Fritz; Donald S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fritz; Donald S..The latest application filed is for "thermally enhanced metal capped bga package".

Company Profile

0.8.3

Fritz; Donald S. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermally enhanced metal capped BGA package Grant 7,319,051 - Cheah , et al. January 15, 2	2008-01-15
Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate Grant 7,144,756 - Wang , et al. December 5, 2	2006-12-05
Semiconductor package with stress inhibiting intermediate mounting substrate Grant 6,969,636 - Fritz November 29, 2	2005-11-29
Thermally enhanced metal capped BGA package App 20050179125 - Cheah, Eng C. ; et al.	2005-08-18
Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate Grant 6,909,176 - Wang , et al. June 21, 2	2005-06-21
Thermally enhanced metal capped BGA package Grant 6,882,041 - Cheah , et al. April 19, 2	2005-04-19
Semiconductor package with stress inhibiting intermediate mounting substrate Grant 6,734,540 - Fritz May 11, 2	2004-05-11
Method and structure for integrated circuit package App 20020145207 - Anderson, Sidney Larry ; et al.	2002-10-10
Semiconductor package with stress inhibiting intermediate mounting substrate App 20020041489 - Fritz, Donald S.	2002-04-11
Integrated circuit package Grant 5,757,070 - Fritz May 26, 1	1998-05-26
Integrated circuit package fabrication method Grant 5,744,383 - Fritz April 28, 1	1998-04-28

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