Patent | Date |
---|
Methods And Systems For Component Analysis, Sorting, And Sequencing Based On Component Parameters And Devices Utilizing The Methods And Systems App 20220165627 - COLE; Zach ;   et al. | 2022-05-26 |
Instrumented component for wireless telemetry Grant 9,071,888 - Subramanian , et al. June 30, 2 | 2015-06-30 |
Voltage regulator circuitry operable in a high temperature environment of a turbine engine Grant 8,952,674 - Mitchell , et al. February 10, 2 | 2015-02-10 |
Electronic circuitry for high-temperature environments Grant 8,803,703 - Mitchell , et al. August 12, 2 | 2014-08-12 |
Instrumented component for wireless telemetry Grant 8,797,179 - Subramanian , et al. August 5, 2 | 2014-08-05 |
Hybrid load differential amplifier operable in a high temperature environment of a turbine engine Grant 8,766,720 - Mitchell , et al. July 1, 2 | 2014-07-01 |
Chopper circuitry operable in a high temperature environment of a turbine engine Grant 8,717,095 - Mitchell , et al. May 6, 2 | 2014-05-06 |
Wireless telemetry electronic circuitry for measuring strain in high-temperature environments Grant 8,629,783 - Mitchell , et al. January 14, 2 | 2014-01-14 |
Chopper Circuitry Operable In A High Temperature Environment Of A Turbine Engine App 20140009222 - Mitchell; David J. ;   et al. | 2014-01-09 |
Voltage Regulator Circuitry Operable In A High Temperature Environment Of A Turbine Engine App 20140002050 - Mitchell; David J. ;   et al. | 2014-01-02 |
Hybrid Load Differential Amplifier Operable In A High Temperature Environment Of A Turbine Engine App 20140002191 - Mitchell; David J. ;   et al. | 2014-01-02 |
Wireless telemetry electronic circuit board for high temperature environments Grant 8,525,036 - Mitchell , et al. September 3, 2 | 2013-09-03 |
Wireless telemetry for instrumented component Grant 8,519,866 - Mitchell , et al. August 27, 2 | 2013-08-27 |
Method for manufacturing a circuit for high temperature and high g-force environments Grant 8,458,899 - Mitchell , et al. June 11, 2 | 2013-06-11 |
Electronic Circuitry For High-temperature Environments App 20130002358 - Mitchell; David J. ;   et al. | 2013-01-03 |
Wireless Telemetry Electronic Circuitry For Measuring Strain In High-temperature Environments App 20120256761 - MITCHELL; DAVID J. ;   et al. | 2012-10-11 |
Wireless telemetry electronic circuit package for high temperature environments Grant 8,220,990 - Mitchell , et al. July 17, 2 | 2012-07-17 |
Wireless telemetry electronic circuitry for measuring strain in high-temperature environments Grant 8,223,036 - Mitchell , et al. July 17, 2 | 2012-07-17 |
Wireless Telemetry Electronic Circuit Board For High Temperature Environments App 20120009056 - MITCHELL; DAVID J. ;   et al. | 2012-01-12 |
Wireless Telemetry Electronic Circuit Board For High Temperature Environments App 20120005891 - Mitchell; David J. ;   et al. | 2012-01-12 |
Wireless telemetry circuit structure for measuring temperature in high temperature environments Grant 8,092,080 - Mitchell , et al. January 10, 2 | 2012-01-10 |
Wireless telemetry electronic circuit board for high temperature environments Grant 8,023,269 - Mitchell , et al. September 20, 2 | 2011-09-20 |
Instrumented Component For Wireless Telemetry App 20110133950 - Subramanian; Ramesh ;   et al. | 2011-06-09 |
Instrumented Component For Wireless Telemetry App 20110133949 - Subramanian; Ramesh ;   et al. | 2011-06-09 |
Wireless Telemetry Electronic Circuitry for Measuring Strain in High-Temperature Environments App 20100039290 - MITCHELL; DAVID J. ;   et al. | 2010-02-18 |
Wireless Telemetry Circuit Structure for Measuring Temperature in High Temperature Environments App 20100039288 - MITCHELL; DAVID J. ;   et al. | 2010-02-18 |
Wireless Telemetry Electronic Circuit Package for High Temperature Environments App 20100039289 - Mitchell; David J. ;   et al. | 2010-02-18 |
Wireless Telemetry Electronic Circuit Board for High Temperature Environments App 20100039779 - MITCHELL; DAVID J. ;   et al. | 2010-02-18 |
Instrumented Component for Wireless Telemetry App 20090121896 - Mitchell; David J. ;   et al. | 2009-05-14 |