continuous plasma etch process Grant 9,530,658 - Lee , et al. December 27, 2	2016-12-27
System And Method For Determining Field Non-uniformities Of A Wafer Processing Chamber Using A Wafer Processing Parameter App 20160370796 - Musselman; Marcus ; et al.	2016-12-22
Line width roughness improvement with noble gas plasma Grant 9,466,502 - Cheng , et al. October 11, 2	2016-10-11
Method For Forming Stair-step Structures App 20160284555 - BAE; In Deog ; et al.	2016-09-29
Method to etch a tungsten containing layer Grant 9,418,869 - Xiang , et al. August 16, 2	2016-08-16
Method And Apparatus For Anisotropic Tungsten Etching App 20160196985 - Tan; Zhongkui ; et al.	2016-07-07
Method For Forming Stair-step Structures App 20160181113 - FU; Qian ; et al.	2016-06-23
Etch Process With Pre-etch Transient Conditioning App 20160155645 - LEE; Wonchul ; et al.	2016-06-02
Line Width Roughness Improvement With Noble Gas Plasma App 20160155643 - CHENG; Shih-Yuan ; et al.	2016-06-02
Method for forming stair-step structures Grant 9,275,872 - Fu , et al. March 1, 2	2016-03-01
Line width roughness improvement with noble gas plasma Grant 9,263,284 - Cheng , et al. February 16, 2	2016-02-16
Etch process with pre-etch transient conditioning Grant 9,257,296 - Lee , et al. February 9, 2	2016-02-09
Method To Etch A Tungsten Containing Layer App 20160035585 - XIANG; Hua ; et al.	2016-02-04
Etch Process With Pre-etch Transient Conditioning App 20150380264 - LEE; Wonchul ; et al.	2015-12-31
Continuous Plasma Etch Process App 20150348792 - LEE; Wonchul ; et al.	2015-12-03
Etch process with pre-etch transient conditioning Grant 9,142,417 - Lee , et al. September 22, 2	2015-09-22
Continuous plasma ETCH process Grant 9,129,902 - Lee , et al. September 8, 2	2015-09-08
Etch with pulsed bias Grant 9,059,116 - Jain , et al. June 16, 2	2015-06-16
Method For Forming Stair-step Structures App 20150118853 - FU; Qian ; et al.	2015-04-30
Plasma etch method to reduce micro-loading Grant 8,901,004 - Kamp , et al. December 2, 2	2014-12-02
Continuous Plasma Etch Process App 20140329391 - Lee; Wonchul ; et al.	2014-11-06
Line Width Roughness Improvement With Noble Gas Plasma App 20140248779 - CHENG; Shih-Yuan ; et al.	2014-09-04
Method of hard mask CD control by Ar sputtering Grant 8,802,571 - Lee , et al. August 12, 2	2014-08-12
Etch Process With Pre-etch Transient Conditioning App 20140167228 - LEE; Wonchul ; et al.	2014-06-19
Line width roughness improvement with noble gas plasma Grant 8,753,804 - Cheng , et al. June 17, 2	2014-06-17
Pulsed bias plasma process to control microloading Grant 8,609,546 - Lee , et al. December 17, 2	2013-12-17
Method for forming stair-step structures Grant 8,535,549 - Fu , et al. September 17, 2	2013-09-17
Method of controlling etch microloading for a tungsten-containing layer Grant 8,518,282 - Lee , et al. August 27, 2	2013-08-27
Method and apparatus for pattern collapse free wet processing of semiconductor devices Grant 8,440,573 - Mikhaylichenko , et al. May 14, 2	2013-05-14
Silicon nitride dry trim without top pulldown Grant 8,431,461 - Zhong , et al. April 30, 2	2013-04-30
Etch With Pulsed Bias App 20130084708 - JAIN; Amit ; et al.	2013-04-04
Method For Forming Stair-step Structures App 20130062735 - FU; Qian ; et al.	2013-03-14
Method Of Hard Mask Cd Control By Ar Sputtering App 20130029491 - Lee; Wonchul ; et al.	2013-01-31
Method for forming stair-step structures Grant 8,329,051 - Fu , et al. December 11, 2	2012-12-11
Extending storage time of removed plasma chamber components prior to cleaning thereof Grant 8,216,388 - Shih , et al. July 10, 2	2012-07-10
Method For Forming Stair-step Structures App 20120149203 - Fu; Qian ; et al.	2012-06-14
Method For Forming Stair-step Structures App 20120149201 - Fu; Qian ; et al.	2012-06-14
Selective etch of high-k dielectric material Grant 8,124,538 - Bae , et al. February 28, 2	2012-02-28
Pulsed Bias Plasma Process To Control Microloading App 20110281438 - Lee; Wonchul ; et al.	2011-11-17
Extending Storage Time Of Removed Plasma Chamber Components Prior To Cleaning Thereof App 20110232678 - Shih; Hong ; et al.	2011-09-29
Method And Apparatus For Pattern Collapse Free Wet Processing Of Semiconductor Devices App 20110183522 - Mikhaylichenko; Katrina ; et al.	2011-07-28
Extending storage time of removed plasma chamber components prior to cleaning thereof Grant 7,976,641 - Shih , et al. July 12, 2	2011-07-12
Method Of Controlling Etch Microloading For A Tungsten-containing Layer App 20110151670 - Lee; Wonchul ; et al.	2011-06-23
Line Width Roughness Improvement With Noble Gas Plasma App 20110104616 - Cheng; Shih-Yuan ; et al.	2011-05-05
Plasma Etch Method To Reduce Micro-loading App 20110021029 - Kamp; Tom ; et al.	2011-01-27
Phase change alloy etch Grant 7,682,979 - Fu , et al. March 23, 2	2010-03-23
Method for reducing microloading in etching high aspect ratio structures Grant 7,629,255 - Fu , et al. December 8, 2	2009-12-08
Selective Etch Of High-k Dielectric Material App 20090258502 - BAE; In Deog ; et al.	2009-10-15
Phase change alloy etch App 20090130855 - Fu; Qian ; et al.	2009-05-21
Method For Reducing Microloading In Etching High Aspect Ratio Structures App 20080296736 - Fu; Qian ; et al.	2008-12-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.