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name:-0.007789134979248
name:-0.0071020126342773
name:-0.0064380168914795
Fortner; James Isaac Patent Filings

Fortner; James Isaac

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fortner; James Isaac.The latest application filed is for "one-piece anode for tuning electroplating at an edge of a substrate".

Company Profile
6.6.7
  • Fortner; James Isaac - Newberg OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods and apparatus for flow isolation and focusing during electroplating
Grant 11,001,934 - Banik, II , et al. May 11, 2
2021-05-11
One-piece anode for tuning electroplating at an edge of a substrate
Grant 10,975,489 - Fortner , et al. April 13, 2
2021-04-13
High flow multi-way piston valve for deposition systems
Grant 10,969,036 - Fortner , et al. April 6, 2
2021-04-06
One-piece Anode For Tuning Electroplating At An Edge Of A Substrate
App 20200173052 - Fortner; James Isaac ;   et al.
2020-06-04
High Flow Multi-way Piston Valve For Deposition Systems
App 20190368630 - Fortner; James Isaac ;   et al.
2019-12-05
Methods And Apparatus For Flow Isolation And Focusing During Electroplating
App 20190055665 - Banik, II; Stephen J. ;   et al.
2019-02-21
Edge flow element for electroplating apparatus
Grant 10,094,034 - Graham , et al. October 9, 2
2018-10-09
Electroplating Apparatus And Methods Utilizing Independent Control Of Impinging Electrolyte
App 20180258546 - Graham; Gabriel Hay ;   et al.
2018-09-13
Methods and apparatuses for dynamically tunable wafer-edge electroplating
Grant 9,752,248 - Kagajwala , et al. September 5, 2
2017-09-05
Edge Flow Element For Electroplating Apparatus
App 20170058417 - Graham; Gabriel Hay ;   et al.
2017-03-02
Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
Grant 9,567,685 - Kagajwala , et al. February 14, 2
2017-02-14
Apparatus And Method For Dynamic Control Of Plated Uniformity With The Use Of Remote Electric Current
App 20160215408 - Kagajwala; Burhanuddin ;   et al.
2016-07-28
Methods And Apparatuses For Dynamically Tunable Wafer-edge Electroplating
App 20160177466 - Kagajawala; Burhanuddin ;   et al.
2016-06-23

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