Frey; Jens

Patent Applications and Registrations

Patent applications and USPTO patent grants for Frey; Jens.The latest application filed is for "micromechanical device and method for manufacturing a micromechanical device".

Company Profile

2.42.44

Frey; Jens - Filderstadt DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micromechanical device and method for manufacturing a micromechanical device Grant 11,261,082 - Graf , et al. March 1, 2	2022-03-01
MEMS component having two different internal pressures Grant 10,752,498 - Breitling , et al. A	2020-08-25
Micromechanical Device And Method For Manufacturing A Micromechanical Device App 20200198966 - Graf; Eckhard ; et al.	2020-06-25
Mems Component Having Two Different Internal Pressures App 20180346324 - Breitling; Achim ; et al.	2018-12-06
Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface Grant 10,000,375 - Reichenbach , et al. June 19, 2	2018-06-19
Sensor unit including a decoupling structure and manufacturing method therefor Grant 9,926,188 - Classen , et al. March 27, 2	2018-03-27
Laser reseal including an additional layer and alloy formation Grant 9,919,919 - Frey , et al. March 20, 2	2018-03-20
Sensor Unit Including A Decoupling Structure And Manufacturing Method Therefor App 20170203958 - CLASSEN; Johannes ; et al.	2017-07-20
Micromechanical component and method for producing a micromechanical component Grant 9,688,527 - Frey , et al. June 27, 2	2017-06-27
Laser Reseal Including Different Cap Materials App 20170158495 - Breitling; Achim ; et al.	2017-06-08
Laser Reseal Including An Additional Layer And Alloy Formation App 20170158496 - Frey; Jens ; et al.	2017-06-08
Structures And Process For Preventing A Projection Of The Laser Resealing Structure Beyond The Wafer Surface App 20170113920 - Reichenbach; Frank ; et al.	2017-04-27
Micromechanical sensor device Grant 9,606,141 - Frey , et al. March 28, 2	2017-03-28
Micromechanical component Grant 9,567,212 - Gonska , et al. February 14, 2	2017-02-14
ASIC element, in particular as a component of a vertically integrated hybrid component Grant 9,475,693 - Meisel , et al. October 25, 2	2016-10-25
Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements Grant 9,416,000 - Schelling , et al. August 16, 2	2016-08-16
Component in the form of a wafer level package and method for manufacturing same Grant 9,406,747 - Weber , et al. August 2, 2	2016-08-02
Method for manufacturing a micromechanical component Grant 9,365,417 - Mayer , et al. June 14, 2	2016-06-14
Hybrid integrated component Grant 9,266,720 - Classen , et al. February 23, 2	2016-02-23
Asic Element, In Particular As A Component Of A Vertically Integrated Hybrid Component App 20150353343 - MEISEL; Daniel Christoph ; et al.	2015-12-10
Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements App 20150353347 - Schelling; Christoph ; et al.	2015-12-10
ASIC element including a via Grant 9,153,523 - Weber , et al. October 6, 2	2015-10-06
Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates Grant 9,123,716 - Gonska , et al. September 1, 2	2015-09-01
Method for manufacturing a component having an electrical through-connection Grant 9,114,978 - Reinmuth , et al. August 25, 2	2015-08-25
Method For Manufacturing A Micromechanical Component App 20150151962 - Mayer; Thomas ; et al.	2015-06-04
Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap Grant 9,040,336 - Classen , et al. May 26, 2	2015-05-26
Component Having A Via And Method For Manufacturing It App 20150137329 - Gonska; Julian ; et al.	2015-05-21
Method for manufacturing a component having an electrical through-connection Grant 9,034,757 - Reinmuth , et al. May 19, 2	2015-05-19
Micromechanical Sensor Device App 20150122023 - FREY; Jens ; et al.	2015-05-07
Component having a via and method for manufacturing it Grant 8,975,118 - Gonska , et al. March 10, 2	2015-03-10
Micromechanical Component And Method For Producing A Micromechanical Component App 20150053001 - FREY; Jens ; et al.	2015-02-26
Method for manufacturing a hybrid integrated component Grant 8,941,193 - Frey , et al. January 27, 2	2015-01-27
Component Including Means For Reducing Assembly-related Mechanical Stresses And Methods For Manufacturing Same App 20140374853 - WEBER; Heribert ; et al.	2014-12-25
Method for producing a two-chip assembly and corresponding two-chip assembly Grant 8,835,222 - Bruendel , et al. September 16, 2	2014-09-16
Hybrid intergrated component Grant 8,759,927 - Classen , et al. June 24, 2	2014-06-24
Sensor module Grant 8,748,998 - Frey , et al. June 10, 2	2014-06-10
Micromechanical Component App 20140117472 - Gonska; Julian ; et al.	2014-05-01
Hybrid Integrated Component App 20140117475 - CLASSEN; Johannes ; et al.	2014-05-01
Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap App 20140110800 - CLASSEN; Johannes ; et al.	2014-04-24
Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches Grant 8,647,961 - Frey , et al. February 11, 2	2014-02-11
Method For Manufacturing A Component Having An Electrical Through-connection App 20140027927 - REINMUTH; Jochen ; et al.	2014-01-30
Method For Manufacturing A Component Having An Electrical Through-connection App 20130341738 - REINMUTH; Jochen ; et al.	2013-12-26
Hybrid Intergrated Component App 20130307096 - CLASSEN; Johannes ; et al.	2013-11-21
Micromechanical Component And Method For Manufacturing A Micromechanical Component App 20130285175 - Gonska; Julian ; et al.	2013-10-31
Method For Manufacturing A Hybrid Integrated Component App 20130277774 - FREY; Jens ; et al.	2013-10-24
Micromechanical yaw-rate sensor Grant 8,490,483 - Wrede , et al. July 23, 2	2013-07-23
Method For Bonding Two Silicon Substrates, And A Correspondeing System Of Two Silicon Substrates App 20130161820 - GONSKA; Julian ; et al.	2013-06-27
Component Having a Via and Method for Manufacturing It App 20130147020 - Gonska; Julian ; et al.	2013-06-13
Method for producing a two-chip assembly and corresponding two-chip assembly App 20130082406 - BRUENDEL; Mathias ; et al.	2013-04-04
Method For Filling Cavities In Wafers, Correspondingly Filled Blind Hole And Wafer Having Correspondingly Filled Insulation Trenches App 20120038030 - Frey; Jens ; et al.	2012-02-16
Sensor Module App 20120032283 - FREY; Jens ; et al.	2012-02-09
Micromechanical component and manufacturing method Grant 7,919,346 - Kaelberer , et al. April 5, 2	2011-04-05
Micromechanical System App 20110068419 - Reinmuth; Jochen ; et al.	2011-03-24
Micromechanical Yaw-rate Sensor App 20110023600 - WREDE; Martin ; et al.	2011-02-03
Micromechanical Component and Manufacturing Method App 20080315332 - Kaelberer; Arnd ; et al.	2008-12-25
Rotation rate sensor Grant 7,316,161 - Willig , et al. January 8, 2	2008-01-08
Rotational rate sensor Grant 7,313,958 - Willig , et al. January 1, 2	2008-01-01
Micromechanical component Grant 7,270,868 - Pannek , et al. September 18, 2	2007-09-18
Rotation rate sensor App 20040206176 - Willig, Rainer ; et al.	2004-10-21
Rotational rate sensor App 20040123660 - Willig, Rainer ; et al.	2004-07-01
Component and method of manufacturing same App 20040081802 - Pannek, Thorsten ; et al.	2004-04-29

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