fox iii angus c

Patent Applications and Registrations

Patent applications and USPTO patent grants for fox iii angus c.The latest application filed is for "autopilot for aircraft having automatic descent function in the event of cabin depressurization".

Company Profile

11.5.0

- unknown
Fox, III; Angus C. - Provo UT
Fox, III; Angus C. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fully-integrated, top-fill, pressureless flow-control module couplable to a pulsating pressurized fuel source Grant 10851910 -	2020-12-01
Adjustable safety chain attachment for trailers Grant 10703150 -	2020-07-07
Holder/dispenser for multiple stacks of identically-colored zirconia ingots Grant 10610342 -	2020-04-07
Moen® type valve cartridge extractor tool having both right-hand and left-hand threads Grant 10611007 -	2020-04-07
Fragrance dispenser refill with locking bottle Grant 10562670 -	2020-02-18
Surface-variable pixilated visual block display system Grant 10559234 -	2020-02-11
Method for enhancing the efficiency of a solar module by subjecting it to extremely-low-freqency EMR Grant 10510919 -	2019-12-17
Powered winch retrieval system for harvested big game Grant 10343878 -	2019-07-09
Communion tray having corner cup disposal openings Grant 10334976 -	2019-07-02
Minimalist wallet for storing and protecting RFID cards Grant D0845623 -	2019-04-16
Vehicle receiver hitch-supported cargo rack transformable into a picnic table with benches Grant 10206495 -	2019-02-19
Autopilot for aircraft having automatic descent function in the event of cabin depressurization Grant 6,507,776 - Fox, III January 14, 2	2003-01-14
Process for manufacturing a DRAM capacitor having an annularly-grooved, cup-shaped storage-node plate which stores charge on inner and outer surfaces Grant 5,763,286 - Figura , et al. June 9, 1	1998-06-09
Sub-micron diffusion area isolation with SI-SEG for a DRAM array Grant 5,453,396 - Gonzalez , et al. September 26, 1	1995-09-26
High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias Grant 5,128,831 - Fox, III , et al. July 7, 1	1992-07-07
Process for creating an etch mask suitable for deep plasma etches employing self-aligned silicidation of a metal layer masked with a silicon dioxide template Grant 5,053,105 - Fox, III October 1, 1	1991-10-01

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