| Patent | Date |
|---|
Method for wafer trimming
Grant 10,818,500 - Fournel , et al. October 27, 2 | 2020-10-27 |
Method For Wafer Trimming
App 20190206693 - Fournel; Franck ; et al. | 2019-07-04 |
Method of transforming an electronic device
Grant 9,824,912 - Pellat , et al. November 21, 2 | 2017-11-21 |
Method for producing an electronic device
Grant 9,769,931 - Fournel , et al. September 19, 2 | 2017-09-19 |
Assembly process of two substrates
Grant 9,718,261 - Landru , et al. August 1, 2 | 2017-08-01 |
Method For Producing An Electronic Device
App 20170034919 - FOURNEL; Franck ; et al. | 2017-02-02 |
Method Of Transforming An Electronic Device
App 20160181139 - PELLAT; Michel ; et al. | 2016-06-23 |
Assembly Process Of Two Substrates
App 20160152017 - Landru; Didier ; et al. | 2016-06-02 |
Method for the treatment and direct bonding of a material layer
Grant 9,209,068 - Moriceau , et al. December 8, 2 | 2015-12-08 |
Method For The Treatment And Direct Bonding Of A Material Layer
App 20150194337 - Moriceau; Hubert ; et al. | 2015-07-09 |
Method for producing hybrid components
Grant 8,871,607 - Signamarcheix , et al. October 28, 2 | 2014-10-28 |
Method of producing a hybrid substrate by partial recrystallization of a mixed layer
Grant 8,841,202 - Fournel , et al. September 23, 2 | 2014-09-23 |
Method in the microelectronics fields of forming a monocrystalline layer
Grant 8,501,589 - Fournel , et al. August 6, 2 | 2013-08-06 |
Data storage medium and associated method
Grant 8,445,122 - Deguet , et al. May 21, 2 | 2013-05-21 |
Method for making a stressed structure designed to be dissociated
Grant 8,389,379 - Fournel , et al. March 5, 2 | 2013-03-05 |
Method of producing a hybrid substrate having a continuous buried electrically insulating layer
Grant 8,318,555 - Signamarcheix , et al. November 27, 2 | 2012-11-27 |
Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation
Grant 8,309,431 - Nguyen , et al. November 13, 2 | 2012-11-13 |
Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer
Grant 8,252,663 - Fournel August 28, 2 | 2012-08-28 |
Method for producing ordered nanostructures
Grant 8,207,048 - Fournel , et al. June 26, 2 | 2012-06-26 |
Method In The Microelectronics Fields Of Forming A Monocrystalline Layer
App 20110201177 - Fournel; Franck ; et al. | 2011-08-18 |
Particle network comprising particles disposed on a substrate and method for realizing such a network
Grant 7,985,469 - Samson , et al. July 26, 2 | 2011-07-26 |
Method For Producing Hybrid Components
App 20110163410 - Signamarcheix; Thomas ; et al. | 2011-07-07 |
Method Of Transferring A Thin Layer Onto A Target Substrate Having A Coefficient Of Thermal Expansion Different From That Of The Thin Layer
App 20100323497 - Fournel; Franck | 2010-12-23 |
Method Of Producing A Hybrid Substrate By Partial Recrystallization Of A Mixed Layer
App 20100221891 - FOURNEL; FRANCK ; et al. | 2010-09-02 |
Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areas
Grant 7,781,300 - Moriceau , et al. August 24, 2 | 2010-08-24 |
Method For Making A Stressed Structure Designed To Be Dissociated
App 20100167499 - Fournel; Franck ; et al. | 2010-07-01 |
Data Storage Medium And Associated Method
App 20090161405 - Deguet; Chrystel ; et al. | 2009-06-25 |
Method of producing a complex structure by assembling stressed structures
Grant 7,550,052 - Fournel , et al. June 23, 2 | 2009-06-23 |
Method of producing mixed substrates and structure thus obtained
Grant 7,494,897 - Fournel , et al. February 24, 2 | 2009-02-24 |
Particle Network and Method For Realizing Such a Network
App 20080160316 - Samson; Yves ; et al. | 2008-07-03 |
Method for Self-Supported Transfer of a Fine Layer by Pulsation after Implantation or Co-Implantation
App 20070281445 - Nguyen; Nguyet-Phuong ; et al. | 2007-12-06 |
Method For Producing Ordered Nanostructures
App 20070228378 - FOURNEL; Franck ; et al. | 2007-10-04 |
Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure
Grant 7,258,743 - Fournel , et al. August 21, 2 | 2007-08-21 |
Method for producing a stacked structure
Grant 7,229,897 - Fournel , et al. June 12, 2 | 2007-06-12 |
Method for making a stressed structure designed to be dissociated
App 20060205179 - Fournel; Franck ; et al. | 2006-09-14 |
Method of producing mixed substrates and structure thus obtained
App 20060166461 - Fournel; Franck ; et al. | 2006-07-27 |
Method of producing a complex structure by assembling stressed structures
App 20060141742 - Fournel; Franck ; et al. | 2006-06-29 |
Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials
Grant 7,041,227 - Fournel , et al. May 9, 2 | 2006-05-09 |
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
Grant 6,991,944 - Rayssac , et al. January 31, 2 | 2006-01-31 |
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
App 20050130429 - Rayssac, Olivier ; et al. | 2005-06-16 |
Method for producing a stacked structure
App 20050101095 - Fournel, Franck ; et al. | 2005-05-12 |
Method of manufacturing a wafer
Grant 6,838,358 - Maurice , et al. January 4, 2 | 2005-01-04 |
Method of manufacturing a wafer
App 20040241960 - Maurice, Thibaut ; et al. | 2004-12-02 |
Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials
App 20040074866 - Fournel, Franck ; et al. | 2004-04-22 |
Method for automatic organization of microstructures or nanostructures and related device obtained
Grant 6,724,017 - Semeria , et al. April 20, 2 | 2004-04-20 |
Method for automatic organisation of microstructures or nanostructures and related device obtained
App 20030186512 - Semeria, Marie-No?euml;lle ; et al. | 2003-10-02 |
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