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Patent applications and USPTO patent grants for Friedler; Sophia.The latest application filed is for "method of porosifying part of a semiconductor wafer".
Patent | Date |
---|---|
Method Of Porosifying Part Of A Semiconductor Wafer App 20220310380 - Friedler; Sophia ;   et al. | 2022-09-29 |
Method for partially removing a semiconductor wafer Grant 11,404,262 - Friedler , et al. August 2, 2 | 2022-08-02 |
Method for Partially Removing a Semiconductor Wafer App 20200168449 - Friedler; Sophia ;   et al. | 2020-05-28 |
Method for manufacturing a semiconductor device comprising etching a semiconductor material Grant 10,497,583 - Moder , et al. De | 2019-12-03 |
Method for Manufacturing a Semiconductor Device Comprising Etching a Semiconductor Material App 20180277391 - Moder; Iris ;   et al. | 2018-09-27 |
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