Frear; Darrel R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Frear; Darrel R..The latest application filed is for "environmental sensor structure".

Company Profile

0.16.17

Frear; Darrel R. - Phoneix AZ US
Frear; Darrel R. - Phoenix AZ
Frear; Darrel R - Phoenix AZ
Frear; Darrel R. - Austin TX
Frear; Darrel R. - Albuquerque NM

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Differential pressure sensor assembly Grant 9,638,597 - Hooper , et al. May 2, 2	2017-05-02
Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture Grant 9,510,495 - Hooper , et al. November 29, 2	2016-11-29
Die-to-die inductive communication devices and methods Grant 9,466,413 - Brauchler , et al. October 11, 2	2016-10-11
Environmental Sensor Structure App 20160130136 - SINGH; AKHILESH K. ; et al.	2016-05-12
Differential Pressure Sensor Assembly App 20160084722 - Hooper; Stephen R. ; et al.	2016-03-24
Die-to-die Inductive Communication Devices And Methods App 20150004902 - Pigott; John M. ; et al.	2015-01-01
Die-to-die Inductive Communication Devices And Methods App 20150001948 - BRAUCHLER; Fred T. ; et al.	2015-01-01
Lead frame having a flag with in-plane and out-of-plane mold locking features Grant 8,742,555 - Wen , et al. June 3, 2	2014-06-03
Electronic Devices With Cavity-type, Permeable Material Filled Packages, And Methods Of Their Manufacture App 20140146509 - HOOPER; STEPHEN R. ; et al.	2014-05-29
Lead Frame Having A Flag With In-plane And Out-of-plane Mold Locking Features App 20130049181 - Wen; Jian ; et al.	2013-02-28
Redistributed Chip Packaging With Thermal Contact To Device Backside App 20120252169 - Tracht; Neil T. ; et al.	2012-10-04
Redistributed chip packaging with thermal contact to device backside Grant 8,217,511 - Tracht , et al. July 10, 2	2012-07-10
Integrated conformal shielding method and process using redistributed chip packaging Grant 7,981,730 - Tang , et al. July 19, 2	2011-07-19
Method for forming a packaged semiconductor device Grant 7,838,420 - Tang , et al. November 23, 2	2010-11-23
Integrated circuit module with integrated passive device Grant 7,763,976 - Tang , et al. July 27, 2	2010-07-27
Integrated Circuit Module With Integrated Passive Device App 20100078760 - Tang; Jinbang ; et al.	2010-04-01
Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging App 20100006988 - Tang; Jinbang ; et al.	2010-01-14
Integrated shielding process for precision high density module packaging App 20090072357 - Tang; Jinbang ; et al.	2009-03-19
Interconnect In A Multi-element Package App 20090057849 - Tang; Jinbang ; et al.	2009-03-05
Redistributed Chip Packaging With Thermal Contact To Device Backside App 20090032933 - Tracht; Neil T. ; et al.	2009-02-05
Electronic component and method of manufacture Grant 6,630,725 - Kuo , et al. October 7, 2	2003-10-07
Thermal fuse for high-temperature batteries Grant 6,064,293 - Jungst , et al. May 16, 2	2000-05-16
Method and apparatus for jetting, manufacturing and attaching uniform solder balls Grant 5,855,323 - Yost , et al. January 5, 1	1999-01-05
Microstructure control of Al-Cu films for improved electromigration resistance Grant 5,300,307 - Frear , et al. April 5, 1	1994-04-05

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