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name:-0.0091660022735596
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Franzen; Paul Patent Filings

Franzen; Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Franzen; Paul.The latest application filed is for "method and apparatus for rf compensation in plasma assisted atomic layer deposition".

Company Profile
0.9.4
  • Franzen; Paul - West Linn OR
  • Franzen; Paul - Gilbert AZ
  • Franzen; Paul - Grevenbroich DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for RF compensation in plasma assisted atomic layer deposition
Grant 9,624,578 - Qian , et al. April 18, 2
2017-04-18
Method And Apparatus For Rf Compensation In Plasma Assisted Atomic Layer Deposition
App 20160090650 - Qian; Jun ;   et al.
2016-03-31
Methods for monitoring thickness of a conductive layer
Grant 9,007,059 - Lahiri , et al. April 14, 2
2015-04-14
Methods And Apparatuses For Determining Thickness Of A Conductive Layer
App 20120129277 - Lahiri; Sudeep Kumar ;   et al.
2012-05-24
Methods and apparatuses for determining thickness of a conductive layer
Grant 8,106,651 - Lahiri , et al. January 31, 2
2012-01-31
High throughput servo load cup with integrated wet chemistry delivery
Grant 7,811,153 - Blank , et al. October 12, 2
2010-10-12
Methods And Apparatuses For Determining Thickness Of A Conductive Layer
App 20090263918 - Lahiri; Sudeep Kumar ;   et al.
2009-10-22
Method for monitoring edge exclusion during chemical mechanical planarization
Grant 7,428,470 - Brown , et al. September 23, 2
2008-09-23
Method For Monitoring Edge Exclusion During Chemical Mechanical Planarization
App 20080200099 - Brown; Brian ;   et al.
2008-08-21
Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system
Grant 7,264,537 - Laursen , et al. September 4, 2
2007-09-04
Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
Grant 7,115,017 - Laursen , et al. October 3, 2
2006-10-03
Centrifuge with two withdrawal chambers
Grant 4,895,666 - Franzen , et al. January 23, 1
1990-01-23

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