FU; Chieh-Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for FU; Chieh-Chen.The latest application filed is for "device for communication".

Company Profile

1.9.12

FU; Chieh-Chen - Kaohsiung TW
Fu; Chieh-Chen - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device For Communication App 20220214488 - YOU; Chang-Feng ; et al.	2022-07-07
Semiconductor device package and method of manufacturing the same Grant 11,329,016 - Hsieh , et al. May 10, 2	2022-05-10
Semiconductor Device Package And Method Of Manufacturing The Same App 20210249369 - HSIEH; Meng-Wei ; et al.	2021-08-12
Semiconductor Package Device And Method Of Manufacturing The Same App 20210167053 - LIN; Chang-Yu ; et al.	2021-06-03
Semiconductor package device and method of manufacturing the same Grant 10,930,627 - Lin , et al. February 23, 2	2021-02-23
Semiconductor package device and method of manufacturing the same Grant 10,784,208 - Liao , et al. Sept	2020-09-22
Semiconductor Package Device And Method Of Manufacturing The Same App 20200212023 - LIN; Chang-Yu ; et al.	2020-07-02
Semiconductor device package and method of manufacturing the same Grant 10,431,554 - Lin , et al. O	2019-10-01
Semiconductor Device Package And Method Of Manufacturing The Same App 20180158783 - LIN; I-Chia ; et al.	2018-06-07
Semiconductor device package and method of manufacturing the same Grant 9,871,005 - Lin , et al. January 16, 2	2018-01-16
Semiconductor Device Package And Method Of Manufacturing The Same App 20170200682 - LIN; I-Chia ; et al.	2017-07-13
Semiconductor Package Device And Method Of Manufacturing The Same App 20170077039 - Liao; Kuo-Hsien ; et al.	2017-03-16
Semiconductor device packages Grant 9,269,673 - Lin , et al. February 23, 2	2016-02-23
Semiconductor device and method for manufacturing the same Grant 8,963,316 - Hsu , et al. February 24, 2	2015-02-24
Semiconductor Device And Method For Manufacturing The Same App 20130207260 - Hsu; Chih-Jing ; et al.	2013-08-15
Package structure with embedded die and method of fabricating the same Grant 8,120,148 - Chen , et al. February 21, 2	2012-02-21
Semiconductor Package and Manufacturing Methods Thereof App 20110127654 - Weng; Chaofu ; et al.	2011-06-02
Structure And Process Of Embedded Chip Package App 20100006330 - Fu; Chieh-Chen ; et al.	2010-01-14
Package Structure With Embedded Die And Method Of Fabricating The Same App 20090224378 - CHEN; KUO-HUA ; et al.	2009-09-10

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