FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER

Patent Applications and Registrations

Patent applications and USPTO patent grants for FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER.The latest application filed is for "service mashup method implemented through dynamic cooperation of client and server, server and client".

Company Profile

1.6.4

FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER - Munich DE
FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER - Munchen DE
Fraunhofer-Gesellschaft Zur Forderung Der -
Fraunhofer Gesellschaft zur Forderung der ... - Muchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and device for nucleic acid based diagnostic approaches including the determination of a deviant condition, especially a health condition and/or a pathogenic condition of a sample Grant 10,910,088 - Sohn , et al. February 2, 2	2021-02-02
Encoding by reconstructing phase information using a structure tensor on audio spectrograms Grant 10,607,630 - Niedermeier , et al.	2020-03-31
Device and method of combining measurement signals from illumination signals Grant 10,580,123 - Doge , et al.	2020-03-03
Polymer composition by continuous filler slurry extrusion Grant 10,435,521 - Tinkl , et al. O	2019-10-08
Shaft arrangement and method for relaying torques acting around a rotational axis Grant 9,404,542 - Flaschentrager , et al. August 2, 2	2016-08-02
Method, server and client in implementing service Mashup for web applications integrations through dynamic cooperation of client and server Grant 9,203,907 - Ma , et al. December 1, 2	2015-12-01
Service Mashup Method Implemented Through Dynamic Cooperation Of Client And Server, Server And Client App 20120246213 - Ma; Qifeng ; et al.	2012-09-27
Fuel Cell Module And Its Use App 20100009237 - Wolff; Andreas ; et al.	2010-01-14
Method And Tool For Cleaning Cavities App 20090107523 - Zorn; Christof ; et al.	2009-04-30
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer App 20060166464 - Jakob; Andreas ; et al.	2006-07-27

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