Frei; Jeremy S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Frei; Jeremy S..The latest application filed is for "discontinuous patterned bonds for semiconductor devices and associated systems and methods".

Company Profile

2.13.16

Frei; Jeremy S. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Discontinuous Patterned Bonds For Semiconductor Devices And Associated Systems And Methods App 20220130807 - Schellhammer; Scott D. ; et al.	2022-04-28
Discontinuous patterned bonds for semiconductor devices and associated systems and methods Grant 11,222,874 - Schellhammer , et al. January 11, 2	2022-01-11
Etched Trenches In Bond Materials For Die Singulation, And Associated Systems And Methods App 20210135067 - Odnoblyudov; Vladimir ; et al.	2021-05-06
Etched trenches in bond materials for die singulation, and associated systems and methods Grant 10,892,384 - Odnoblyudov , et al. January 12, 2	2021-01-12
Discontinuous Patterned Bonds For Semiconductor Devices And Associated Systems And Methods App 20190189597 - Schellhammer; Scott D. ; et al.	2019-06-20
Discontinuous patterned bonds for semiconductor devices and associated systems and methods Grant 10,242,970 - Schellhammer , et al.	2019-03-26
Etched Trenches In Bond Materials For Die Singulation, And Associated Systems And Methods App 20180301602 - Odnoblyudov; Vladimir ; et al.	2018-10-18
Etched trenches in bond materials for die singulation, and associated systems and methods Grant 10,020,432 - Odnoblyudov , et al. July 10, 2	2018-07-10
Discontinuous Patterned Bonds For Semiconductor Devices And Associated Systems And Methods App 20160336302 - Schellhammer; Scott D. ; et al.	2016-11-17
Discontinuous patterned bonds for semiconductor devices and associated systems and methods Grant 9,362,259 - Schellhammer , et al. June 7, 2	2016-06-07
Engineered substrate assemblies with thermally opaque materials, and associated systems, devices, and methods Grant 9,230,847 - Coones , et al. January 5, 2	2016-01-05
Discontinuous Patterned Bonds For Semiconductor Devices And Associated Systems And Methods App 20150357314 - Schellhammer; Scott D. ; et al.	2015-12-10
Discontinuous patterned bonds for semiconductor devices and associated systems and methods Grant 9,059,380 - Schellhammer , et al. June 16, 2	2015-06-16
Etched Trenches In Bond Materials For Die Singulation, And Associated Systems And Methods App 20150155452 - Odnoblyudov; Vladimir ; et al.	2015-06-04
Engineered Substrate Assemblies With Thermally Opaque Materials, And Associated Systems, Devices, And Methods App 20150090956 - Coones; Joseph G. ; et al.	2015-04-02
Engineered Substrates Having Mechanically Weak Structures And Associated Systems And Methods App 20150048301 - Kilbury; Oliver J. ; et al.	2015-02-19
Etched trenches in bond materials for die singulation, and associated systems and methods Grant 8,952,413 - Odnoblyudov , et al. February 10, 2	2015-02-10
Discontinuous Patterned Bonds For Semiconductor Devices And Associated Systems And Methods App 20140295594 - Schellhammer; Scott D. ; et al.	2014-10-02
Discontinuous patterned bonds for semiconductor devices and associated systems and methods Grant 8,754,424 - Schellhammer , et al. June 17, 2	2014-06-17
Vertical solid-state transducers and solid-state transducer arrays having backside terminals and associated systems and methods Grant 8,598,611 - Odnoblyudov , et al. December 3, 2	2013-12-03
Etched Trenches In Bond Materials For Die Singulation, And Associated Systems And Methods App 20130234193 - Odnoblyudov; Vladimir ; et al.	2013-09-12
Vertical Solid-state Transducers And Solid-state Transducer Arrays Having Backside Terminals And Associated Systems And Methods App 20130175560 - Odnoblyudov; Vladimir ; et al.	2013-07-11
Discontinuous Patterned Bonds For Semiconductor Devices And Associated Systems And Methods App 20130049016 - Schellhammer; Scott D. ; et al.	2013-02-28

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