Friese; Gerald

Patent Applications and Registrations

Patent applications and USPTO patent grants for Friese; Gerald.The latest application filed is for "method and apparatus of stress relief in semiconductor structures".

Company Profile

0.6.9

Friese; Gerald - Munich DE
Friese; Gerald - Munchen DE
Friese, Gerald - Muenchen DE
Friese, Gerald - Fishkill NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus of stress relief in semiconductor structures Grant 7,786,007 - Hoinkis , et al. August 31, 2	2010-08-31
Method and Apparatus of Stress Relief in Semiconductor Structures App 20080213993 - Hoinkis; Mark ; et al.	2008-09-04
Method and apparatus of stress relief in semiconductor structures Grant 7,368,804 - Hoinkis , et al. May 6, 2	2008-05-06
Method and apparatus of stress relief in semiconductor structures App 20050221610 - Hoinkis, Mark ; et al.	2005-10-06
Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level Grant 6,866,943 - Friese , et al. March 15, 2	2005-03-15
Method and apparatus of stress relief in semiconductor structures App 20040227214 - Hoinkis, Mark ; et al.	2004-11-18
FBEOL process for Cu metallizations free from Al-wirebond pads Grant 6,730,982 - Barth , et al. May 4, 2	2004-05-04
Method of eliminating back-end rerouting in ball grid array packaging Grant 6,720,212 - Robl , et al. April 13, 2	2004-04-13
Bond Pad Structure Comprising Tungsten Or Tungsten Compound Layer On Top Of Metallization Level App 20030203216 - Friese, Gerald ; et al.	2003-10-30
Method of eliminating back-end rerouting in ball grid array packaging App 20030183913 - Robl, Werner ; et al.	2003-10-02
Zero mask MIMcap process for a low k BEOL App 20020155676 - Stetter, Michael ; et al.	2002-10-24
FBEOL process for Cu metallizations free from Al-wirebond pads App 20020142592 - Barth, Hans-Joachim ; et al.	2002-10-03
Method of making a MIM capacitor with self-passivating plates Grant 6,451,664 - Barth , et al. September 17, 2	2002-09-17
Method Of Making A Mim Capacitor With Self-passivating Plates App 20020102809 - Barth, Hans-Joachim ; et al.	2002-08-01
Power pads for application of high current per bond pad in silicon technology App 20020016070 - Friese, Gerald	2002-02-07

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