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Patent applications and USPTO patent grants for Foulke, Richard F..The latest application filed is for "bi-directional arm and storage system".
Patent | Date |
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Bi-directional arm and storage system App 20040191032 - Foulke, Richard F. ;   et al. | 2004-09-30 |
Reticle tracking and cleaning App 20040185682 - Foulke, Richard F. ;   et al. | 2004-09-23 |
Reticle storage system App 20040158348 - Foulke, Richard F. ;   et al. | 2004-08-12 |
Apparatus and process for manufacturing solder balls App 20040149084 - Chun, Jung-Hoon ;   et al. | 2004-08-05 |
Reticle storage system Grant 6,690,993 - Foulke , et al. February 10, 2 | 2004-02-10 |
Method and apparatus for placing solder balls on a substrate Grant 6,641,030 - Freeman , et al. November 4, 2 | 2003-11-04 |
Solder ball placement apparatus Grant 6,427,903 - Foulke , et al. August 6, 2 | 2002-08-06 |
Reticle storage system App 20020044856 - Foulke, Richard F. ;   et al. | 2002-04-18 |
Solder ball placement apparatus Grant 6,056,190 - Foulke , et al. May 2, 2 | 2000-05-02 |
Particle-free storage for articles Grant 5,059,079 - Foulke , et al. October 22, 1 | 1991-10-22 |
Object handling apparatus Grant 4,699,556 - Foulke October 13, 1 | 1987-10-13 |
Wafer transfer apparatus Grant 4,682,928 - Foulke , et al. July 28, 1 | 1987-07-28 |
Vacuum pickup apparatus Grant 4,603,897 - Foulke , et al. August 5, 1 | 1986-08-05 |
Wafer transfer apparatus Grant 4,493,606 - Foulke , et al. January 15, 1 | 1985-01-15 |
Vibration-free tailless wire bonder Grant 4,234,117 - Foulke November 18, 1 | 1980-11-18 |
Ultrasonic thermal compression beam lead, flip chip bonder Grant 3,938,722 - Kelly , et al. February 17, 1 | 1976-02-17 |
Tailless Wire Bonder Grant 3,863,827 - Foulke , et al. February 4, 1 | 1975-02-04 |
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