Freyman; Bruce J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Freyman; Bruce J..The latest application filed is for "grid array assembly of circuit boards with singulation grooves".

Company Profile

0.15.0

Freyman; Bruce J. - Tempe AZ
Freyman; Bruce J. - Boca Raton FL
Freyman; Bruce J. - Plantation FL
Freyman; Bruce J. - Sunrise FL
Freyman; Bruce J. - N. Lauderdale FL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Grid array assembly of circuit boards with singulation grooves Grant 6,329,606 - Freyman , et al. December 11, 2	2001-12-11
Carrier strip and molded flex circuit ball grid array and method of making Grant 6,124,637 - Freyman , et al. September 26, 2	2000-09-26
Carrier strip and molded flex circuit ball grid array Grant 5,859,475 - Freyman , et al. January 12, 1	1999-01-12
Mold runner removal from a substrate-based packaged electronic device Grant 5,635,671 - Freyman , et al. June 3, 1	1997-06-03
Integrated circuit package having a face-to-face IC chip arrangement Grant 5,438,224 - Papageorge , et al. August 1, 1	1995-08-01
Moisture relief for chip carrier Grant 5,296,738 - Freyman , et al. March 22, 1	1994-03-22
Leadless pad array chip carrier Grant 5,241,133 - Mullen, III , et al. August 31, 1	1993-08-31
Method of making a transfer molded semiconductor device Grant 5,218,759 - Juskey , et al. June 15, 1	1993-06-15
Transfer molded semiconductor device package with integral shield Grant 5,166,772 - Soldner , et al. November 24, 1	1992-11-24
Overmolded semiconductor package with anchoring means Grant 5,136,366 - Worp , et al. August 4, 1	1992-08-04
Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate Grant 5,134,462 - Freyman , et al. July 28, 1	1992-07-28
Grounding an ultra high density pad array chip carrier Grant 5,077,633 - Freyman , et al. December 31, 1	1991-12-31
Fabrication of pad array carriers from a universal interconnect structure Grant 5,006,673 - Freyman , et al. April 9, 1	1991-04-09
Method of making an ultra high density pad array chip carrier Grant 4,700,473 - Freyman , et al. October 20, 1	1987-10-20
Ultra high density pad array chip carrier Grant 4,700,276 - Freyman , et al. October 13, 1	1987-10-13

Company Registrations

SEC

0001236269

FREYMAN BRUCE J

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