Fraser; Dana J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fraser; Dana J..The latest application filed is for "flexible pipe and method of manufacturing same".

Company Profile

0.8.7

Fraser; Dana J. - Panama City FL
Fraser; Dana J. - South Portland ME

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible pipe and method of manufacturing same App 20060191311 - Fraser; Dana J. ; et al.	2006-08-31
Flexible pipe and method of manufacturing same using metal reinforced tape Grant 6,899,140 - Fraser , et al. May 31, 2	2005-05-31
Flexible tubular member with sealed tape layer Grant 6,889,715 - Fraser , et al. May 10, 2	2005-05-10
End fitting tubular members and method of applying same Grant 6,827,375 - Fraser December 7, 2	2004-12-07
Flexible pipe including a vent passage and method of manufacturing same Grant 6,769,454 - Fraser , et al. August 3, 2	2004-08-03
Flexible tubular member with sealed tape layer App 20040099324 - Fraser, Dana J. ; et al.	2004-05-27
System and method for treating flexible pipes App 20040089970 - Fraser, Dana J. ; et al.	2004-05-13
Flexible pipe and method of fabricating same using overlapping layers Grant 6,705,351 - Fraser March 16, 2	2004-03-16
Flexible pipe and method of manufacturing same using metal reinforced tape App 20040025953 - Fraser, Dana J. ; et al.	2004-02-12
Flexible pipe and method of fabricating same using overlapping layers App 20030183293 - Fraser, Dana J.	2003-10-02
End fitting for tubular members and method of applying same App 20030111839 - Fraser, Dana J.	2003-06-19
Flexible pipe including a vent passage and method of manufacturing same App 20030056845 - Fraser, Dana J. ; et al.	2003-03-27
Flexible pipe including vent passage and method of manufacturing same Grant 6,446,672 - Kalman , et al. September 10, 2	2002-09-10
Flexible pipe and method of manufacturing same Grant 6,363,974 - Perez , et al. April 2, 2	2002-04-02
Low impedance package for integrated circuit die Grant 4,680,613 - Daniels , et al. July 14, 1	1987-07-14

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