Franz; Diana

Patent Applications and Registrations

Patent applications and USPTO patent grants for Franz; Diana.The latest application filed is for "composition comprising cinmethylin-containing microparticles and a further herbicide".

Company Profile

8.7.15

Franz; Diana - Limburgerhof DE
Franz; Diana - Schifferstadt DE
Franz; Diana - Hinckley OH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition comprising cinmethylin-containing microparticles and a further herbicide Grant 11,019,816 - Urch , et al. June 1, 2	2021-06-01
Composition Comprising Cinmethylin-Containing Microparticles and a Further Herbicide App 20190373894 - URCH; Henning ; et al.	2019-12-12
Microcapsules Comprising Cinmethyln In The Core And A Polyurea Derived From Diphenylmethane Diisocyanate Or An Oligomer Thereof App 20190364888 - URCH; Henning ; et al.	2019-12-05
Composition comprising polyurethane microcapsules comprising cinmethylin App 20190350197 - KOLB; Klaus ; et al.	2019-11-21
Cinmethylin Microcapsules with a Shell Made of Tetramethylxylylene Diisocyanate and a Polyamine with at Least Three Amine Groups App 20190343121 - KOLB; Klaus ; et al.	2019-11-14
Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine Grant 10,407,594 - Noller , et al. Sept	2019-09-10
Agrochemical adjuvant containing 2-oxo-1,3-dioxolan-4 carboxylates Grant 10,219,515 - Mecfel-Marczewski , et al.	2019-03-05
Agrochemical Adjuvant Containing 2-oxo-1,3-dioxolan-4 Carboxylates App 20170318811 - MECFEL-MARCZEWSKI; Joanna ; et al.	2017-11-09
Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant Grant 9,416,298 - Li , et al. August 16, 2	2016-08-16
Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors Grant 9,263,296 - Noller , et al. February 16, 2	2016-02-16
Process For The Manufacture Of Semiconductor Devices Comprising The Chemical Mechanical Polishing (cmp) Of Iii-v Material In The Presence Of A Cmp Composition Comprising A Specific Non-ionic Surfactant App 20150175845 - Li; Yuzhuo ; et al.	2015-06-25
Chemical Mechanical Polishing (cmp) Composition Comprising Two Types Of Corrosion Inhibitors App 20150118845 - Noller; Bastian ; et al.	2015-04-30
Process For The Manufacture Of Semiconductor Devices Comprising The Chemical Mechanical Polishing (cmp) Of Iii-v Material In The Presence Of A Cmp Composition Comprising A Compound Containing An N-heterocycle App 20150099361 - Franz; Diana ; et al.	2015-04-09
Chemical Mechanical Polishing (cmp) Composition Comprising A Polymeric Polyamine App 20140004703 - Noller; Bastian Marten ; et al.	2014-01-02
Aqueous Polishing Compositions Containing N-substituted Diazenium Dioxides And/or N'-hydroxy-diazenium Oxide Salts App 20130200039 - Noller; Bastian ; et al.	2013-08-08
Dispersion Comprising Cerium Oxide And Silicon Dioxide App 20120083188 - Kroell; Michael ; et al.	2012-04-05
Production And Use Of Paraffin Inhibitor Formulations App 20100130385 - Guzmann; Marcus ; et al.	2010-05-27
Transmission System Component And Method For Making Same App 20060266094 - Cecil; Craig S. ; et al.	2006-11-30

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